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A kind of resin composition and its application

A technology of resin composition and compound, applied in the field of (meth)acrylate composition, resin composition and hardened film, can solve the problems of non-wear resistance and poor toughness, achieve performance adjustment, easy performance, and reduce oxygen resistance Effect

Active Publication Date: 2017-06-13
CHINA LUCKY FILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The resin can maintain the hardness, gloss, chemical corrosion resistance and other properties of (meth)acrylate, and at the same time overcome the shortcomings of poor toughness and non-wear resistance of the coating film

Method used

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  • A kind of resin composition and its application
  • A kind of resin composition and its application
  • A kind of resin composition and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] The present embodiment resin composition is formulated according to the following formula:

[0089] Silicone modified (meth)acrylate 100 parts

[0090] Photopolymerization initiator (IRGACURE-TPO) 1 part

[0091] Photopolymerization initiator (UVI-6992) 1 part

[0092] Hexamethylene diisocyanate trimer (N3300) 0.02 parts

[0093] Amino acrylate (OS-1) 4 parts

[0094] Reactive diluent (EM242-TF) 10 parts

[0095] Butanone 24 parts

[0096] Leveling agent (EFKA3299) 1 part

[0097] Fully mix the above components to obtain a transparent and uniform resin composition.

[0098] Among them, silicone-modified (meth)acrylate is prepared from methyl methacrylate, glycidyl methacrylate, acrylic acid, γ-methacryloxypropyl trimethoxysilane, and the molecular chain contains active hydroxyl groups , epoxy groups and double bonds.

[0099] A polyester film with a thickness of 38 μm is used as the base film, and a 3 μm thick resin composition coating is coated on the base film...

Embodiment 2

[0101] The present embodiment resin composition is formulated according to the following formula:

[0102] Silicone modified (meth)acrylate 100 parts

[0103] Photopolymerization initiator (IRGACURE-1173) 2 parts

[0104] Photopolymerization initiator (UVI-6992) 2 parts

[0105] 1 part isophorone diisocyanate (IPDI)

[0106] Active diluent (DPHA) 5 parts

[0107] Amino acrylate (OS-1) 4 parts

[0108] Butanone 28 parts

[0109] Leveling agent (EFKA3299) 1 part

[0110] Fully mix the above components to obtain a transparent and uniform resin composition.

[0111] Among them, the silicone-modified (meth)acrylate is prepared from butyl methacrylate, glycidyl methacrylate, methacrylic acid, and γ-methacryloxypropyltrimethoxysilane, and the molecular chain contains Active hydroxyl, epoxy and double bonds.

[0112] A polyester film with a thickness of 38 μm is used as the base film, and a 3 μm thick resin composition coating is coated on the base film by a reverse gravure pr...

Embodiment 3

[0114] The present embodiment resin composition is formulated according to the following formula:

[0115] Silicone modified (meth)acrylate 100 parts

[0116] Photopolymerization initiator (IRGACURE-819) 4 parts

[0117] Photopolymerization initiator (CAT-3) 4 parts

[0118] Hexamethylene diisocyanate trimer (N3300) 2 parts

[0119] Reactive diluent (604Q-35) 20 parts

[0120] Amino acrylate (OS-1) 4 parts

[0121] Butanone 8 parts

[0122] Leveling agent (EFKA3299) 1 part

[0123] Fully mix the above components to obtain a transparent and uniform resin composition.

[0124] Among them, the silicone-modified (meth)acrylate is prepared from methyl methacrylate, glycidyl acrylate, acrylic acid, and acryltrimethoxysilane, and the molecular chain contains active hydroxyl groups, epoxy groups and double bonds.

[0125] A polyester film with a thickness of 38 μm is used as the base film, and a 3 μm thick resin composition coating is coated on the base film by a reverse gravur...

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Abstract

The invention discloses a resin composition, which comprises organosilicon-modified (methyl)acrylate, a curing agent and an active diluents, by comparing with 100 mass part of organosilicon-modified (methyl)acrylate, the resin composition at least comprises 0.1-20 parts of curing agent and 1-50 parts of active diluents, the organosilicon-modified (methyl)acrylate molecular chain contains active hydroxyl, epoxide group and double bond. The composition is capable of preventing adhesion after primary solidification, and has the characteristics of high hardness, good toughness, better adhesive force and good wear resistance after secondary solidification or multi-time solidification. The composition can be solidified by a plurality of modes, and also enables multi-time solidification; and the resin composition can be used in paints and printing ink fields.

Description

technical field [0001] The present invention relates to a resin composition, in particular to a silicone-modified multi-curable (meth)acrylate composition, the resin can be applied to heat, UV cations, UV radicals, moisture, Air-cured coatings, inks and other fields. [0002] The invention also relates to a cured film, which can be applied in the field of film interior decoration. Background technique [0003] In the prior art, various (meth)acrylate heat-curable and UV-curable resins have been proposed. The cured resin has fast light curing, high hardness of the coating film, good adhesion, good gloss, and chemical resistance. Corrosion and other advantages. Among them, double or multiple curing resins can be rolled, punched and shaped after the first curing, and the double curing can improve the performance and achieve the effect that the first curing can not achieve; in addition, it is easy to adjust the performance and easy to control the curing process, etc. It can e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D4/02C09D4/06C09D7/12C09D11/00C09D11/101C08J7/04C08J7/06
Inventor 姜伟李娜张占国左志和千昌富
Owner CHINA LUCKY FILM CORP