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Fluorine-containing polyimide copper-clad plate and preparation method thereof

A technology of copper-clad laminate and polyimide, which is applied in the field of fluorine-containing polyimide copper-clad laminate and its preparation, can solve the problem of not meeting high temperature conditions, low heat resistance, and inferior to aromatic heterocyclic polymerization Problems such as physical systems, to achieve excellent electrical and mechanical properties, high temperature resistance, and low cost

Inactive Publication Date: 2015-07-08
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, epoxy resin systems also have some problems, such as low heat resistance, far inferior to aromatic heterocyclic polymer systems (such as polyimide, polybenzimidazole, polybenzoxazole, polyphenylquinone, etc.) Oxaline, polybenzothiazole, etc.), cannot meet the application under high temperature conditions

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Put 548 grams (1.0 moles) of 2,2-bis[4-(2,4-diaminoanilino)phenyl]hexafluoropropane and 22,000 grams of N,N-dimethylacetamide into the reaction kettle, at room temperature After stirring and dissolving, cool to below 1°C, add 196 grams (2.0 moles) of maleic anhydride, stir and react at 1°C for 0.5 hours, then add 310 grams (1.0 moles) of 3,3',4,4'-tetracarboxylic di Phenyl ether dianhydride was stirred and reacted for 1 hour to obtain 3254 g of component A, which was designated as A-1.

Embodiment 2

[0036] 548 grams (1.0 moles) of 2,2-bis[4-(2,4-diaminoanilino)phenyl]hexafluoropropane, 2890 grams of N,N-dimethylacetamide and 2000 grams of N-methyl -2-Pyrrolidone was put into the reaction kettle, stirred and dissolved at room temperature, cooled to below 1°C, added 156.8 grams (1.6 moles) of maleic anhydride, stirred and reacted at 5°C for 0.5 hours, then added 310 grams (1.0 moles) of 3, 3',4,4'-Tetracarboxydiphenyl ether dianhydride and 208 g (0.4 moles) of 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, continued stirring After 2 hours of reaction, 6112.8 g of component A was obtained, which was designated as A-2.

Embodiment 3

[0038] 1093 grams (2.0 moles) of 2,2-bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl]propane and 2190 grams of N-methyl-2-pyrrolidone were placed in the reactor , after stirring and dissolving at room temperature, cooled to below 1°C, added 589 grams (1.9 moles) of 3,3',4,4'-tetracarboxydiphenyl ether dianhydride, stirred and reacted at 5°C for 2 hours, added 9.8 grams ( 0.1 mole) maleic anhydride, continue to react for 0.5 hour, obtain 3283 gram B components, denoted as B-1.

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Abstract

The invention relates to a fluorine-containing polyimide copper-clad plate and a preparation method thereof. The fluorine-containing polyimide copper-clad plate consists of a copper foil, a piece of alkali-free glass cloth and fluorine-containing polyimide resin. The preparation method comprises the following steps: (1) facilitating the reaction among 2,2-di[4-(2,4-diaminophenoxy)phenyl] hexafluoropropane, maleic anhydride and aromatic dianhydride in high-polarity non-proton organic solvent to obtain a component A; (2) facilitating the reaction among fluorine-containing aromatic diamine, maleic anhydride and aromatic dianhydride in a high-polarity non-proton organic solvent to obtain a component B; (3) mixing the component A and the component B to obtain a mixture, stirring the mixture to facilitate the reaction to obtain fluorine-containing polyimide resin; (4) immersing the alkali-free glass cloth in the fluorine-containing polyimide resin solution, heating, removing the solvent, and carrying out the semi-solidification to obtain a semi-solidified coil material; and (5) cutting, laminating, laying A copper foil, heating, pressing and solidifying the semi-solidified coil material to obtain the fluorine-containing polyimide copper-clad plate. The prepared fluorine-containing polyimide copper-clad plate is good in electric performance, mechanics property, high in temperature resistance, simple in operation process, excellent comprehensive performance and wide in application prospect.

Description

technical field [0001] The invention belongs to the field of matrix resin composite materials, and in particular relates to a fluorine-containing polyimide copper clad board and a preparation method thereof. Background technique [0002] Copper clad laminate technology and production have experienced more than half a century of development history. Now it has become an important part of basic materials in electronic information products. Copper-clad laminate manufacturing is a sunrise industry, and it has broad prospects along with the development of electronic information and communication industries. Copper clad laminate manufacturing technology is a multidisciplinary technology with high technology. The development of electronics industry technology in the past century shows that copper clad laminate technology is often one of the key aspects to promote the development of the electronics industry. Its progress and development are constantly driven by the innovation and...

Claims

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Application Information

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IPC IPC(8): B32B27/04B32B27/28B32B15/08B32B15/20B32B37/06C08G73/10
Inventor 虞鑫海孙兆琪周志伟
Owner DONGHUA UNIV