Method for preparing efficient ingot polycrystalline silicon and special monocrystalline silicon wafer
A technology for monocrystalline silicon wafers and polycrystalline silicon ingots is applied in the field of solar cells, which can solve the problems of lower qualification rate of crystal ingots, impurity pollution, small output, etc., and achieve the effect of improving cell efficiency.
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Embodiment 1
[0021] The method for preparing high-efficiency cast polycrystalline silicon ingots of the present invention comprises the following steps:
[0022] S1: For monocrystalline silicon wafers with a thickness of 0.18 mm, perform de-cleaning treatment to remove oil, metal impurities, organic pollutants and other impurities on the surface of single crystal silicon wafers;
[0023] S2: Brush a layer of silicon oxide on the upper and lower surfaces of the single crystal silicon wafer, with a thickness of 0.1-0.2mm;
[0024] S3: Brush the silicon nitrogen layer on the surface of the silicon oxide layer respectively, the thickness of each layer is 0.2-0.3mm;
[0025] S4: place on a heating table to dry, the temperature is controlled at 80-100oC, and the time is controlled at 5-10min;
[0026] S5: putting the monocrystalline silicon wafer processed in step S4 into the bottom of the polycrystalline ingot casting furnace, and casting an ingot by a common process to obtain a small-grain in...
Embodiment 2
[0028] like figure 1 As shown, another aspect of the present invention also discloses a monocrystalline silicon wafer dedicated to the preparation of high-efficiency ingot polycrystalline silicon, including a silicon wafer body 1, and silicon oxygen Layer 2 and silicon nitride layer 3, the thickness of the silicon chip body is 0.18 mm, the thickness of the silicon oxide layer 2 is 0.1-0.2 mm, and the thickness of the silicon nitride layer 3 is 0.2-0.3 mm.
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