Plating solution for electroplating Ni/graphene compound heat conduction film on surface of substrate

Abstract

The invention discloses a plating solution for electroplating a Ni / graphene compound heat conduction film on the surface of a substrate. Each liter of the plating solution comprises the following components by weight: 230g-380g of nickel salt, 30g-40g of boric acid, 0.1g-10g of a stress subduction agent, 0.1g-2g of graphene, 0.01g-0.1g of a dispersing agent and 0.05g-0.4g of a surfactant. According to the plating solution, by adding the surfactant, the wettability between the surface of the substrate and the plating solution is effectively improved; by adding the stress subduction agent, the stress among plating layers is effectively reduced; by virtue of a proper amount of graphene and dispersing agent, the Ni / graphene compound heat conduction film with the thickness of 10-50mu m can be formed on the surface of the substrate after plating, the film has high binding force with the substrate, and graphene is uniformly dispersed in the film, so that the heat conductivity coefficient of a material obtained after plating is greatly increased relative to that of the substrate.

Description

technical field [0001] The invention relates to an electroplating nickel solution, in particular to a plating solution for forming a Ni / graphene composite heat-conducting film on the surface of a substrate by electroplating. Background technique [0002] Metal film materials, such as aluminum foil, copper foil, gold film, etc. have a series of advantages such as good ductility, stable chemical properties, strong plasticity and beauty, and are often coated on the surface of compact instruments, but their thermal conductivity The performance is low, which leads to slow heat dissipation, and the concentration of heat can easily lead to shortened life of the instrument. In order to improve this deficiency, graphene with ultra-high thermal conductivity is usually compounded in metal thin film materials, but most of the current research is limited to growing graphene on the surface of the substrate by the Hammer method. Although the number of graphene layers prepared by this metho...

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Problems solved by technology

[0002] Metal film materials, such as aluminum foil, copper foil, gold film, etc. have a series of advantages such as good ductility, stable chemical properties, strong plasticity and beauty, and are often coated on the surface of compact instruments, but their thermal conductivity Low performance, which leads to slow heat dissipation, and heat concentration can easily lead to shortened instrument life

In order to improve this deficiency, graphene with ultra-high thermal conductivity is usually compounded in metal thin film materials, but most of the current research is limited to growing graphene on the surface of the substrate by the Hammer method. Although the number of graphene layers prepared by this method Less, higher purity, but it is not suitable for large-scale industrial production, and the graphene grown in this way is only on the surface of the substrate, the bonding force with the substrate is poor, and it is easy to peel off

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