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Highly active phenolic compound modified expandable phenolic resin and preparation method thereof

A high-activity phenolic and phenolic resin technology, which is applied in the field of preparation of high-active phenolic compounds modified expandable high-solid phenolic resins, can solve problems such as high curing temperature, low activity of phenolic resins, and many acidic curing agents. Achieve the effects of lower curing temperature, increased methylol content, and improved resin activity

Active Publication Date: 2020-01-17
INST OF CHEM IND OF FOREST PROD CHINESE ACAD OF FORESTRY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Technical Problems Solved In order to solve the low activity of phenolic resins in the prior art, the need for more acidic curing agents during curing and molding, and the high curing temperature, the present invention uses high-activity phenolic compounds to replace part of phenol to prepare phenolic resins, which improves the phenolic resin. Resin activity, while reducing the amount of curing agent, curing temperature and curing time, reducing the corrosion of phenolic foam material acid curing agent on building walls, oil pipelines, etc., and saving energy

Method used

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  • Highly active phenolic compound modified expandable phenolic resin and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] (1) Add 35g of phenol, 0.5g of calcium oxide, and 10g of water into a four-neck flask with a condenser, raise the temperature to 70°C for reaction, and add 4g of paraformaldehyde for 10 minutes;

[0023] (2) Add 11 g of paraformaldehyde to the mixed solution of (1) reaction, add in 3 times, control the reaction temperature at 70° C., and co-condense for 30 minutes;

[0024] (3) Cool down to 55° C., add 0.5 g of m-cresol and continue the reaction for 20 minutes, cool to 40° C. and discharge to prepare m-cresol-modified expandable phenolic resin.

[0025] See attached table 1 for the basic properties of the resin and the curing process conditions.

Embodiment 2

[0027] (1) 55g phenol, 16.5g 30% (wt) Ba(OH) 2 Add the solution and 20g of water into a four-neck flask with a condenser, raise the temperature to 90°C, add 10g of furfural and react for 30 minutes;

[0028] (2) add furfural 30g in the mixed solution of (1) reaction, add in 3 times, control reaction temperature 90 ℃, co-condensation reaction 60 minutes;

[0029] (3) Cool down to 75° C., add 10 g of p-cresol and continue the reaction for 60 minutes, cool to 40° C. and discharge to prepare p-phenol-modified expandable phenolic resin.

[0030] See attached table 1 for the basic properties of the resin and the curing process conditions.

Embodiment 3

[0032] (1) 45g of phenol, 7.5g of 30% (wt) NaOH solution, and 10g of water were added to a four-neck flask with a condenser tube, the temperature was raised to 85°C, and 6g of paraformaldehyde was added to react for 20 minutes;

[0033] (2) Add 24 g of paraformaldehyde to the mixed solution of (1) reaction, add in 4 times, control the reaction temperature at 85° C., and co-condense for 40 minutes;

[0034] (3) Cool down to 65° C., add 5 g of resorcinol to continue the reaction for 35 minutes, cool to 40° C. and discharge to prepare a resorcinol-modified expandable phenolic resin.

[0035] See attached table 1 for the basic properties of the resin and the curing process conditions.

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Abstract

The invention relates to a preparation method for high-activity phenolic compound modified expandable phenolic resin. Raw materials of the resin comprises, by weight, 35 to 55 parts of phenol, 0.5 to 10 parts of high-activity phenolic compound, 15 to 40 parts of aldehyde compound, 0.5 to 5 parts of basic catalyst and 10 to 30 parts of water. The high-activity phenolic compound modified expandable phenolic resin is prepared through step-by-step condensation polymerization technology, the phenol, the basic catalyst, the water and parts of the aldehyde compound are added into a four-opening flask, reaction is conducted for a period of time, the residual aldehyde compound is added in batches, and reaction is conducted continuously; the temperature is lowered to 55 to 75 DEG C, the high-activity phenolic compound is added, reaction is conducted continuously for a period of time, and the high-activity expandable phenolic resin is prepared. According to the preparation method for the high-activity phenolic compound modified expandable phenolic resin, part of phenol is replaced by the high-activity phenolic compound, the activity of the resin is improved, and at the same time, the free formaldehyde content of the resin, and the dosage of the curing agent and the curing temperature of the resin are lowered; in addition, no waste water is generated in the preparation process of the resin, and the environmental pollution and energy waste due to dehydration are avoided.

Description

technical field [0001] The invention relates to the field of preparation of high-activity phenolic resin, in particular to a preparation method of high-activity phenolic compound-modified expandable high-solid phenolic resin. Background technique [0002] Thermosetting phenolic resin is a high polymer prepared by condensation polymerization of phenolic compounds and aldehyde compounds under the catalysis of a basic catalyst. Thermosetting phenolic resin, surfactant, foaming agent, curing agent and other additives are mixed evenly and then cured at a certain temperature to make a foam material. The foam material has the advantages of heat preservation, flame retardancy, high temperature resistance and sound insulation. It is widely used in construction, automobiles, ships, aviation equipment, oil pipelines and other fields. At present, there are many studies on phenolic foam in phenolic foam materials. CN 103897125 A provides a cardanol-modified nitrogen-containing phenolic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G8/10C08G8/08C08G8/06C08G8/24C08G8/04
Inventor 陈日清刘娟王春鹏储富祥
Owner INST OF CHEM IND OF FOREST PROD CHINESE ACAD OF FORESTRY
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