The invention provides a silver alloy wire rod, which includes a core wire, a gold plated layer, and a palladium plated layer formed between the gold plated layer and the core wire. The core wire includes silver, palladium, a first additive component, and a second additive component, wherein the first additive component may be platinum, nickel, or copper, and the second additive component may be germanium, cerium, gold, or iridium. The core wire comprises, based on the total weight, palladium with the content being more than or equal to 1.1 wt% and less than or equal to 2.8 wt%, the first additive component with the content being more than 0.1 wt% and less than 1 wt%, and the second additive component with the content being more than 0.02 wt% and less than 0.2 wt%. Therefore, the silver alloy wire rod has excellent conductivity, antioxidant ability, wire drawing operation performance, heading stability, PCT reliability, and u-HAST reliability, and the interfacial bonding strength between the silver alloy wire rod and a packaging material can be particularly improved.