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Preparation method of polyimide film

A technology of polyimide film and polyamic acid glue, which is applied in the field of preparation of polyimide film, can solve the problems of unfavorable size stability, etc., and achieve the effects of reducing thermal expansion coefficient, high electrical strength, and not easy to crack

Active Publication Date: 2017-11-07
安徽统唯新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Polyimides with traditional structures are mainly synthesized from dibasic anhydrides and dibasic amines. The source of raw materials is wide and the synthesis is relatively easy.
There are many kinds of dianhydrides and diamines, and polyimides with different properties can be obtained by different combinations. The CTE of polyimide films with traditional structures generally ranges from 40 to 65ppm / K. Compared with copper foil and silicon wafers, the CTE CTE16~17ppm / K is too high, which is not conducive to the dimensional stability of the laminated copper foil

Method used

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  • Preparation method of polyimide film

Examples

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Effect test

Embodiment 1

[0021] The preparation method of polyimide film, comprises the following steps:

[0022] (1) Under the condition of normal pressure filled with nitrogen in the kettle body at 45°C, first dissolve 4,4'-diaminodiphenyl ether in dimethylacetamide solvent, and then add pyromellitic dianhydride to carry out polymerization reaction , the reaction time was 4 hours, the mol ratio of pyromellitic dianhydride and 4,4'-diaminodiphenyl ether was 1:1.01, and the polyamic acid glue A with a solid content of 20wt% was obtained (stirring speed in the whole reaction process 90r / min);

[0023] (2) Under the condition of normal pressure filled with nitrogen in the kettle body at 45°C, first dissolve p-phenylenediamine in dimethylacetamide solvent, and then add 3,3',4,4'-benzophenone tetra Formic dianhydride is polymerized, the reaction time is 4.5 hours, the molar ratio of 3,3',4,4'-benzophenone tetracarboxylic dianhydride and p-phenylenediamine is 1:1.004, and the solid content is 20wt%. Poly...

Embodiment 2

[0029] The preparation method of polyimide film, comprises the following steps:

[0030] (1) Under the condition of normal pressure filled with nitrogen in the kettle body at 35°C, first dissolve 4,4'-diaminodiphenyl ether in dimethylacetamide solvent, and then add pyromellitic dianhydride to carry out polymerization reaction , the reaction time was 4 hours, the mol ratio of pyromellitic dianhydride and 4,4'-diaminodiphenyl ether was 1:1.007, and the polyamic acid glue A with a solid content of 17% was obtained (stirring speed in the whole reaction process 90r / min);

[0031] (2) Under the condition of normal pressure filled with nitrogen in the kettle body at 55°C, first dissolve p-phenylenediamine in dimethylacetamide solvent, and then add 3,3',4,4'-benzophenone tetra Formic dianhydride is polymerized, the reaction time is 4.5 hours, the molar ratio of 3,3',4,4'-benzophenone tetracarboxylic dianhydride to p-phenylenediamine is 1.007, and a polyamide with a solid content of 2...

Embodiment 3

[0037] The preparation method of polyimide film, comprises the following steps:

[0038](1) Under the condition of normal pressure filled with nitrogen in the kettle body at 55°C, first dissolve 4,4'-diaminodiphenyl ether in dimethylacetamide solvent, and then add pyromellitic dianhydride to carry out polymerization reaction , the reaction time was 4 hours, the mol ratio of pyromellitic dianhydride and 4,4'-diaminodiphenyl ether was 1.013, and the polyamic acid glue A with a solid content of 23wt% was obtained (the stirring speed of the whole reaction process was 90r / min);

[0039] (2) Under the condition of normal pressure filled with nitrogen in the kettle body at 35°C, first dissolve p-phenylenediamine in dimethylacetamide solvent, and then add 3,3',4,4'-benzophenone tetra Formic dianhydride is polymerized, the reaction time is 4.5 hours, the molar ratio of 3,3',4,4'-benzophenone tetracarboxylic dianhydride and p-phenylenediamine is 1:1.001, and the solid content is 17wt%...

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Abstract

The preparation method of the polyimide film of the present invention comprises the following steps: (1) placing pyromellitic dianhydride and 4,4'-diaminodiphenyl ether in a dimethylacetamide solvent for polymerization reaction to obtain Polyamic acid glue A; (2) 3,3',4,4'-benzophenone tetracarboxylic dianhydride and p-phenylenediamine are placed in dimethylacetamide solvent for polymerization reaction to obtain polyamide Acid glue B; (3) mixing polyamic acid glue A and polyamic acid glue B; (4) preparing nano-montmorillonite ultrafine powder dispersion; (5) mixing nano-montmorillonite ultrafine powder The body dispersion is fully dispersed in the multi-component polyamic acid glue to obtain the polyamic acid composite glue; (6) the polyamic acid composite glue is made into a film through the salivation molding process, and finally the film is sent into the imidization furnace After processing, the polyimide film is obtained. The polyimide film prepared by the invention has performance advantages such as low coefficient of thermal expansion, high strength, high stability and high electric strength.

Description

technical field [0001] The invention relates to a preparation method of a polyimide film. Background technique [0002] Polyimide refers to a class of polymers containing imide rings (-CO-NH-CO-) in the main chain. It is one of the organic polymer materials with the best comprehensive performance and has been widely used in aviation and aerospace. , microelectronics, nanometer, liquid crystal, separation membrane, laser and other fields. When polyimide is used as a base film on a flexible circuit board, the dimensional stability of the film is highly required, so the coefficient of thermal expansion (CTE) is an important parameter to investigate the dimensional stability of the film. [0003] Polyimides with traditional structures are mainly synthesized from dibasic anhydrides and dibasic amines, with wide sources of raw materials and relatively easy synthesis. There are many kinds of dianhydrides and diamines, and different combinations can obtain polyimides with differen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08L79/08C08K3/34C08G73/10
Inventor 王超
Owner 安徽统唯新材料科技股份有限公司
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