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Flake alumina porous ceramic used for high-power LED lamp cooling fins, and preparation method thereof

A technology of flaky alumina and LED lamps, which is applied in the field of porous heat dissipation ceramics, can solve the problems of inhomogeneous dispersion of alumina, uneven ceramic structure, and poor compatibility, so as to reduce cracking failure problems, good transition, and improve phase capacitive effect

Inactive Publication Date: 2015-12-02
合肥凯士新材料贸易有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method cannot disperse the alumina uniformly, it is easy to agglomerate, and the ceramic structure is not uniform, and if the ceramic sheet is applied to the LED heat sink, it is necessary to improve the toughness, thermal conductivity, crack resistance, and heat resistance of the ceramic.
The compatibility between the ceramic sheet and metal is relatively poor and needs to be improved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] A sheet-shaped alumina porous ceramic for heat sinks of high-power LED lamps, made of the following raw materials in parts by weight (kg): α-Al 2 o 3 (Particle size is 2-8μm) 35, deionized water 103, sodium polyacrylate 0.3, methyl cellulose 2.2, glycerol 1.7, MgF 2 0.6, micro silicon powder 1.4, magnesium powder 0.4, nano carbon 2.5, nano indium tin oxide 0.8, nano aluminum hydroxide 4.5, nano copper 1.3, PVA binder 1.

[0016] The production method of the sheet-shaped alumina porous ceramics for the heat sink of the high-power LED lamp is characterized in that:

[0017] (1) Add α-Al 2 o 3 , deionized water, and sodium polyacrylate were mixed to obtain a suspension, and the suspension was ball-milled for 5 hours, and MgF2, micro-silica fume, and nano-carbon were added, and mixed evenly, and then PVA binder was added, mixed evenly, and then nano-aluminum hydroxide was added, Ball milling for 0.7h and standing for 50min to obtain slurry;

[0018] (2) Add methylcellu...

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PUM

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Abstract

The invention discloses a flake alumina porous ceramic used for high-power LED lamp cooling fins. The flake alumina porous ceramic is prepared from, by weight, 34 to 36 parts of alpha-Al2O3 (particle size ranging from 2 to 8<mu>m), 100 to 105 parts of deionized water, 0.2 to 0.3 part of sodium polyacrylate, 2 to 2.3 parts of methylcellulose, 1.6 to 1.8 parts of glycerin, 0.5 to 0.7 part of MgF2, 1.3 to 1.5 parts of silica fume, 0.3 to 0.4 part of magnesium powder, 2 to 3 parts of nanocarbon, 0.7 to 0.9 part of nano-indium stannum oxide, 4 to 5 parts of nano-aluminium hydroxide, 1.2 to 1.5 parts of nano-copper, and 0.9 to 1.1 parts of PVA binder. Interlayer channels of the flake alumina porous ceramic are communicated; transition performance and thermal fatigue resistance are excellent; the flake alumina porous ceramic is provided with improved heat dispersion performance and excellent recombination property with metal via adding of MgF2, silica fume, magnesium powder, nanocarbon, and nano-indium stannum oxide; the flake alumina porous ceramic is suitable for high-power LED chip heat dispersion, and service life of chips is prolonged greatly.

Description

technical field [0001] The invention relates to the field of porous heat-dissipating ceramics, in particular to a sheet-shaped alumina porous ceramic used for a heat sink of a high-power LED lamp and a preparation method thereof. Background technique [0002] Light-emitting diode (LED) is a type of light-emitting device that can directly convert electrical energy into visible light and radiant energy. It has strong market potential, and high-power LEDs are considered by the industry to be the main direction of the lighting source market1. At the current level, high-power LEDs can only convert 10% to 20% of the input power into light energy, and the remaining 80% to 90% are converted into heat energy. In order to ensure its normal operation, it is necessary to ensure that the operating temperature of the LED is within the allowable range through an effective heat dissipation design. Therefore, the heat dissipation problem of high-power LED chips has become an obstacle to the...

Claims

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Application Information

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IPC IPC(8): C04B35/10C04B38/06
Inventor 董照海
Owner 合肥凯士新材料贸易有限公司
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