High-conductivity polyimide/carbon material/silver three-phase composite film and preparing method thereof

A polyimide and composite film technology, applied in the field of highly conductive polyimide/carbon material/silver three-phase composite film and its preparation, can solve the problem of increasing the density of polymer matrix, easy corrosion of metal materials, and reducing the flexibility of materials Sex and other issues, to achieve excellent high temperature performance, to solve the effect of high density

Inactive Publication Date: 2015-09-02
HANGZHOU INST OF ADVANCED MATERIAL BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a single metal filler will not only increase the density of the polymer matrix, but a large number of metal fillers will also reduce the flexibility of

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] (1) adding mass fraction in DMAC is 5% graphene, and ultrasonically disperses at room temperature so that it is fully dispersed in an organic solvent and forms a uniform dispersion;

[0020] (2) Add the ODA monomer to the graphene organic solvent dispersion, stir until it is completely dissolved, then add the BPDA monomer to the above solution in batches under stirring (the molar ratio of BPDA to ODA is 1.01:1), Reaction synthesis has the polyamic acid / graphene solution of certain viscosity (polyamic acid solid content is 12%), add subsequently by trifluoroacetylacetone, silver acetate, and the solution of appropriate DMAc configuration (trifluoroacetylacetone and silver acetate mole Ratio 3:1, the massfraction of silver in polyimide is 10%), stirs 2h, casts to form polyamic acid / graphene / silver trifluoroacetylacetonate film subsequently;

[0021] (3) Heat the polyamic acid / graphene / silver trifluoroacetylacetonate film to 350°C for imidization and reduction of silver io...

Embodiment 2

[0023] (1) adding mass fraction in DMAC is 10% graphene, and ultrasonically disperses at room temperature so that it is fully dispersed in an organic solvent and forms a uniform dispersion;

[0024] (2) Add the ODA monomer to the graphene organic solvent dispersion, stir until it is completely dissolved, then add the BPDA monomer to the above solution in batches under stirring (the molar ratio of BPDA to ODA is 1.01:1), Reaction synthesis has the polyamic acid / graphene solution of certain viscosity (polyamic acid solid content is 12%), add subsequently by trifluoroacetylacetone, silver acetate, and the solution of appropriate DMAc configuration (trifluoroacetylacetone and silver acetate mole Ratio 3:1, the massfraction of silver in polyimide is 10%), stirs 2h, casts to form polyamic acid / graphene / silver trifluoroacetylacetonate film subsequently;

[0025] (3) Heat the polyamic acid / graphene / silver trifluoroacetylacetonate film to 350°C for imidization and reduction of silver i...

Embodiment 3

[0027] (1) adding mass fraction to DMAC is 20% graphene, and ultrasonically disperses at room temperature to make it fully dispersed in an organic solvent and form a uniform dispersion;

[0028] (2) Add the ODA monomer to the graphene organic solvent dispersion, stir until it is completely dissolved, then add the BPDA monomer to the above solution in batches under stirring (the molar ratio of BPDA to ODA is 1.01:1), Reaction synthesis has the polyamic acid / graphene solution of certain viscosity (polyamic acid solid content is 12%), add subsequently by trifluoroacetylacetone, silver acetate, and the solution of appropriate DMAc configuration (trifluoroacetylacetone and silver acetate mole Ratio 3:1, the massfraction of silver in polyimide is 10%), stirs 2h, casts to form polyamic acid / graphene / silver trifluoroacetylacetonate film subsequently;

[0029] (3) Heat the polyamic acid / graphene / silver trifluoroacetylacetonate film to 350°C for imidization and reduction of silver ions....

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Abstract

The invention relates to a high-conductivity polyimide/carbon material/silver three-phase composite film and a preparing method thereof, and belongs to the field of electric-conduction and electromagnetic shielding composite films. The preparing method of the polyimide composite film includes the steps that polyamide salt formed by dicarboxylic anhydride and diamine in a condensation polymerization mode serves as a precursor, carbon materials in a certain proportion and silver with silver trifluoroacetylacetone as a precursor are doped into the polyamide salt, and high-temperature imidization is carried out to obtain the film. The mass percent of the silver ranges from 0% to 20%, and the mass percent of the carbon materials ranges from 0% to 30%. The molecular proportion of dicarboxylic anhydride monomers to diamine monomers ranges from 1-1.2:1. The polyimide composite film prepared with the method has the advantages that the resistance and the electromagnetic shielding effectiveness are adjustable, the preparing technology is simple, density is low, conductivity is high, flexibility is good, and the corrosion resistance is achieved, and therefore the polyimide composite film is widely suitable for the electronic fields such as microwave absorption and EMI shielding and the photoelectron field.

Description

technical field [0001] The invention belongs to the field of conductive and electromagnetic shielding composite films, in particular to a highly conductive polyimide / carbon material / silver three-phase composite film and a preparation method thereof. Background technique [0002] Polymer-based conductive composite materials are widely used in the fields of electronics, electronics, microelectronics, and optoelectronics due to their low density, simple molding process, corrosion resistance, and good flexibility, especially in the research of electromagnetic shielding materials. . The preparation of polymer-based conductive composites usually uses fillers with high conductivity, such as metal powder and metal fibers, in the polymer matrix to make the final composite material have high conductivity and electromagnetic shielding function. However, a single metal filler will not only increase the density of the polymer matrix, but a large amount of metal filler will also reduce t...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08K3/04C08K3/08C08K7/06C08K7/24C08G73/10
Inventor 田国峰王俊莉齐胜利牛鸿庆韩恩林武德珍
Owner HANGZHOU INST OF ADVANCED MATERIAL BEIJING UNIV OF CHEM TECH
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