Preparation method for polyimide film

A technology of polyimide film and polyamic acid glue solution is applied in the field of preparation of polyimide film, which can solve problems such as unfavorable dimensional stability, and achieves reduction of thermal expansion coefficient, no chamfering and warpage, and reduction of mean square. The effect of the radius of gyration

Active Publication Date: 2015-12-02
安徽统唯新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Polyimides with traditional structures are mainly synthesized from dibasic anhydrides and dibasic amines. The source of raw materials is wide and the synthesis is relatively easy.
There are many kinds of dianhydrides and diamines, and polyimides with different properties can be ob

Method used

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  • Preparation method for polyimide film

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] The preparation method of polyimide film, comprises the following steps:

[0022] (1) Under the condition of normal pressure filled with nitrogen in the kettle body at 45°C, first dissolve 4,4'-diaminodiphenyl ether in dimethylacetamide solvent, and then add pyromellitic dianhydride to carry out polymerization reaction , the reaction time was 4 hours, the mol ratio of pyromellitic dianhydride and 4,4'-diaminodiphenyl ether was 1:1.01, and the polyamic acid glue A with a solid content of 20wt% was obtained (stirring speed in the whole reaction process 90r / min);

[0023] (2) Under the condition of normal pressure filled with nitrogen in the kettle body at 45°C, first dissolve p-phenylenediamine in dimethylacetamide solvent, and then add 3,3',4,4'-benzophenone tetra Formic dianhydride is polymerized, the reaction time is 4.5 hours, the molar ratio of 3,3',4,4'-benzophenone tetracarboxylic dianhydride and p-phenylenediamine is 1:1.004, and the solid content is 20wt%. Poly...

Embodiment 2

[0029] The preparation method of polyimide film, comprises the following steps:

[0030] (1) Under the condition of normal pressure filled with nitrogen in the kettle body at 35°C, first dissolve 4,4'-diaminodiphenyl ether in dimethylacetamide solvent, and then add pyromellitic dianhydride to carry out polymerization reaction , the reaction time was 4 hours, the mol ratio of pyromellitic dianhydride and 4,4'-diaminodiphenyl ether was 1:1.007, and the polyamic acid glue A with a solid content of 17% was obtained (stirring speed in the whole reaction process 90r / min);

[0031] (2) Under the condition of normal pressure filled with nitrogen in the kettle body at 55°C, first dissolve p-phenylenediamine in dimethylacetamide solvent, and then add 3,3',4,4'-benzophenone tetra Formic dianhydride is polymerized, the reaction time is 4.5 hours, the molar ratio of 3,3',4,4'-benzophenone tetracarboxylic dianhydride to p-phenylenediamine is 1.007, and a polyamide with a solid content of 2...

Embodiment 3

[0037] The preparation method of polyimide film, comprises the following steps:

[0038](1) Under the condition of normal pressure filled with nitrogen in the kettle body at 55°C, first dissolve 4,4'-diaminodiphenyl ether in dimethylacetamide solvent, and then add pyromellitic dianhydride to carry out polymerization reaction , the reaction time was 4 hours, the mol ratio of pyromellitic dianhydride and 4,4'-diaminodiphenyl ether was 1.013, and the polyamic acid glue A with a solid content of 23wt% was obtained (the stirring speed of the whole reaction process was 90r / min);

[0039] (2) Under the condition of normal pressure filled with nitrogen in the kettle body at 35°C, first dissolve p-phenylenediamine in dimethylacetamide solvent, and then add 3,3',4,4'-benzophenone tetra Formic dianhydride is polymerized, the reaction time is 4.5 hours, the molar ratio of 3,3',4,4'-benzophenone tetracarboxylic dianhydride and p-phenylenediamine is 1:1.001, and the solid content is 17wt%...

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Abstract

The invention relates to a preparation method for a polyimide film. The preparation method comprises the following steps that step 1, pyromellitic dianhydride and 4, 4'-diaminodiphenyl ether are placed in dimethylacetamide solvent for polymerization reaction, so that polyamide acid gel A is obtained; step 2, 3,3',4,4'-diphenyl ketone tetracarboxylic acid dianhydride and ursol are placed in dimethylacetamide solvent for polymerization reaction, so that polyamide acid gel B is obtained; step 3, the polyamide acid gel A and the polyamide acid gel B are mixed; step 4, ultrafine nano-montmorillonite powder dispersion liquid is prepared; step 5, the ultrafine nano-montmorillonite powder dispersion liquid is fully dispersed in polybasic polyamide acid gel, so that composite polyamide acid gel is obtained; step 6, the composite polyamide acid gel is made into a film through the tape casting technology, and finally the film is fed into an imidization furnace to be treated, so that the polyimide film is obtained. The polyimide film prepared through the preparation method has the performance advantages of low thermal expansivity, high strength, high stability, high electric strength and the like.

Description

technical field [0001] The invention relates to a preparation method of a polyimide film. Background technique [0002] Polyimide refers to a class of polymers containing imide rings (-CO-NH-CO-) in the main chain. It is one of the organic polymer materials with the best comprehensive performance and has been widely used in aviation and aerospace. , microelectronics, nanometer, liquid crystal, separation membrane, laser and other fields. When polyimide is used as a base film on a flexible circuit board, the dimensional stability of the film is highly required, so the coefficient of thermal expansion (CTE) is an important parameter to investigate the dimensional stability of the film. [0003] Polyimides with traditional structures are mainly synthesized from dibasic anhydrides and dibasic amines, with wide sources of raw materials and relatively easy synthesis. There are many kinds of dianhydrides and diamines, and different combinations can obtain polyimides with differen...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08K3/34C08G73/10
Inventor 王超
Owner 安徽统唯新材料科技股份有限公司
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