Copper surface roughening treatment solution and treatment method thereof
A technology for roughening and copper surface application in printed circuit liquid treatment, electrical components, printed circuit manufacturing, etc. It can solve problems such as high production costs and insufficient profitability, and achieve enhanced bonding, improved oxidation efficiency, and delayed decomposition. Effect
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Embodiment 1
[0057] A kind of copper surface roughening treatment liquid of the present embodiment comprises following components:
[0058] h 2 SO 4 (98wt%) 95g / L Organosilane coupling agent 3.5g / L h 2 o 2 (30v / v%) 60mL / L Zinc sulfate 10g / L Benzenesulfonic acid 100mg / L Benzotriazole 0.5g / L 1-Butyl-3 methylimidazolium tetrafluoroborate 0.5g / L Deionized water Dilute to 1L
Embodiment 2
[0060] A kind of copper surface roughening treatment liquid of the present embodiment comprises following components:
[0061] h 2 SO 4 (98%) 95g / L Organosilane coupling agent 3.5g / L h 2 o 2 (30%) 60mL / L Zinc sulfate 10g / L Benzenesulfonic acid 100mg / L Benzotriazole 1g / L dodecyl mercaptan 1.5g / L Deionized water Dilute to 1L
Embodiment 3
[0063] A kind of copper surface roughening treatment liquid of the present embodiment comprises following components:
[0064] h 2 SO 4 (98%) 95g / L Organosilane coupling agent 3.5g / L h 2 o 2 (30%) 60mL / L Zinc sulfate 10g / L
[0065] Benzenesulfonic acid 100mg / L Benzotriazole 2.5g / L dodecyl mercaptan 2.5g / L Deionized water Dilute to 1L
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