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Method for preparing Al/Ni reaction laminated foil by EBPVD (electron beam physical vapor deposition)

A technology of reactive lamination and lamination, applied in coating, metal material coating process, ion implantation plating, etc., can solve the problems of easy introduction of impurities at the interface of Al/Ni layer, unfavorable self-propagation rate, low production efficiency, etc. , to achieve the effect of no pollution on the interface, low cost and high production efficiency

Active Publication Date: 2015-09-16
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention aims to solve the technical problems of low production efficiency, high production cost, easy introduction of impurities at the interface of the Al / Ni layer, causing pollution, and unfavorable for obtaining a higher self-spreading rate in the current preparation method of Al / Ni laminated foil, and proposes A method for preparing Al / Ni reaction laminated foil by EBPVD

Method used

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  • Method for preparing Al/Ni reaction laminated foil by EBPVD (electron beam physical vapor deposition)
  • Method for preparing Al/Ni reaction laminated foil by EBPVD (electron beam physical vapor deposition)
  • Method for preparing Al/Ni reaction laminated foil by EBPVD (electron beam physical vapor deposition)

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specific Embodiment approach 1

[0029] Embodiment 1: This embodiment is a method for preparing Al / Ni reaction laminated foil by EBPVD according to the following steps:

[0030] 1. Preliminary preparations for EBPVD: clean the ingots I and II, clean the vacuum chamber of the EBPVD equipment, and install the substrate. There are two electron guns in the vacuum chamber of the EBPVD equipment, which are electron guns I and II. The ingot I is placed under the electron gun I, the cleaned ingot II is placed under the electron gun II, the separation layer material is placed between the ingot I and the ingot II, the substrate is wiped, and the baffle is closed; Ingot I is pure Al, and the ingot II is pure Ni;

[0031] 2. Preheating the ingot: close the vacuum chamber and evacuate until the vacuum degree is 6×10 -3At Pa, turn on the electron gun Ⅰ and electron gun Ⅱ, set the current of the electron gun Ⅰ to 0.02A~0.1A, and the current of the electron gun Ⅱ to 0.02A~0.1A, use the electron gun Ⅰ to scan the ingot Ⅰ for...

specific Embodiment approach 2

[0038] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the material of the separation layer in step 1 is sodium chloride or calcium chloride. Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0039] Embodiment 3: The difference between this embodiment and Embodiment 1 or 2 is that the substrate described in Step 1 is a large heat sink integral substrate, a circulating water-cooled substrate, a static water-cooled substrate, a segmented substrate, The base plate of the radiation tube or the base plate of the water cooling box, and the thickness of the base plate is greater than 40mm. Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention relates to a method for preparing Al / Ni reaction laminated foil by EBPVD (electron beam physical vapor deposition), and aims to solve the technical problems that a current Al / Ni laminated foil preparation method is low in production efficiency and high in production cost, impurities are easily led into an Al / Ni layer interface, pollution is caused, and higher self-propagating speed cannot be obtained. The method includes the steps: firstly, previous preparation of EBPVD; secondly, ingot preheating; thirdly, deposition layer separation; fourthly, laminated foil deposition. The Al / Ni reaction laminated foil is uniform in structure, the layer thickness can be controlled, the interface is complete and clear, pollution is avoided, production efficiency is high, cost is low, the temperature of various substrates can be lower than 160 DEG C in the preparation process, combustion of the Al / Ni reaction laminated foil is avoided, and the Al / Ni reaction laminated foil prepared by the method can release great heat in a self-propagating mode within a short time and can be applied to the field of special welding.

Description

technical field [0001] The invention relates to a preparation method of Al / Ni reaction laminated foil. Background technique [0002] With the rapid development of high-tech represented by space technology, information technology, new energy and new materials, higher requirements are put forward for material connection technology. Taking the space environment as an example, due to the limitation of the spacecraft load, traditional melting welding cannot be used in space; while brazing with high reliability often has a complicated process and is difficult to achieve in space. In VLSI manufacturing, it is necessary to accurately and quickly solder some original devices on the circuit board, and electronic devices are often very sensitive to heat, which requires shortening the connection time as much as possible and reducing the impact on surrounding devices. Al / Ni reactive laminated foil is a new type of layered energetic composite material, which can be used as a local heat s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/30C23C14/14
Inventor 宋广平芦强强孙跃赫晓东
Owner HARBIN INST OF TECH
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