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Heat sink for light-emitting diode lamps and preparation method thereof

A technology of light-emitting diodes and heat sinks, applied in semiconductor devices of light-emitting elements, lighting and heating equipment, cooling/heating devices for lighting devices, etc., can solve problems such as poor mechanical properties, achieve long service life, good thermal conductivity and Insulation performance, the effect of improving thermal conductivity

Inactive Publication Date: 2017-07-28
STATE GRID CORP OF CHINA +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the defects of poor mechanical properties in the prior art, the present invention provides a heat sink for light-emitting diode lamps; the present invention also provides a preparation method for the heat sink

Method used

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  • Heat sink for light-emitting diode lamps and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A heat sink for LED lamps, which is prepared from the following raw materials in parts by weight:

[0020] 16 parts of silicon carbide, 12 parts of magnesium oxide, 8 parts of graphite, 6 parts of glass fiber, 6 parts of polycarbonate, 5 parts of polyglycolic acid, 3 parts of decabromodiphenylethane, 3 parts of glyceryl monostearate, chlorine 2 parts of vinegar resin, 1 part of aluminum tripolyphosphate, 1 part of antimony trioxide, 1 part of silica gel powder;

[0021] The preparation method of above-mentioned radiator comprises the steps:

[0022] 1) Weighing raw materials: taking each raw material by weight for subsequent use;

[0023] 2) Preparation of material A: Send silicon carbide, magnesium oxide and graphite to a ball mill, grind to a powder with a particle size of 500 mesh or more, then mix the powder with silica gel powder, and stir at 500 rpm for 10 minutes to obtain material A; , the particle size of silica gel powder is 300-400 mesh, the pore volume is ...

Embodiment 2

[0028] A heat sink for LED lamps, which is prepared from the following raw materials in parts by weight:

[0029] 20 parts of silicon carbide, 15 parts of magnesium oxide, 10 parts of graphite, 7 parts of glass fiber, 7 parts of polycarbonate, 6 parts of polyglycolic acid, 4 parts of decabromodiphenylethane, 4 parts of glyceryl monostearate, chlorine 3 parts of vinegar resin, 2 parts of aluminum tripolyphosphate, 2 parts of antimony trioxide, 2 parts of silica gel powder;

[0030] The present invention also provides the preparation method of above-mentioned heat sink, it comprises the following steps:

[0031] 1) Weighing raw materials: taking each raw material by weight for subsequent use;

[0032] 2) Preparation of material A: Send silicon carbide, magnesium oxide and graphite to a ball mill, grind to a powder with a particle size of 500 mesh or more, then mix the powder with silica gel powder, and stir at 500 rpm for 10 minutes to obtain material A; , the particle size of...

Embodiment 3

[0037] Taking the external dimensions of 50×20×8 as an example (unit: mm), the performance parameters of the heat sinks prepared in Examples 1 and 2 were tested, and the specific results are shown in Table 1:

[0038] Table 1

[0039]

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Abstract

The invention belongs to the field of photoelectric lighting materials, and discloses a cooling fin for a light-emitting diode lamp. The cooling fin comprises, by weight, 20 parts of silicon carbide, 15 parts of magnesium oxide, 10 parts of graphite, 7 parts of glass fibers, 7 parts of makrolon, 6 parts of polyglycolic acid, 4 parts of decabromodiphenyl ethane, 4 parts of glycerin monostearate, 3 parts of vinisol, 2 parts of aluminum triphosphate, 2 parts of antimonous oxide and 2 parts of silica-gel powder. The invention further discloses a manufacturing method of the cooling fin. The cooling fin manufactured by the method is good in heat-conducting property, flame retardant property and mechanical property and is good in market prospect.

Description

technical field [0001] The invention belongs to the field of photoelectric lighting materials, and in particular relates to a heat sink for light-emitting diode lamps and a preparation method thereof. Background technique [0002] Light-emitting diode lamps, also known as LED lamps, refer to appliances that can transmit light, distribute and change the light distribution of LED light sources, including all parts and components required to fix and protect LED light sources except for LED light sources, as well as connections to power sources Required wiring accessories. With its technical characteristics of high efficiency, energy saving, long life, and small size, LED lamps are becoming the main product in the new generation lighting market, and they are powerfully driving the rapid development of the environmental protection and energy saving industry. [0003] Due to the light generation characteristics of the LED, only 20% of its energy input when illuminating the device...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21V29/74F21V29/85F21Y115/10
CPCF21Y2101/00
Inventor 张岩尹纪伟王选廷刘超公绪波葛家恒
Owner STATE GRID CORP OF CHINA
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