Alumina-based chemical mechanical polishing slurry

A chemical-mechanical, alumina-based technology, applied in the field of polishing fluid, can solve the problems of uneven dispersion of polishing fluid, poor quality of fine polishing, surface defects and scratches, etc.

Active Publication Date: 2015-04-29
SHANGHAI XINANNA ELECTRONICS TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a kind of alumina-based chemical mechanical polishing fluid, which is used to overcome the problems of uneven dispersion of polishing fluid in the prior art, poor quality of fine polishing, and flaws and scratches on the surface

Method used

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  • Alumina-based chemical mechanical polishing slurry
  • Alumina-based chemical mechanical polishing slurry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] In this embodiment, the chemical mechanical polishing liquid is 100 parts by weight, which contains the following raw material components and parts by weight:

[0041] 30 parts by weight of polishing particles

[0042] Surfactant 4 parts by weight

[0043] The balance is water and a pH adjuster.

[0044] The polishing particles described in this embodiment are aluminum oxide particles; the particle size is 150 nm; the pH regulator is nitric acid solution; the surfactant is sodium polyacrylate.

[0045] The pH of the chemical mechanical polishing solution is 3.

[0046] The chemical mechanical polishing fluid is obtained by stirring the above-mentioned raw material components evenly.

[0047] The polishing test results are shown in Table 1.

Embodiment 2

[0049] In this embodiment, the chemical mechanical polishing liquid is 100 parts by weight, which contains the following raw material components and parts by weight:

[0050] 20 parts by weight of polishing particles

[0051] Surfactant 0.5 parts by weight

[0052] The balance is water and a pH adjuster.

[0053] The polishing particles described in this embodiment are aluminum oxide particles; the particle size is 150 nm; the pH regulator is nitric acid solution; the surfactant is polyoxyethylene sodium sulfate.

[0054] The pH of the chemical mechanical polishing solution is 5.

[0055] The chemical mechanical polishing fluid is obtained by stirring the above-mentioned raw material components evenly.

[0056] The polishing test results are shown in Table 1.

Embodiment 3

[0058] In this embodiment, the chemical mechanical polishing liquid is 100 parts by weight, which contains the following raw material components and parts by weight:

[0059] 10 parts by weight of polishing particles

[0060] Surfactant 0.5 parts by weight

[0061] The balance is water and a pH adjuster.

[0062] The polishing particles described in this embodiment are aluminum oxide particles; the particle size is 200 nm; the pH regulator is potassium hydroxide; the surfactant is sodium polyoxyethylene sulfate.

[0063] The chemical mechanical polishing solution has a pH of 11.

[0064] The chemical mechanical polishing fluid is obtained by stirring the above-mentioned raw material components evenly.

[0065] The polishing test results are shown in Table 1.

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Abstract

The invention discloses alumina-based chemical mechanical polishing slurry. In terms of the total mass of the chemical mechanical polishing slurry, the chemical mechanical polishing slurry comprises components in percentage as follows: 0.1-30wt% of polishing particles, 0.01-10wt% of a surfactant and the balance of a pH regulator and an aqueous medium. The polishing speed of the chemical mechanical polishing slurry to a sapphire substrate material can be controlled to range from 50 nm/min to 200 nm/min, and meanwhile, the surface roughness is decreased to below 15 angstroms; speed-controllable, low-surface-damage and residue-free polishing can be performed on the sapphire substrate material by the aid of the polishing slurry.

Description

technical field [0001] The invention relates to a polishing liquid, in particular to an alumina-based chemical mechanical polishing liquid. Background technique [0002] Sapphire, also known as white gem, is composed of α-A1 2 o 3 , transparent, has the same optical and mechanical properties as natural gemstones, has good thermal properties, excellent electrical and dielectric properties, and chemical corrosion resistance, high infrared transmittance, good wear resistance, hardness Second only to diamond, it has a Da Mok's grade of 9. It still has good stability at high temperatures. Its melting point is 2030 ° C. It is widely used in industry, national defense, scientific research, civil and other fields. Infrared windows, semiconductor chip substrates, light-emitting diode substrates, precision wear-resistant bearings and other high-tech parts manufacturing materials. Sapphire is difficult to machine due to its high hardness and brittleness. In particular, the precisio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02H01L21/304
CPCC09G1/02
Inventor 李沙沙刘卫丽宋志棠
Owner SHANGHAI XINANNA ELECTRONICS TECH
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