Flame-retardant, halogen-free, and phosphorus-free resin composition, its use, and its preparation method for prepregs, laminates, and copper-clad laminates

Abstract

The invention discloses an inflaming-retarding halogen-free and phosphorus-free resin composition. The inflaming-retarding halogen-free and phosphorus-free resin composition is characterized in that the inflaming-retarding halogen-free and phosphorus-free resin composition is composed by the combination of a resin object, inorganic filler, curing accelerator and solvent. The weight ratio of the resin object, the inorganic filler, the curing accelerator and the solvent is 100:5-50:0.01-1:35-93. The resin object is composed by the combination of halogen-free and phosphorus-free benzoxazine resin, halogen-free and phosphorus-free epoxy resin, halogen-free and phosphorus-free organic silicon resin and curing agent. The weight ratio of the halogen-free and phosphorus-free benzoxazine resin, the halogen-free and phosphorus-free epoxy resin, the halogen-free and phosphorus-free organic silicon resin and the curing agent is 100:20-60:20-60:10-40. The halogen-free and phosphorus-free benzoxazine resin is composed by the combination of 60-100% of melamine-type halogen-free and phosphorus-free benzoxazine resin and 0-40% of other kinds of halogen-free and phosphorus-free benzoxazine resin. The inflaming-retarding halogen-free and phosphorus-free resin composition is applied to the preparation of a half-curing piece, a laminated board and a copper-clad plate used in high frequency, and the practicability is strong.

Description

technical field [0001] The invention belongs to a polymer resin composition and its application in the manufacture of composite materials, and relates to a flame-retardant, halogen-free and phosphorus-free resin composition, its application, and a preparation method for prepregs, laminated boards, and copper-clad boards. The flame retardant, halogen-free and phosphorus-free resin composition of the invention is especially suitable for the preparation of prepregs, laminates and copper-clad boards for high frequency (1 GHz). Background technique [0002] With the high-speed and high-frequency of electronic information processing and transmission, higher requirements are put forward for the dielectric properties of laminated boards and copper-clad laminates. It is a new requirement to prepare plates with low dielectric constant and dielectric loss factor to reduce signal delay, distortion and loss during high-speed transmission. In addition, since the European Union officially...

AI Technical Summary

Problems solved by technology

The invention introduces melamine-type benzoxazine resin with high nitrogen content, and adopts nitrogen / silicon / inorganic filler synergistic flame retardancy, and the flame retardancy can reach UL94V-0 level; by adding organic silicon resin with low dielectric properties (The dielectric constant is 3, the dielectric loss factor is 0.005), and the pressed plate has a lower dielectric constant (3.22-3.78) and dielectric loss factor (0.006-0.007); through the introduction of the flexible segment in the silicone resin , improve the problem of poor flexibility of the board after curing of melamine benzoxazine resin and epoxy resin; through the Si-O-Si bond in the structure of the silicone resin, the heat resistance of the board is greatly improved (Td5%≥ 390°C); thus, the present invention provides a halogen-free, phosphorus-free, high-frequency (1GHz), flame-retardant resin composition, and further, provides a flame-retardant, halogen-free, and phosphorus-free resin composition and is used for prepregs, Preparation method of laminated board and copper clad laminate to manufacture high frequency (1 GHz) prepreg, laminated board and copper clad laminate

Images