A kind of conductive paste for solar cell encapsulation and its preparation method and application
A technology of solar cells and conductive pastes, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of poor thermal conductivity, high curing temperature of conductive adhesive, long curing time, etc., to achieve increased oxidation resistance, uniform properties, evenly dispersed effect
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Embodiment 1
[0041] A conductive paste for solar cell encapsulation, consisting of the following components by weight: 5 parts of bismaleimide, 8 parts of matrix resin, 1 part of epoxy diluent, 2 parts of dispersant (stearamide), 10 parts of flaky graphene of modified loaded nano-silver, 1 part of curing agent (trimethylhexamethylenediamine), curing accelerator (2,4,6-tris(dimethylaminomethyl)phenol ) 0.5 parts, modified micron silver powder 70 parts, coupling agent (γ-aminopropyltriethoxysilane) 1.5 parts, antioxidant (2,5-di-tert-butylhydroquinone) 0.5 parts.
[0042] The matrix resin is composed of the following components in parts by weight: 25 parts of bismaleimide, 45 parts of bisphenol A epoxy resin, 10 parts of epoxy diluent, and 20 parts of dispersant.
[0043] The preparation method of described conductive paste, comprises the steps:
[0044] (1) Mix 5 parts of imide-extended bismaleimide, 8 parts of matrix resin, 1 part of butanediol diglycidyl ether and 1.5 parts of stearamide...
Embodiment 2
[0058] A conductive paste for solar cell encapsulation, consisting of the following components by weight: 10 parts of bismaleimide, 5 parts of matrix resin, 2 parts of epoxy diluent, 5 parts of dispersant (stearamide), 5 parts of modified scaly graphene loaded with nanometer silver, 1 part of curing agent, 0.2 part of curing accelerator, 65 parts of modified micron silver powder, 1 part of coupling agent, and 0.2 part of antioxidant.
[0059] The matrix resin is composed of the following components in parts by weight: 20 parts of bismaleimide, 35 parts of bisphenol A epoxy resin, 5 parts of epoxy diluent, and 15 parts of dispersant.
[0060] The preparation method of described conductive paste, comprises the steps:
[0061] (1) Mix 10 parts of imide-extended bismaleimide, 5 parts of matrix resin, 2 parts of butanediol diglycidyl ether (an epoxy diluent) and 4 parts of dispersant;
[0062] (2) Add conductive micron silver powder to the aqueous solution of arginine, stir for 30...
Embodiment 3
[0072] A conductive paste for solar cell encapsulation, consisting of the following components by weight: 7 parts of bismaleimide, 6 parts of matrix resin, 2 parts of epoxy diluent, 3 parts of dispersant, modified loaded nano 8 parts of silver flake graphene, 1 part of curing agent, 0.3 part of curing accelerator, 70 parts of modified micron silver powder, 2 parts of coupling agent, and 0.4 part of antioxidant.
[0073] The base resin is composed of the following components in parts by weight: 30 parts of bismaleimide, 45 parts of bisphenol A epoxy resin, 15 parts of epoxy diluent, and 25 parts of dispersant.
[0074] The preparation method of described conductive paste, comprises the steps:
[0075] (1) Mix 7 parts of imide-extended bismaleimide, 6 parts of matrix resin, 2 parts of butanediol diglycidyl ether (epoxy diluent) and 2.5 parts of dispersant;
[0076] (2) Add conductive micron silver powder to the aqueous solution of arginine, stir for 30 minutes, mix evenly, and ...
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