Manufacturing method of high-frequency LTCC circuit module substrate

Abstract

A manufacturing method of a high-frequency LTCC circuit module substrate comprises the following steps: (1) manufacturing an insulating medium layer of the high-frequency LTCC module substrate; (2) manufacturing LTCC composite adhesive sheets; (3) manufacturing the high-frequency LTCC circuit module substrate. The manufacturing method has the advantages as follows: the manufacturing method is suitable for circuit design with different signal frequencies; a metal material with high electrical conductivity is used as a conductor material, so that the quality factor of a circuit system can be favorably improved and the flexibility of the circuit design is improved; requirements on large current, high temperature resistance can be met, and thermal design of electronic equipment is optimized; the high-frequency LTCC circuit module substrate is high in reliability and is applicable to a severe environment, and the service life of the substrate is prolonged; adhesion between the copper foil layers and the insulating medium layer is facilitated, and the adhesive property is good; the peeling strength of the high-frequency LTCC circuit module substrate is improved, and the high-frequency LTCC circuit module substrate is especially applicable to a high heat-resistant environment; the ranges of the thicknesses of the copper foils can be widened; the copper foils with different thicknesses are selected according to different load current, load power as well as intercepting capabilities of the copper layers, so that the thicknesses of the copper layers are utilized to the maximum extent as much as possible.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit module substrate, in particular to a method for manufacturing a high-frequency LTCC circuit module substrate. Background technique [0002] The modularization of electronic components has become an indisputable fact in the industry, especially LTCC is the preferred method. Alternative module substrates include LTCC, HTCC (high temperature co-fired ceramics), traditional PCB such as FR4 and PTFE (high performance polytetrafluorohexene), etc. The sintering temperature of HTCC is above 1500°C, and the matching refractory metals such as tungsten, molybdenum / manganese have poor electrical conductivity, and the sintering shrinkage is not as easy to control as LTCC. The dielectric loss of LTCC is an order of magnitude lower than that of RF4. PTFE has lower losses, but both are less insulating. LTCC allows better precision control than most organic substrate materials. No organic material can be...

AI Technical Summary

Problems solved by technology

No organic material compares comprehensively to LTCC substrates for high frequency performance, size and cost

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