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A layered electronic component and its manufacturing method

A technology of electronic components and manufacturing methods, which is applied in the field of layered electronic components and their production, can solve problems such as sintering shrinkage mismatch, high resin content, deglue cracking, etc., and achieve the effect of preventing interface sintering cracking

Active Publication Date: 2016-06-29
SHENZHEN SUNLORD ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

(1) The resin content of the internal electroconductive paste is too high, and if the amount of glue removal is too large, it is easy to cause sintering cracking
(2) The metal material of the inner electrode has a catalytic effect on the debinding of organic matter, resulting in severe degradation of the organic binder, a large amount of gas is released in a short period of time, and the temperature rises sharply, resulting in debinding and cracking
(3) The bonding force between the raw tape and the internal electrode is poor, resulting in the inability to form a high-strength bonding force between layers during lamination, and delamination and cracking have occurred before sintering under the action of external force; (4) Between the internal electrode and the green tape The sintering shrinkage does not match, and there is internal stress during sintering, which leads to sintering cracking
[0006] Although the height difference between the electrode and the green tape can be reduced by design, due to the influence of materials and processes, the interlayer bonding is still very weak after lamination, and most cracks occur at the lamination interface after sintering

Method used

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  • A layered electronic component and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 1) 100g low-temperature co-fired ceramic powder as ceramic powder, 13.3g acrylic resin as binder, 1g oleic acid as dispersant, 10g copper oxide as sintering aid, 50g toluene as solvent and 16.5g Butyl acetate was added into a ball mill jar and ball milled for 24 hours to form a low temperature co-fired ceramic slurry containing copper oxide.

[0034] 2) Cast a layer of 5um slurry coating on the ceramic green tape by casting method, wherein the ceramic green tape also contains a sintering aid.

[0035] 3) drying the slurry coating to make the slurry coating form a sintering aid layer, wherein the mass percentage of the sintering aid in the ceramic green tape is smaller than the mass percentage of the sintering aid in the sintering aid layer.

[0036] In this embodiment, two solvents with different volatilization speeds are used, so that during the drying process, butyl acetate volatilizes faster, while toluene volatilizes slower, so that the formed sintering layer is not...

Embodiment 2

[0040] 1) 100g ferrite porcelain powder as ceramic powder, 8g polyethylene glycol butyral as binder, 1g nonionic dispersant as dispersant, 10g bismuth oxide as sintering aid, and as 50g of toluene and 22g of butyl acetate as a solvent were added into a ball mill jar for ball milling for 24 hours to form a low-temperature ferrite porcelain powder slurry containing bismuth oxide.

[0041] 2) A 2-3um thick slurry coating is formed on the ceramic green tape by means of spin coating, wherein the ceramic green tape also contains a sintering aid.

[0042] 3) drying the slurry coating to make the slurry coating form a sintering aid layer, wherein the mass percentage of the sintering aid in the ceramic green tape is smaller than the mass percentage of the sintering aid in the sintering aid layer.

[0043] 4) Laminating the ceramic green tapes with the sintering-assisting layer, and then sintering; wherein, there is at least one layer of the sintering-assisting layer between adjacent ce...

Embodiment 3

[0046] 1) Add 100g of ferrite porcelain powder as ceramic powder, 4g of polyvinyl alcohol as binder, 10g of bismuth nitrate as sintering aid and 60g of pure water as solvent into a ball mill for 24 hours to form a Low temperature ferrite porcelain powder paste.

[0047] In this embodiment, the polyvinyl alcohol simultaneously functions as a binder and a dispersant for dispersing the ferrite porcelain powder into water.

[0048] 2) A 2-3um thick slurry coating is formed on the ceramic green tape by means of spin coating, wherein the ceramic green tape also contains a sintering aid.

[0049] 3) drying the slurry coating to make the slurry coating form a sintering aid layer, wherein the mass percentage of the sintering aid in the ceramic green tape is smaller than the mass percentage of the sintering aid in the sintering aid layer.

[0050] 4) Laminating the ceramic green tapes with the sintering-assisting layer, and then sintering; wherein, there is at least one layer of the si...

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Abstract

The invention discloses a manufacturing method for a layered electronic element. The manufacturing method comprises the following steps: 1) coating raw ceramic tapes with slurry containing ceramic powder and a sintering aid to form a slurry coating, wherein the raw ceramic tapes contain the sintering aid; 2) drying the slurry coating to enable the slurry coating to form a sintering aid layer, wherein mass percent of the sintering aid in the raw ceramic tapes is smaller than that of the sintering aid in the sintering aid layer; 3) stacking the raw ceramic tapes with the sintering aid layer and then sintering, wherein at least one sintering aid layer is arranged between adjacent raw ceramic tapes.

Description

【Technical field】 [0001] The invention relates to the field of electronic components, in particular to a layered electronic component and a manufacturing method thereof. 【Background technique】 [0002] With the development of technology, people's demand for laminated chip electronic components is increasing. However, the production process of chip electronic components has been troubled by sintering cracks for a long time. It is difficult to remove sintered cracked products through rework and selection, and it is easy to become the biggest hidden danger of product quality. Therefore, solving the problem of sintering cracking is a recognized technical difficulty for chip electronic component manufacturers. [0003] There have been a large number of documents and patents to study the causes of sintering cracking, and three sintering cracking mechanisms have been recognized: (1) The debinding curve is unreasonable, resulting in rapid debinding, a large amount of gas is releas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/622
Inventor 余谋发华永安
Owner SHENZHEN SUNLORD ELECTRONICS
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