Copper surface roughening treatment solution and treatment method thereof

A technology for roughening and copper surface application in printed circuit liquid treatment, electrical components, printed circuit manufacturing, etc. It can solve problems such as high production costs and insufficient profitability, and achieve enhanced bonding, improved oxidation efficiency, and delayed decomposition. Effect

Active Publication Date: 2015-11-11
GUANGDONG GUANGHUA SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the early stage of development of the printed circuit industry, Hong Kong and Taiwan manufacturers gradually introduced advanced technologies from Europe, the United States, Japan and other countries into the country. Equipment design, equipment...

Method used

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  • Copper surface roughening treatment solution and treatment method thereof
  • Copper surface roughening treatment solution and treatment method thereof
  • Copper surface roughening treatment solution and treatment method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] A kind of copper surface roughening treatment liquid of the present embodiment comprises following components:

[0058] h 2 SO 4 (98wt%) 95g / L Organosilane coupling agent 3.5g / L h 2 o 2 (30v / v%) 60mL / L Zinc sulfate 10g / L Benzenesulfonic acid 100mg / L Benzotriazole 0.5g / L 1-Butyl-3 methylimidazolium tetrafluoroborate 0.5g / L Deionized water Dilute to 1L

Embodiment 2

[0060] A kind of copper surface roughening treatment liquid of the present embodiment comprises following components:

[0061] h 2 SO 4 (98%) 95g / L Organosilane coupling agent 3.5g / L h 2 o 2 (30%) 60mL / L Zinc sulfate 10g / L Benzenesulfonic acid 100mg / L Benzotriazole 1g / L dodecyl mercaptan 1.5g / L Deionized water Dilute to 1L

Embodiment 3

[0063] A kind of copper surface roughening treatment liquid of the present embodiment comprises following components:

[0064] h 2 SO 4 (98%) 95g / L Organosilane coupling agent 3.5g / L h 2 o 2 (30%) 60mL / L Zinc sulfate 10g / L

[0065] Benzenesulfonic acid 100mg / L Benzotriazole 2.5g / L dodecyl mercaptan 2.5g / L Deionized water Dilute to 1L

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PUM

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Abstract

The invention discloses a copper surface roughening treatment solution, which comprises the following components: 98wt% of H2SO4 50 to 150g/L, volume concentration 30% of H2O2 40 to 60ml/L, a silane coupling agent 0.5 to 5g/L, dissolvable zinc salt 8 to 12g/L, a stabilizer 50 to 150g/L, a corrosion inhibitor composition 0.5 to 7.5g/L, and deionized water residual. Through treatment of the copper surface roughening treatment solution, a layer of dense and uniform honeycomb structure is formed on the copper surface, the structure can increase the specific surface area combined with semi-curing resin, and during a laminating process, a crosslinking reaction for resin curing is involved, a chemical bond is formed, and the binding force with the semi-curing resin is further enhanced.

Description

technical field [0001] The invention relates to the technical field of surface treatment, in particular to a copper surface roughening treatment liquid and a treatment method thereof. Background technique [0002] my country has become the world's largest producer and consumer of printed circuit boards. The printed circuit industry has gradually grown from a small one, and the entire industrial chain has become more complete. Products have also moved from low-end to mid-end and high-end. develop. The production of mid-end and high-end printed circuit boards not only requires printed circuit board manufacturers to invest a lot of R&D and engineering personnel, but also requires the cooperation of upstream equipment and raw material manufacturers. In the early stage of development of the printed circuit industry, Hong Kong and Taiwan manufacturers gradually introduced advanced technologies from Europe, the United States, Japan and other countries into the country. Equipment de...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0085H05K2203/0789H05K2203/11
Inventor 王翀向琳何为肖定军
Owner GUANGDONG GUANGHUA SCI TECH
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