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A kind of mechanical copper plating and copper alloy process

A copper alloy and mechanical plating technology, applied in electrolysis process, electrolysis components, etc., can solve problems such as unsuitability and easy oxidation of metal copper, and achieve the effects of convenient operation, stable deposition speed and simple process flow

Active Publication Date: 2017-12-01
KUNMING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main layered material used in mechanical copper plating and copper alloy is copper powder or copper alloy powder. Compared with zinc and zinc alloy powder, metallic copper is easy to oxidize, and the standard electrode potential of metallic copper is much more positive than metallic zinc. The surface state of zinc powder and zinc powder in the acidic solution is also different, so the conventional mechanical galvanizing process is not suitable for mechanical copper and copper alloy plating from the perspective of mechanism.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] In the mechanical copper plating and copper alloy process described in this embodiment, the workpiece to be plated is 100 kg of steel flat gaskets with a thickness of Ф20 and a thickness of 3 mm, the surface area to be plated is 9.5 m2, and the thickness of the coating to be plated is 10 microns, specifically including the following steps:

[0024] (1) Pre-treatment: Steel gaskets are degreased, rinsed, derusted, and rinsed in sequence to obtain steel parts with clean surfaces; Hydrochloric acid pickling method to remove the rust products on the surface of the gasket, rinse with running water;

[0025] (2) Put the steel gasket, medium (Ф2~3), water, into the plating cylinder of general mechanical plating equipment, add 400 mL phosphoric acid to the plating cylinder to adjust the pH value of the plating solution to 3, and then add 807.5 g of red copper powder, then add 465 mL deposition accelerator aqueous solution to the plating cylinder, and rotate the plating cylinder...

Embodiment 2

[0030] In the mechanical copper plating and copper alloy process described in this embodiment, the workpiece to be plated is 100 kg of steel flat gaskets with a thickness of Ф16 and 2 mm, the surface area to be plated is 14 square meters, and the thickness of the coating to be plated is 10 microns, specifically including the following steps:

[0031] (1) Pre-treatment: Steel flat gaskets are degreased, rinsed, derusted, and rinsed in sequence to obtain steel parts with clean surfaces; this embodiment adopts oxidation method to remove all kinds of grease and dirt on the surface of steel flat gaskets , use hydrochloric acid pickling method to remove the rust products on the surface of the gasket, and use running water to rinse;

[0032] (2) Put the iron and steel parts, medium (Ф2~3), water, into the plating cylinder of general mechanical plating equipment, add 450 mL citric acid to adjust the pH value of the plating solution to 5, then add 1190g brass powder, and then Add 300 m...

Embodiment 3

[0037] In the mechanical copper plating and copper alloy process described in this embodiment, the workpiece to be plated is 100 kg of steel nails with a length of Ф2.5 mm and a length of 50 mm, the surface area to be plated is 22.5 m2, and the thickness of the coating to be plated is 20 microns, specifically including the following steps:

[0038] (1) Pre-treatment: steel nails are degreased, rinsed, derusted, and rinsed in sequence to obtain steel nails with clean surfaces; in this embodiment, ultrasonic cleaning is used to remove all kinds of grease and dirt on the surface of steel nails, and hydrochloric acid pickling is used Remove the rust products on the surface of the gasket with running water for rinsing;

[0039](2) Put steel nails, medium (Ф0.5~1), water, into the plating drum of general-purpose mechanical plating equipment, add 600 mL of phosphoric acid to adjust the pH of the plating solution to 1, then add 1912.5 g of copper powder, and then Add 400 mL deposition...

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Abstract

The invention discloses a mechanical copper plating and copper alloy process, which belongs to the technical field of surface plating of iron and steel parts. The mechanical copper plating and copper alloy process of the present invention is by means of general mechanical plating equipment, by adjusting the pH value of plating solution, then adding copper powder or copper alloy powder and deposition accelerator in plating solution, along with the plating of mechanical plating equipment The drum is rotated to finally prepare a copper layer or a copper alloy layer on the surface of the steel part. The deposition accelerator used in the process of the present invention for copper plating consists of diatomaceous earth, sodium gluconate, triethanolamine, stannous salt, ammonium dihydrogen phosphate, polyethylene glycol, OP-10, phosphoric acid, and an appropriate amount of water. By adopting the mechanical copper plating and copper alloy process of the present invention, rapid deposition of copper or copper alloy powder on the surface of steel parts can be realized, the process is simple, the operation is convenient, and the double effect of anticorrosion and decoration of steel parts can be achieved.

Description

technical field [0001] The invention relates to a mechanical copper and copper alloy plating process, which belongs to the technical field of surface plating of iron and steel materials and is used for preparing copper and copper alloy plating on the surface of iron and steel parts. Background technique [0002] In recent years, with the increasing pressure of environmental protection, the traditional copper electroplating process has been shut down, shut down, and adjusted for a time; while the demand for copper plating process in the fields of electronics, electrical appliances, and decorative-protective hardware has continued unabated, which has given mechanical The development of copper plating provides a good opportunity. However, in the field of mechanical plating, there is no mature mechanical copper plating process used in production practice. Literature search shows that there is little research on mechanical copper plating process in the field of surface protection...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/16C25D3/38
Inventor 王胜民赵晓军李继锋谭蓉王玉光申国成
Owner KUNMING UNIV OF SCI & TECH
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