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Adhesive sheet

A technology for adhesive sheets and adhesives, which is applied in the direction of adhesive types, ester copolymer adhesives, conjugated diene adhesives, etc., and can solve the problems of residual adhesive and lower yield.

Active Publication Date: 2015-09-09
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when a conventional adhesive sheet is used, when it is peeled off from a structure including an encapsulating resin and a semiconductor chip, there is a problem that adhesive residue is generated in the structure.
In particular, there is a problem that the residual glue is conspicuous in the peripheral portion of the semiconductor chip, and this residual glue becomes a cause of a decrease in yield.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0174] Mix 100 parts by weight of the acrylic copolymer (copolymer of acrylate-2-ethylhexyl and hydroxyethyl acrylate, and acrylate-2-ethylhexyl structural unit: hydroxyethyl acrylate structural unit= 100:5 (weight ratio)), 1.5 parts by weight of isocyanate crosslinking agent (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "CORONATE L"), 10 parts by weight of terpene-phenol-based tackifier resin (YASUHARA CHEMICAL CO ., LTD., trade name "YS POLYSTAR S145"), and 100 parts by weight of toluene to prepare a composition for forming an adhesive layer.

[0175] This adhesive layer-forming composition was coated on one side of a polytetrafluoroethylene film (manufactured by TORAY INDUSTRIES, INC., trade name "Lumirror S10", thickness 38 μm) as a substrate layer to obtain a substrate composed of An adhesive sheet composed of an adhesive layer and an adhesive layer (thickness 10 μm).

Embodiment 2

[0177] Mix 100 parts by weight of an acrylic copolymer (a copolymer of 2-ethylhexyl acrylate and acrylic acid and trimethylolpropane acrylate as the base polymer, and the structural unit of 2-ethylhexyl acrylate: acrylic acid structure Unit: trimethylolpropane acrylate structural unit=100:3:0.03 (weight ratio)), 0.5 parts by weight of epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Company, Inc., trade name "TETRAD-C") , 10 parts by weight of a terpene-phenol tackifier resin (manufactured by YASUHARA CHEMICAL CO., LTD., trade name "YS POLYSTAR S145"), and 100 parts by weight of toluene to prepare a composition for forming an adhesive layer.

[0178] This adhesive layer-forming composition was coated on one side of a polytetrafluoroethylene film (manufactured by TORAY INDUSTRIES, INC., trade name "Lumirror S10", thickness 38 μm) as a substrate layer to obtain a substrate composed of An adhesive sheet composed of an adhesive layer and an adhesive layer (t...

Embodiment 3

[0180] Mix 100 parts by weight of an addition-reactive polysiloxane-based adhesive (manufactured by TORAY INDUSTRIES, INC., trade name "silicone rubber SD-4580L", and silicone rubber:silicone resin=60:40 (weight ratio)), A composition for forming an adhesive layer was prepared using 0.5 parts by weight of a platinum-based catalyst (manufactured by TORAY INDUSTRIES, INC., trade name "SRX-212") and 100 parts by weight of toluene.

[0181] The adhesive layer-forming composition was coated on one side of a polyimide film (manufactured by DU PONT-TORAY CO., LTD., trade name "KAPTON 200H", thickness 50 μm) as a base layer, A pressure-sensitive adhesive sheet composed of a base material layer and a pressure-sensitive adhesive layer (10 μm) was obtained.

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Abstract

The invention provides an adhesive sheet which has appropriate adhesiveness for packaging resin and a semiconductor chip forming a semiconductor package and can be easily peeled off from the packaging resin and the semiconductor chip and can prevent the defective gum during the peeling. The adhesive sheet of the invention is provided with an adhesive agent layer. A contact angle of the adhesive agent layer surface relative to the 4-tert-butyl phenyl glycidyl ether is more than 15 degrees. The adhesive strength of the adhesive sheet relative to the polyethylene terephthalate at the 23 DEG C is more than 0.5N / 20mm.

Description

technical field [0001] The present invention relates to an adhesive sheet. Background technique [0002] In recent years, in pursuit of miniaturization of semiconductor devices, CSP (Chip Size / Scale Package), which forms a built-in semiconductor element and a semiconductor package of the same size, has attracted attention as a semiconductor packaging technology. Among CSPs, WLP (Wafer Level Package) is known as a semiconductor packaging technology that forms a small and highly integrated package. WLP is a technique of encapsulating a plurality of semiconductor chips in batches with an encapsulating resin without using a substrate, and then cutting and separating each semiconductor chip to obtain a semiconductor package. Generally, when semiconductor chips are packaged in batches, in order to prevent movement of the semiconductor chips, a plurality of semiconductor chips are temporarily fixed with a predetermined temporary fixing material, and the plurality of semiconductor ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J133/08C09J183/04C09J109/00C09J11/08C09J11/06
CPCC09J7/20C09J7/385C09J9/00C09J133/00C09J183/04C09J2203/326C09J2301/412
Inventor 北山和宽平山高正有满幸生
Owner NITTO DENKO CORP
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