A kind of resin composition and its application
A technology of resin composition and compound, applied in the field of (meth)acrylate composition, resin composition and hardened film, can solve the problems of non-wear resistance and poor toughness, achieve performance adjustment, easy performance, and reduce oxygen resistance Effect
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Embodiment 1
[0088] The present embodiment resin composition is formulated according to the following formula:
[0089] Silicone modified (meth)acrylate 100 parts
[0090] Photopolymerization initiator (IRGACURE-TPO) 1 part
[0091] Photopolymerization initiator (UVI-6992) 1 part
[0092] Hexamethylene diisocyanate trimer (N3300) 0.02 parts
[0093] Amino acrylate (OS-1) 4 parts
[0094] Reactive diluent (EM242-TF) 10 parts
[0095] Butanone 24 parts
[0096] Leveling agent (EFKA3299) 1 part
[0097] Fully mix the above components to obtain a transparent and uniform resin composition.
[0098] Among them, silicone-modified (meth)acrylate is prepared from methyl methacrylate, glycidyl methacrylate, acrylic acid, γ-methacryloxypropyl trimethoxysilane, and the molecular chain contains active hydroxyl groups , epoxy groups and double bonds.
[0099] A polyester film with a thickness of 38 μm is used as the base film, and a 3 μm thick resin composition coating is coated on the base film...
Embodiment 2
[0101] The present embodiment resin composition is formulated according to the following formula:
[0102] Silicone modified (meth)acrylate 100 parts
[0103] Photopolymerization initiator (IRGACURE-1173) 2 parts
[0104] Photopolymerization initiator (UVI-6992) 2 parts
[0105] 1 part isophorone diisocyanate (IPDI)
[0106] Active diluent (DPHA) 5 parts
[0107] Amino acrylate (OS-1) 4 parts
[0108] Butanone 28 parts
[0109] Leveling agent (EFKA3299) 1 part
[0110] Fully mix the above components to obtain a transparent and uniform resin composition.
[0111] Among them, the silicone-modified (meth)acrylate is prepared from butyl methacrylate, glycidyl methacrylate, methacrylic acid, and γ-methacryloxypropyltrimethoxysilane, and the molecular chain contains Active hydroxyl, epoxy and double bonds.
[0112] A polyester film with a thickness of 38 μm is used as the base film, and a 3 μm thick resin composition coating is coated on the base film by a reverse gravure pr...
Embodiment 3
[0114] The present embodiment resin composition is formulated according to the following formula:
[0115] Silicone modified (meth)acrylate 100 parts
[0116] Photopolymerization initiator (IRGACURE-819) 4 parts
[0117] Photopolymerization initiator (CAT-3) 4 parts
[0118] Hexamethylene diisocyanate trimer (N3300) 2 parts
[0119] Reactive diluent (604Q-35) 20 parts
[0120] Amino acrylate (OS-1) 4 parts
[0121] Butanone 8 parts
[0122] Leveling agent (EFKA3299) 1 part
[0123] Fully mix the above components to obtain a transparent and uniform resin composition.
[0124] Among them, the silicone-modified (meth)acrylate is prepared from methyl methacrylate, glycidyl acrylate, acrylic acid, and acryltrimethoxysilane, and the molecular chain contains active hydroxyl groups, epoxy groups and double bonds.
[0125] A polyester film with a thickness of 38 μm is used as the base film, and a 3 μm thick resin composition coating is coated on the base film by a reverse gravur...
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