Prepreg And Uses Of The Same

Abstract

A prepreg is provided. The prepreg is prepared by immersing a reinforcing material into a resin composition and drying the immersed reinforcing material, wherein the resin composition has a first dielectric constant and comprises a thermosetting resin component, a hardener and a filler. The reinforcing material has a second dielectric constant, and the ratio of the first dielectric constant to the second dielectric constant ranges from 0.8 to 1.05.

Description

technical field [0001] The present invention relates to a prepreg and a laminate provided by using the prepreg, in particular to a prepreg for preparing a laminate with a homogeneous dielectric constant (Dk). Background technique [0002] A printed circuit board (PCB) is a circuit substrate of an electronic device, which carries other electronic components and electrically connects the components to provide a stable circuit working environment. A common printed circuit board substrate is a copper clad laminate (CCL), which is mainly composed of resin, reinforcing material and copper foil. Common resins such as epoxy resin, phenolic resin, polyamide formaldehyde, silicone and Teflon, etc.; commonly used reinforcing materials such as glass fiber cloth, glass fiber mat, insulating paper, linen cloth, etc. [0003] In general, PCBs can be manufactured by the following methods. A reinforcing material such as glass fabric is impregnated in a resin such as epoxy resin, and the re...

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Problems solved by technology

[0005] However, the problem that often occurs is: when the signal group between parallel lines is transmitted, there will be a problem of signal asynchrony such as signal delay or offset, which is called "signal skew (signal skew)"

Specifically, since the PCB board material is composed of "resin composition" and "reinforcement material", and "resin composition" and "reinforcement material" have different dielectric constants due to different materials, here In some cases, the physical properties of the circuit closer to the "resin composition" are greatly affected by the resin composition, and the physical properties of the circuit closer to the "reinforcing material" are greatly affected by the reinforcing material, so the physical properties of the two difference on the , which in turn leads to signal skew

[0007] figure 1 It is a schematic cross-sectional view of an existing PCB board. Taking this figure as an example, there is a pair of parallel lines 111 and 114 in the PCB board, and the distance between the line 111 and the nearest glass fiber bundle 112 (reinforcement material) is 106, while The distance between the line 114 and the nearest glass fiber bundle 116 is 108, because the separation distance 108 is less than 106 (that is, the distance between the line 114 and the glass fiber bundle 116 is smaller than the distance between the line 111 and the glass fiber bundle 112), so the line 114 The dielectric properties of the glass fiber bundle will be greater than that of the line 111, so that the dielectric properties of the lines 111 and 114 will be different, resulting in signal skew problems

For the skew problem, the previous technologies all focused on changing the line design, trying to make each line in a roughly equivalent position as much as possible, so as to reduce the signal skew; however, the change of the line design still has its limitations and high cost. Therefore, it is still difficult to achieve a satisfactory situation in practice.

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