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Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing touch panel

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, to achieve the effect of excellent acid resistance and excellent adhesion

Active Publication Date: 2015-04-22
株式会社力森诺科
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on the other hand, the surface smoothness of the substrate used is very high, and high adhesion is required for the photosensitive element used

Method used

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  • Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing touch panel
  • Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing touch panel
  • Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing touch panel

Examples

Experimental program
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manufacture example 1

[0164] (Production Example 1: Production of Binder Polymer (A-1))

[0165] With methacrylic acid 30g, methyl methacrylate 35g and butyl methacrylate 35g (mass ratio 30 / 35 / 35), azobisisobutyronitrile 0.5g and acetone 10g as polymerizable monomer (monomer) The resulting solution was mixed as "solution a". A solution obtained by dissolving 0.6 g of azobisisobutyronitrile in 30 g of acetone was referred to as "solution b".

[0166] Add 100 g of a mixture of 80 g of acetone and 20 g of propylene glycol monomethyl ether (mass ratio 4:1) in a flask with a stirrer, a reflux cooler, a thermometer, a dropping funnel, and a nitrogen inlet pipe, blowing nitrogen into the flask while Heating was performed while stirring, and the temperature was raised to 80°C.

[0167] After dripping the said solution a into the said liquid mixture in a flask over 4 hours, it heat-retained at 80 degreeC for 2 hours, stirring. Next, after dripping the said solution b into the solution in the flask over 1...

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Abstract

A photosensitive resin composition for ITO etching use, which comprises a binder polymer, a photopolymerizable compound, a photopolymerization initiator and a silane coupling agent, wherein the silane coupling agent comprises a silane compound having a mercaptoalkyl group.

Description

technical field [0001] The present invention relates to a method for forming a photosensitive resin composition, a photosensitive element, a resist pattern, and a touch panel. Background technique [0002] The touch sensor part of the touch panel includes: the sensor part that senses the information touched by human fingers without covering the screen information within the range where the screen can be seen (visible area), and the wiring for transmitting the information ( lead out the wiring part). [0003] A transparent electrode pattern that absorbs little visible light and has conductivity is formed in the sensor portion of the visible region. In addition, a metal having a low resistance value is used for the lead-out wiring. [0004] These sensor parts and lead-out wiring parts are manufactured as follows, for example. First, a photosensitive resin composition is laminated on polyethylene terephthalate or glass having a transparent electrode layer (lamination process...

Claims

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Application Information

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IPC IPC(8): G03F7/075G03F7/004G03F7/027G03F7/40G06F3/041
CPCG06F2203/04103G06F3/041G03F7/027G03F7/0755G06F3/0446
Inventor 玉田春仙木村伯世高崎俊彦
Owner 株式会社力森诺科