Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for preparing infrared cut-off filter

A technology of infrared cut-off and optical filter, which is applied in the direction of optical filter, optics, optical components, etc., can solve the problems of unreasonable process design, affecting the quality and yield of window plates, etc., and achieve the improvement of viscosity and interfacial film properties, polishing Good effect and high hardness

Inactive Publication Date: 2015-10-14
江苏苏创光学器材有限公司
View PDF6 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method still has the problem of unreasonable process design, which will directly affect the quality and yield of the window

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Step 1. Cutting: take blue glass as the raw material, and use the glass cutting machine to cut the blue glass raw material according to the demand;

[0025] Step 2, shaping; use the diamond grinding wheel of the CNC machine tool to grind the corners of the wafer;

[0026] Step 3, slicing; cut the reshaped blue glass with diamond wire cutting equipment, the diameter of the diamond wire is 0.16mm, the particle size of the diamond on the diamond wire is 40μm, and the diamond wire moves at a speed of 15m / s during cutting. The moving speed of the blue glass relative to the diamond wire is 0.3mm / min, and the cutting fluid is continuously sprayed on the diamond wire during cutting. The cutting fluid contains diamond particles with a particle size of 30 μm and corundum particles with a particle size of 60 μm;

[0027] Step 4, chamfering; using the diamond grinding wheel of the CNC machine tool to chamfer the corners of the wafer;

[0028] Step 5. Grinding; using a grinding mac...

Embodiment 2

[0032] Step 1. Cutting: take blue glass as the raw material, and use the glass cutting machine to cut the blue glass raw material according to the demand;

[0033] Step 2, shaping; use the diamond grinding wheel of the CNC machine tool to grind the corners of the wafer;

[0034] Step 3, slicing; cutting the reshaped blue glass with emery wire cutting equipment, the diameter of the emery wire is 0.14 mm, the particle size of the diamond on the emery wire is 30 μm, and the emery wire moves at a speed of 12 m / s during cutting. The moving speed of the blue glass relative to the emery wire is 0.2mm / min. When cutting, the cutting fluid is continuously sprayed on the emery wire. The cutting fluid contains diamond particles with a particle size of 20 μm and corundum particles with a particle size of 50 μm;

[0035] Step 4, chamfering; using the diamond grinding wheel of the CNC machine tool to chamfer the corners of the wafer;

[0036]Step 5. Grinding; using a grinding machine to gri...

Embodiment 3

[0040] Step 1. Cutting: take blue glass as the raw material, and use the glass cutting machine to cut the blue glass raw material according to the demand;

[0041] Step 2, shaping; use the diamond grinding wheel of the CNC machine tool to grind the corners of the wafer;

[0042] Step 3, slicing; cut the reshaped blue glass with diamond wire cutting equipment, the diameter of the diamond wire is 0.15 mm, the particle size of the diamond on the diamond wire is 35 μm, and the diamond wire moves at a speed of 13 m / s during cutting. The moving speed of the blue glass relative to the diamond wire is 0.25mm / min. When cutting, the cutting fluid is continuously sprayed on the diamond wire. The cutting fluid contains diamond particles with a particle size of 25 μm and corundum particles with a particle size of 55 μm;

[0043] Step 4, chamfering; using the diamond grinding wheel of the CNC machine tool to chamfer the corners of the wafer;

[0044] Step 5. Grinding; using a grinding mach...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a method for preparing an infrared cut-off filter, specifically comprising the steps of cutting, shaping, slicing, chamfering, grinding, double-sided chemical polishing, coating, and the like. An infrared cut-off filter prepared by the method has high quality. The rejection rate is low. The production efficiency is high.

Description

technical field [0001] The invention relates to a preparation method of an infrared cutoff filter, in particular to a preparation method of a sapphire infrared cutoff filter, and belongs to the technical field of sapphire processing. Background technique [0002] Infrared cut-off filter is an optical filter with high and low refractive index alternately coated on the optical substrate by using precision optical coating technology to achieve high transparency in the visible light region (400-630nm) and cut-off in the near-infrared (700-1100nm). It is mainly used in digital imaging fields such as mobile phone cameras, computer built-in cameras, and car cameras to eliminate the influence of infrared light on CCD / CMOS imaging. [0003] Chinese patent document ZL201210121438.6 provides a method for preparing a blue glass infrared cut filter, which includes selecting a film system according to the transmittance of the blue glass and a preset transmittance, and selecting the film m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G02B5/20G02B1/115
CPCG02B5/208G02B1/115
Inventor 苏凤坚刘俊郝正平
Owner 江苏苏创光学器材有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com