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High-toughness photosensitive resin for 3D printing and preparation method thereof.

A photosensitive resin and 3D printing technology, which is applied in the field of polymer materials and 3D printing, can solve the problems that the printed model is easy to break, high strength, easy to bend and break, etc.

Inactive Publication Date: 2015-07-08
QINGDAO UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The shortcomings of photosensitive resin used in SLA 3D printers are particularly prominent. Due to the use of epoxy resin with good stability, it has high strength but is very brittle, and the printed model is easy to break and bend and break.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Example 1: A High Toughness Free Radical 3D Printing Photosensitive Resin and Its Preparation

[0026] First, a tough polyurethane acrylate was synthesized: take 1 mol of diol compound hydroxyl-terminated polybutadiene, add it to 2 mol of toluene diisocyanate, mix rapidly at 10°C for 15 minutes, then raise the temperature to 40°C, and react for 2.5 hours. Add 2mol hydroxyethyl acrylate to the above product, continue to react for 4 hours to obtain tough polyurethane acrylate.

[0027] Take 40g of the tough resin synthesized above, mix it with 50g of tripropylene glycol diacrylate, 5g of 1-hydroxycyclohexylacetophenone, 4g of benzophenone, 0.3g of Tego Glide 100, and 0.7g of Tego Rad 2100 at 25°C In 30 minutes, the 3D printing photosensitive resin was obtained.

Embodiment 2

[0028] Example 2: A High Toughness Free Radical 3D Printing Photosensitive Resin and Its Preparation

[0029] First, a tough polyurethane acrylate was synthesized: take 1 mol of diol compound polypropylene oxide ether diol, add 2 mol of toluene diisocyanate, mix rapidly at 10°C for 15 minutes, then raise the temperature to 40°C, and react for 2.5 hours. Add 2mol hydroxyethyl acrylate to the above product, continue to react for 4 hours to obtain tough polyurethane acrylate.

[0030] Take 30g of the tough resin synthesized above, mix with 10g bisphenol A diacrylate, 15g pentaerythritol triacrylate, 20g cyclotrimethylolpropane formal acrylate, 13g tripropylene glycol diacrylate, 5g1-hydroxycyclohexyl Acetophenone, 4g benzophenone, 1.5g Tego Glide 100, 1.5g Tego Rad 2100 were stirred and mixed at 25°C for 30 minutes to obtain a 3D printing photosensitive resin.

Embodiment 3

[0031] Example 3: A high-toughness free radical-cation hybrid 3D printing photosensitive resin and its preparation

[0032] First, a tough epoxy-modified polyurethane is synthesized: take 1 mol of diol compound hydroxyl-terminated polysiloxane, add it to 2 mol of toluene diisocyanate, mix rapidly at 10°C for 15 minutes, then raise the temperature to 50°C, and react for 3 hours. Add 2mol glycidol to the above product, and continue to react for 4 hours to obtain tough epoxy-modified polyurethane.

[0033] Take 20g of the toughness resin synthesized above, and 15g 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexyl carboxylate, 10g bisphenol A epoxy resin, 30g trimethylolpropane triacrylate , 15g of isobornyl acrylate, 5g of photoinitiator triarylsulfonium hexafluorophosphate, 4.8g of 1-hydroxycyclohexylacetophenone, and 0.2g of Tego Flow 300 were stirred and mixed at 40°C for 30 minutes to obtain a 3D printing photosensitive resin.

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PUM

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Abstract

The invention provides a high-toughness photosensitive resin for 3D printing and a preparation method thereof. The photosensitive resin comprises a photosensitive resin (maleable photosensitive resin and rigid photosensitive resin), an active diluent, a light initiator and an additive. The method first synthesizes the toughness photosensitive resin (maleable polyurethane acrylate and epoxy modified polyurethane), and then the maleable photosensitive resin is mixed with the rigid photosensitive resin, active diluent, light initiator and additive. The maleable photosensitive resin is prepared from a polymer soft segment, which is a mixture of one or more selected from of polypropyleneoxide glycol ether, PTMG, hydroxyl-terminated polybutadiene, hydroxyl-terminated styrene butadiene rubber, hydroxyl-terminated butadiene acrylonitrile rubber and hydroxyl-terminated polysiloxane, and a polymer hard segment of toluene diisocyanate or isophorone diisocyanate, through hydroxyethyl acrylate or epoxypropanol termination. The photosensitive resin is applicable to DLP or SLA type 3D printers for modification of the existing 3D printing photosensitive resin, has excellent bending strength, and can directly print out elastic models.

Description

technical field [0001] The invention belongs to the field of polymer materials, in particular to a photosensitive resin mixture and a preparation method thereof, which can be used in the field of 3D printing. Background technique [0002] The 3D printing technologies that use photosensitive resin as printing materials mainly include: stereolithography (Stereolithography, SLA), DLP projection three-dimensional printing process (Digital Light Processing, DLP) and ultra-thin layer thick photosensitive resin injection molding technology (Connex500 system , Objet Geometries). The printing process is to determine the three-dimensional model in the computer, and then deliver it to the 3D printer. The printing process uses ultraviolet light to irradiate the liquid photosensitive resin, and the layers are stacked and formed. [0003] The photosensitive resin used for 3D printing needs to be cured quickly under the exposure conditions of the 3D printer, and it also needs to meet the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027C08G18/76C08G18/69C08G18/67C08G18/30C08G18/61C08G18/48C08G18/75
Inventor 魏燕彦王虎杜秀才马凤国林润雄
Owner QINGDAO UNIV OF SCI & TECH
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