High-quality silicon chip cutting fluid

Abstract

The invention relates to a high-quality silicon chip cutting fluid. The high-quality silicon chip cutting fluid comprises the following components in parts by weight: 50-60 parts of polyethylene glycol, 5-10 parts of salicylic acid, 8-16 parts of sodium thiosulfate, 2-7 parts of triethylene glycol, 10-18 parts of carboxymethylcellulose, 0.5-5 parts of alkyl sodium sulfosuccinate, 25-30 parts of triethanolamine, 4-12 parts of a surfactant, 4-12 parts of a dispersing agent and 30-35 parts of water. The high-quality silicon chip cutting fluid can be used for improving the stability of silicon carbide, has high redispersion capability, and can also be used for improving the cutting yield and greatly reducing the cutting cost.

Description

technical field [0001] The invention relates to a high-quality silicon chip cutting fluid. Background technique [0002] Solar silicon wafer cutting generally uses silicon carbide micropowder with high hardness, small particle size and concentrated particle size distribution as the main cutting medium. Usually, carbonized micropowder should be added to the cutting fluid in a certain proportion, and fully dispersed, and then configured into a uniform and stable cutting mortar, which can then be used for silicon wafer cutting. Using silicon carbide micropowder as the medium in the wire cutting process of solar silicon wafers, the whole mechanism is to make the silicon carbide micropowder particles continuously and rapidly impact the surface of the silicon rod, and use the hard characteristics and sharp corners of the silicon carbide particles to gradually cut off the silicon rod. This process will Accompanied by the large frictional heat release, at the same time, the broken ...

AI Technical Summary

Problems solved by technology

[0004] For the existing cutting fluids at home and abroad, they all have the weakness of poor redispersion ability. After a long time of storage, silicon carbide will be deposited and agglomerated. If you stir again, the silicon carbide cannot be dispersed in the cutting fluid again.