Chip BGA packaging reinforcing method

A chip and reinforcement glue technology, applied in the field of chip BGA packaging reinforcement, can solve the problems of damage to peripheral components, different heating temperatures, and single glue removal method, and achieve the effect of increasing internal bonding force, improving strength, and ensuring reinforcement effect.

Active Publication Date: 2015-11-11
SUZHOU QITAI ELECTRONICS CO LTD
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing BGA package reinforcement glue can only be removed by heating method, but depending on the glue material, the heating temperature is very different, and sometimes the temperature is too high will cause irreversible damage to the surrounding components, the single method of glue removal makes the original PCB that can be reworked The work board has become a "tasteless" "tasteless"

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip BGA packaging reinforcing method
  • Chip BGA packaging reinforcing method
  • Chip BGA packaging reinforcing method

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0041] Synthesis Example 1 Synthesis of Monofunctional Acrylic Ester Monomer

[0042] Add 12mL of hydroxyacrylic acid, 5ml of dimethylsilanediol, 100ml of absolute ethanol and 1g of sulfamic acid into the three-necked flask, reflux and stir for 3 hours, cool, and filter to obtain the liquid; then add 2ml of 85% phosphoric acid, 50ml of Dehydrated alcohol, reflux, stirring reaction for 10 hours, through silica gel column chromatography, developing agent is dichloromethane, obtain light yellow liquid, be monofunctional acrylate monomer, 1 HNMR (400MHz, CDCl 3 )δ5.58(s, -C=CH 2 ,1H),6.11(s, -C=CH 2 ,1H),1.85(s, CH 3 ,3H); 31 P-NMR (ppm): 1.11.

Embodiment 1

[0043] Example 1: Preparation of thermosetting acrylic resin prepolymer

[0044] According to the composition molar ratio and reaction parameters in Table 1, first add benzoyl peroxide (3% of the mass of acrylic acid monomer) and dioxane into the reactor, heat to reflux, and then add monofunctional acrylate monomer , nitrogen-containing vinyl monomer, reflux reaction, then lower the temperature to 60 ° C, remove the solvent in vacuum, and finally add alcohol amine (5% of the mass of the acrylic acid monomer), and obtain a thermosetting acrylic resin prepolymer by column chromatography, which is a water-soluble Properties, molecular weight and molecular weight distribution are shown in Table 1.

[0045] Table 1 Acrylic acid monomer composition and product molecular weight

[0046]

[0047] The structural formulas of monofunctional acrylate monomer and nitrogen-containing vinyl monomer are respectively: , .

Embodiment 2

[0048] Embodiment two: the preparation of reinforcing glue

[0049] According to the mass parts in Table 2, pour the silica sol into container A, and keep the temperature at 25°C; put the thermosetting acrylic resin prepolymer into container B, stir at 80°C for 1h, then add the thermosetting acrylic resin prepolymer In the silica sol, stir for 0.5h; then add the water-based polyurethane compound into container A, and continue stirring for 2h; finally, add paraffin wax into container A, stir for 0.5h to obtain a BGA packaging reinforcement that can be cured at room temperature; out of the container for packaging.

[0050] Table 2 Reinforcing glue composition (mass parts)

[0051] group Silica sol Thermosetting Acrylic Prepolymers Water-Based Polyurethane Compounds paraffin 1 50 30（A） 1 1 2 55 40（B） 1 3 3 56 35（C） 2 4 4 60 40（A） 3 5 5 58 38（B） 2 2 6 52 40（D） 2 3

[0052] Among them, 30(A) represents 30 parts ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
molecular weight distributionaaaaaaaaaa
Login to view more

Abstract

The invention discloses a chip BGA packaging reinforcing method. The method comprises the following steps that after a chip is mounted to a PCB via a BGA, a BGA packaging reinforcing glue is filled between the chip and the PCB; solidification under a normal temperature for 5-50 minutes is performed and then reinforcing to chip BGA packaging is completed. By using the BGA packaging reinforcing method of the invention, a curing condition is simple and curing can be realized through normal temperature placing so that chip damages brought by heating curing needed by reinforcing and a complex technology of ultraviolet curing in the prior art are avoided. During usage, curing is rapid and storage is stable before usage so that a problem of poor storage performance caused by acceleration curing is avoided. And the glue after curing is removed conveniently and can be completely removed under the normal temperature. A defect that the glue can be removed after being heated in the prior art is overcome. Quality of the BGA chip is protected and a product yield is effectively increased.

Description

technical field [0001] The invention belongs to the technical field of electronic product preparation, and in particular relates to a method for encapsulating and reinforcing a chip BGA, which can complete the encapsulating and reinforcing the chip BGA at normal temperature. Background technique [0002] With the development of integrated circuit technology, the integration degree of silicon single chip has been continuously improved, and the packaging requirements for integrated circuits have become more stringent. In order to meet the needs of development, BGA came into being. Today, BGA once became the high Best choice for density, high performance, multi-pin packages. [0003] Encapsulation glue refers to a type of electronic glue or adhesive that can seal, encapsulate or pott some components. After potting, it can play the role of waterproof, moisture-proof, shockproof, dustproof, heat dissipation, and confidentiality. Common encapsulants mainly include epoxy encapsula...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56C09J175/04C09J133/00C09J1/00
CPCH01L21/56C09J1/00C09J133/00C09J175/04
Inventor 贺晓锋
Owner SUZHOU QITAI ELECTRONICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap