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Polyamide-imides, graphite films and preparation for the graphite film

A polyamide-imide and polymer technology, applied in chemical instruments and methods, inorganic chemistry, coatings, etc., can solve the problems of low degree of graphitization and inability to form artificial graphite films.

Active Publication Date: 2015-06-17
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Analyzing the existing technology, it can be found that the general polyamide-imide film (PAI film) cannot form an artificial graphite film after heat treatment at a high temperature of 2,400°C due to the low degree of graphitization

Method used

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  • Polyamide-imides, graphite films and preparation for the graphite film
  • Polyamide-imides, graphite films and preparation for the graphite film
  • Polyamide-imides, graphite films and preparation for the graphite film

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preparation example Construction

[0023] According to another embodiment of the present invention, the present invention provides a method for preparing a graphite film, comprising: performing a heat treatment process on a polyamide-imide (PAI) polymer to prepare a graphite film.

[0024] The temperature of the heat treatment process is generally between 25-2,900°C.

[0025] Above-mentioned polyamide-imide polymer has following chemical formula (I):

[0026]

[0027] In chemical formula (I), X 1 can include

[0028] x 2 can include

[0029] The ratio of m to n can be between 8:2˜6:4, or 7.5:2.5˜6.5:3.5. The weight average molecular weight of the polymer is 20,000-60,000, or 30,000-50,000.

[0030] The aforementioned heat treatment process may include a carbonization process and a graphitization process.

[0031] The temperature of the above-mentioned carbonization process is generally between 25-1,300°C, and the temperature of the above-mentioned graphitization process is generally between 1,8...

Embodiment 1

[0035] The preparation of graphite film PAI-1 of the present invention (polyamide-imide polymer (X 1 =MDI,X 2 =PMDA+BPDA))

[0036] At room temperature, put a stirrer and a heating mantle on a 2-liter four-port reactor, and mix 153.60 grams of trimellitic anhydride (TMA), 24.96 grams of pyromellitic dianhydride (PMDA), 67.20 grams of 3,3',4,4'-biphenyl tetracarboxylic dianhydride (3,3',4,4'-biphenyl tetracarboxylic dianhydride, BPDA) and 300.00 grams of diphenylmethane diisocyanate (methylene diphenylene Diisocyanate, MDI) was dissolved in 1637.00 g of NMP solvent and stirred evenly. The temperature was raised to 80°C for 1 hour, then the temperature was raised to 120°C for 2 hours, and finally the temperature was raised to 170°C for 2 hours. After the reaction is completed, wait for it to cool down to room temperature, put the solution into a PE bottle and seal it for storage. The composition molar ratio m of this polymer was 7, n was 3, and the weight average molecular w...

Embodiment 2

[0038] The preparation of graphite film PAI-2 of the present invention (polyamide-imide polymer (X 1 =MDI,X 2 =PMDA+BPDA+ODPA))

[0039]At room temperature, put a stirrer and a heating mantle on a 1-liter four-port reactor, and mix 67.74 grams of trimellitic anhydride (TMA), 12.81 grams of pyromellitic dianhydride (PMDA), 17.28 grams of 3,3',4,4'-biphenyl tetracarboxylic dianhydride (3,3',4,4'-biphenyl tetracarboxylic dianhydride, BPDA), 36.45 grams of 4,4'-oxodiphenylene Dissolve phthalic anhydride (4,4'-oxydiphthalic anhydride, ODPA) and 150.00 g of methylene diphenylene diisocyanate (MDI) into 852.00 g of NMP solvent, and stir evenly. The temperature was raised to 80°C for 1 hour, then the temperature was raised to 120°C for 2 hours, and finally the temperature was raised to 170°C for 2 hours. After the reaction is completed, wait for it to cool down to room temperature, put the solution into a PE bottle and seal it for storage. The composition molar ratio m of this pol...

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Abstract

A polyamide-imide represented by the following formula is provided. A graphite film prepared by performing a thermal treatment process on the polyamide-imide represented by the above-mentioned formula is also provided. In the thermal treatment process, the temperature range of the thermal treatment process ranges from 25° C. to 2,900° C.

Description

【Technical field】 [0001] The present invention relates to a polyamide-imide macromolecule, in particular to a polyamide-imide macromolecule introduced with dianhydride, a graphite film made of the polyamide-imide macromolecule and a preparation method thereof. 【Background technique】 [0002] Under the trend of electronic products becoming lighter, thinner, shorter and smaller, in addition to the heat dissipation requirements of 3C products, in industries such as batteries and energy storage, the demand for heat dissipation has also increased as the power has increased. High thermal conductivity value, can be used as a heat dissipation part for various heating elements. [0003] The production method of artificial graphite film is to use a specific polymer film material, which is carbonized at 1,000°C (nitrogen environment) and graphitized at 2,400°C (argon environment), and then subjected to subsequent rolling process to obtain graphite film. [0004] An analysis of the pri...

Claims

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Application Information

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IPC IPC(8): C08G73/14C01B31/04
CPCC01B32/205C08G73/1035C08G73/1042C08G73/1053C08G73/1067C08G73/1071C08G73/14C09D179/08
Inventor 林振隆刘彦群张惠雯邱国展胡宪霖
Owner IND TECH RES INST
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