Silver alloy wire rod

Abstract

The invention provides a silver alloy wire rod, which includes a core wire, a gold plated layer, and a palladium plated layer formed between the gold plated layer and the core wire. The core wire includes silver, palladium, a first additive component, and a second additive component, wherein the first additive component may be platinum, nickel, or copper, and the second additive component may be germanium, cerium, gold, or iridium. The core wire comprises, based on the total weight, palladium with the content being more than or equal to 1.1 wt% and less than or equal to 2.8 wt%, the first additive component with the content being more than 0.1 wt% and less than 1 wt%, and the second additive component with the content being more than 0.02 wt% and less than 0.2 wt%. Therefore, the silver alloy wire rod has excellent conductivity, antioxidant ability, wire drawing operation performance, heading stability, PCT reliability, and u-HAST reliability, and the interfacial bonding strength between the silver alloy wire rod and a packaging material can be particularly improved.

Description

technical field [0001] The invention relates to the related fields of semiconductor and LED packaging, in particular to a silver alloy wire with silver as the main component. Background technique [0002] In view of the good ductility, electrical conductivity and resistance to oxidation of gold wires, most of the wire bonding manufacturing methods in the early semiconductor field used gold wires with a wire diameter of 15 to 50 microns to bond The die is interconnected with the substrate for signal transfer purposes. [0003] However, as the price of gold soars year by year and the brittle intermetallic compound formed at the interface between the gold wire and the aluminum pad is easy to deteriorate the reliability of the contact, the industry turns to the cheap copper wire instead of gold wire to reduce the reliability of electronic products Production costs, and the copper wire has the advantages of high strength and is not easy to form intermetallic compounds with the a...

AI Technical Summary

Problems solved by technology

However, the silver alloy wires in the prior art are prone to chemical reactions with the packaging materials in the harsh environment of the reliability test, so that the silver alloy wires in the prior art are often corroded to reduce their reliability; and Delamination (also known as delamination (delamination)) often occurs between the surface of the silver alloy wire and the packaging material, so that the silver alloy wire of the prior art cannot have sufficient interface bonding strength with the packaging material, and even Cause problems such as line fusing (burn out)

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