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Dispersion composition, and curable composition, transparent film, microlens and solid-state imaging element using same, and polymer compound

A technology of polymer compounds and curable compositions, which can be applied to lenses, optical elements, and photosensitive materials for opto-mechanical equipment, etc., can solve the problems of poor coating surface and large wafer size.

Active Publication Date: 2015-05-20
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, in order to produce more equipment in one production, the size of the wafer used is also increased, and in this case, there is a tendency for the coating surface to deteriorate

Method used

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  • Dispersion composition, and curable composition, transparent film, microlens and solid-state imaging element using same, and polymer compound
  • Dispersion composition, and curable composition, transparent film, microlens and solid-state imaging element using same, and polymer compound
  • Dispersion composition, and curable composition, transparent film, microlens and solid-state imaging element using same, and polymer compound

Examples

Experimental program
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Effect test

Embodiment

[0752] Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples. In addition, unless otherwise specified, "part" and "%" are based on mass.

[0753] In addition, in the examples, the acid value is determined by the potential difference method (solvent tetrahydrofuran / water=54 / 6 (volume ratio), titrant 0.1N sodium hydroxide aqueous solution (acid value).

[0754] In addition, the subsequent measurement of the weight average molecular weight is performed by connecting HPC-8220GPC (manufactured by TOSOH CORPORATION), guard column: TSKguardcolumn SuperHZ-L, column: TSKgel SuperHZM-M, TSKgel SuperHZ4000, TSKgel SuperHZ3000, TSKgel SuperHZ2000 in series at a column temperature of 40 10 μl of a tetrahydrofuran solution having a sample concentration of 0.1% by mass was injected at °C, and tetrahydrofuran as an elution solvent was flowed at a flow rate of 0.35 ml per minute, and the peak of the sample was detected by an RI...

Synthetic example 1

[0755] (Synthesis Example 1) Synthesis of Polymer Compound (C-1)

[0756] The polymer compound (C-1) was synthesized according to the synthesis method described in paragraphs 0266 to 0348 of JP-A-2007-277514 (corresponding to paragraphs 0289 to 0429 in the specification of US Patent Application Publication No. 2010 / 233595). Specifically, as follows.

[0757] 100 parts of dipentaerythritol hexa(3-mercaptopropionate) [(33); manufactured by Sakai Chemical Industry Co., Ltd., and the following compound (A-3) having an adsorption site and a carbon-carbon double bond 91.38 Parts were dissolved in 446.6 parts of 1-methoxy-2-propanol, and heated to 90°C under a nitrogen stream. The feed ratio at this time was 1.0:5.5 in terms of molar ratio.

[0758] 0.81 part of dimethyl 2,2'-azobis(2-methylpropionate) [V-601, manufactured by Wako Pure Chemical Industries, Ltd.] was added thereto, followed by heating for 2 hours. Furthermore, 0.81 parts of V-601 was added, and it was made to react...

Synthetic example 2

[0764] (Synthesis Example 2) Synthesis of Polymer Compound (C-34)

[0765] The polymer compound (C-34) was synthesized according to the synthesis method described in paragraphs 0266 to 0348 of JP-A-2007-277514 (corresponding to paragraphs 0289-0429 in the specification of US Patent Application Publication No. 2010 / 233595). Specifically, as follows.

[0766] 65.0 parts of dipentaerythritol hexa(3-mercaptopropionate) [(33); manufactured by Sakai Chemical Industry Co., Ltd., and 44.5 parts of the following compound (A-16) having an adsorption site and a carbon-carbon double bond 27.0 parts of (A-3) were dissolved in 318.4 parts of 1-methoxy-2-propanol, and heated to 90°C under a nitrogen stream. At this time, the feed ratio of (33) to (A-16) to (A-3) was 1.0:2.5:2.5 in molar ratio.

[0767] To this was added 0.478 parts of dimethyl 2,2'-azobis(2-methylpropionate) [V-601, manufactured by Wako Pure Chemical Industries, Ltd.] and heated for 2 hours. Furthermore, 0.478 parts of V-...

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Abstract

PROBLEM TO BE SOLVED: To provide a dispersion composition which has excellent dispersibility even when an inorganic ultrafine particle is packed densely and also has a low viscosity, a high refractive index and excellent surface characteristics of the film surface after coating and a curable composition, a transparent film, a micro-lens and a solid-state imaging device using the dispersion composition.SOLUTION: A dispersion composition comprises a metal oxide particle (A) of primary particle sizes of 1-100 nm, a polymer compound (B) of formula (1) having a weight average molecular weight of 10,000 or smaller and a solvent (C).

Description

technical field [0001] The present invention relates to a dispersion composition, a curable composition using the same, a transparent film, a microlens, a solid-state imaging device, and a polymer compound. Background technique [0002] For microlenses used in imaging optical systems of on-chip color filters in electronic copiers, solid-state imaging devices, etc., and for optical wiring instead of copper wiring, it is desired to form transparent members such as transparent films with high refractive index and fine transparent wiring. with composition. [0003] In particular, microlenses used in solid-state imaging devices are required to be finer along with the miniaturization of solid-state imaging devices, and at the same time require a higher refractive index for more efficient light collection. For example, a composition for forming a microlens or a solid-state imaging element with a high refractive index using silica-coated titanium oxide particles is disclosed (for e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/02C08F2/44C08G59/18C08G65/18C08K3/22C09D4/00C09D5/00C09D7/12C09D201/02C09D201/08G02B1/04G02B3/00G03F7/004
CPCC08F2/44C09D4/00C09D5/028C08G59/18C08K3/22C08G65/18C09D201/02C09D201/08C08L101/02G02B1/04G03F7/0007G03F7/0047G03F7/027G03F7/029G03F7/031G03F7/038C08L33/00C09D133/06C09D7/67C08L101/08C08L2201/10C08K9/04C08L33/02
Inventor 荒山恭平出井宏明久保田诚高桑英希
Owner FUJIFILM CORP
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