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Photocuring thermocuring resin composition, application and circuit board using same

A heat-curing resin and light-curing technology, used in photosensitive materials for optomechanical equipment, optics, optomechanical equipment, etc., can solve problems such as poor environmental protection and complex processes, and achieve the effect of excellent adhesion

Inactive Publication Date: 2015-10-21
RONGDA PRINTING INK HUIZHOU +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the photopolymerizable heat-curable composition with UV discoloration resistance disclosed in the prior art has the following defects: the ink needs to be dried before exposure, and the volatile organic solvent is dried, so that the process is complicated and the environmental protection is poor

Method used

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  • Photocuring thermocuring resin composition, application and circuit board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] 200g of hydantoin epoxy resin (MHR070 from Wuxi Meihua Chemical Co., Ltd., epoxy value 0.7), 100g of acrylic acid, 0.3g of hydroquinone and 1.5g of triphenylphosphine were mixed and heated to 100 to 120°C. After reacting for 12 hours, when the acid value was less than 5, add 130g of trimethylolpropane triacrylate, then add 70g of tetrahydrophthalic anhydride, and control the temperature at 90 to 100°C for 3 hours to stop the reaction. A light yellow resin with a viscosity of 1000dPa.s / 25°C, a number average molecular weight of 580, a solid content of more than 98% and an acid value of 53 was obtained, coded as A-1.

Embodiment 2

[0080] 200g 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester (TTA186, epoxy value 0.84), 121g acrylic acid, 0.3g hydroquinone and 1.5 g of triphenylphosphine were mixed and heated to 100 to 120°C. After reacting for 15 hours, when the acid value was less than 5, add 122g of trimethylolpropane triacrylate, then add 100g of tetrahydrophthalic anhydride, and control the temperature at 90 to 100°C for 3 hours to stop the reaction. A light yellow resin with a viscosity of 800dPa.s / 25°C, a number average molecular weight of 691, a solid content of more than 98% and an acid value of 69 was obtained, coded as A-2.

Embodiment 3

[0082] 200g of hydrogenated bisphenol A type epoxy resin (Nanya, Taiwan NPST-3000, epoxy value 0.45), 65g of acrylic acid, 1.5g of triphenylphosphine and 0.3g of hydroquinone were mixed and heated to 100 to 120°C. After reacting for 15 hours, when the acid value was less than 5, 70 g of tetrahydrophthalic anhydride was added. And the temperature was controlled at 90 to 100° C., and the reaction was carried out for 3 hours. Detect with infrared spectrometer, when 1780cm-1 peak disappears, stop reaction, and add 130g trihydroxypropane triacrylate. A light yellow resin with a viscosity of 900dPa.s / 25°C, a number average molecular weight of 720, a solid content of more than 98% and an acid value of 56 was obtained, coded as A-3.

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Abstract

The invention provides a photocuring thermocuring resin composition. The photocuring thermocuring resin composition comprises, by weight, A, 20-70% of resin containing carboxyl and unsaturated double bonds and no aromatic nucleus, B, 2-20% of photopolymerization unsaturated monomers, C, 5-20% of epoxy resin, D, 0.1-5% of an epoxy resin curing catalyst, E, 0.1-15% of a polymerization initiator, F, 1-60% of padding, G, 5-50% of titanium dioxide and H, 0.1-5% of an antifoaming agent, and an flatting agent, antioxygen, an adhesion promoter, a thixotropic agent, a coupling agent and the like which are optional; all the components are counted based on the resin composition, and the sum of the percentage composition of all the components is 100%. The photocuring thermocuring resin composition can be used for laser imaging and has very good properties such as soldering heat resistance, ultraviolet light color-change resisting property, hardness, adhesiveness, acid resistance, alkali resistance and solvent resistance.

Description

technical field [0001] The present invention relates to a light-curable heat-curable resin composition, its use and a circuit board using it, more specifically, to a light-curable heat-curable resin composition with low solvent content and no aromatic ring, its use and use its circuit board. Background technique [0002] In recent years, with the development of LED (Light Emitting Diode) technology, LED lighting has been widely used as a green and energy-saving light source. As LED lighting, the lamp beads of LED backlight are installed on the backlight substrate, and it has also developed rapidly. The mounting substrate of LED lamp beads requires extremely small pads, and the use of photosensitive imaging white ink has become a well-known technology. In the past, it used the following processes to achieve the refinement of conductive circuit pads: screen printing photosensitive ink; pre-drying; using film for contact exposure, cleaning the unexposed part with alkaline wat...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/004
Inventor 杨遇春刘启升黄勇
Owner RONGDA PRINTING INK HUIZHOU