Dispersed copper composite material and preparation method thereof

A technology of composite materials and dispersed copper, which is applied in the field of preparation of dispersed copper composite materials and dispersed copper composite materials, which can solve the problems of many processes, difficult control of the production process, and the need to improve the strength and conductivity.

Inactive Publication Date: 2015-12-09
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the traditional internal oxidation method to prepare Cu-Al 2 o 3 There are still many problems in composite materials: (1) There are many processes, long cycle time, high production cost, and it is impossible to manufacture parts with large sizes and complex shapes; (2) There are too many influencing factors, the production process is difficult to contro

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] The dispersed copper composite material in this embodiment consists of the following components in mass percentage: Al 2 o 3 0.24%, Y 2 o 3 0.16%, the balance is Cu and unavoidable impurities.

[0041] The powder used to prepare dispersed copper composite materials consists of the following components in mass percentage: 1.58% Cu 2 O powder, the balance is Cu-Al-Y alloy powder; Al and Y account for 0.25% of the mass of Cu-Al-Y alloy powder, and the mass percentage of Al and Y is 50%:50%. Cu 2 The particle size of the O powder is -325 mesh+400 mesh, the purity is ≥99.0%, and it is commercially available.

[0042] The preparation method of dispersed copper composite material comprises the following steps:

[0043] (1) Preparation of Cu-Al-Y alloy powder

[0044] Take the following raw materials: standard cathode copper Cu-CATH-2, Cu content ≥ 99.95wt%; aluminum ingot Al99.70 for remelting, Al content ≥ 99.70wt%; rare earth metal yttrium Y-1, Y content > 99.5%; The...

Embodiment 2

[0057] The dispersed copper composite material in this example is composed of the following components in mass percentage: Al 2 o 3 1.02%, Y 2 o 3 0.076%, the balance is Cu and unavoidable impurities.

[0058] The powder used to prepare the dispersed copper composite material is composed of the following components in mass percentage: 5.33% Cu 2 O powder, the balance is Cu-Al-Y alloy powder; Al and Y account for 0.60% of the mass of Cu-Al-Y alloy powder, and the mass percentage of Al and Y is 90%:10%. Cu 2 The particle size of the O powder is -325 mesh+400 mesh, the purity is ≥99.0%, and it is commercially available.

[0059] The preparation method of dispersed copper composite material comprises the following steps:

[0060] (1) Preparation of Cu-Al-Y alloy powder

[0061] Take the following raw materials: standard cathode copper Cu-CATH-2, Cu content ≥ 99.95wt%; aluminum ingot Al99.70 for remelting, Al content ≥ 99.70wt%; rare earth metal yttrium Y-1, Y content > 99.5...

Embodiment 3

[0074] The dispersed copper composite material in this example is composed of the following components in mass percentage: Al 2 o 3 3.74%, Y 2 o 3 0.03%, the balance is Cu and unavoidable impurities.

[0075] The powder used to prepare dispersed copper composite materials consists of the following components in mass percentage: 18.96% Cu 2 O powder, the balance is Cu-Al-Y alloy powder; Al and Y account for 2.0% of the mass of Cu-Al-Y alloy powder, and the mass percentage of Al and Y is 98%:2%. Cu 2 The particle size of the O powder is -325 mesh+400 mesh, the purity is ≥99.0%, and it is commercially available.

[0076] The preparation method of dispersed copper composite material comprises the following steps:

[0077] (1) Preparation of Cu-Al-Y alloy powder

[0078] Take the following raw materials: standard cathode copper Cu-CATH-2, Cu content ≥ 99.95wt%; aluminum ingot Al99.70 for remelting, Al content ≥ 99.70wt%; rare earth metal yttrium Y-1, Y content > 99.5%; The ...

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Abstract

The invention discloses a dispersed copper composite material and a preparation method thereof, belonging to the technical field of dispersed copper processing. The dispersed copper composite material is composed of the following components in percentage by mass: 0.24-3.74% of Al2O3, 0.03-1.27% of Y2O3 and the balance of Cu and unavoidable impurities. The dispersed copper composite material is prepared from Cu2O powder and Cu-Al-Y alloy powder through the steps of mixing, pressing, sintering and internal oxidation, extruding and forging; the composite material has the high strength of 500Pa or above and the high conductivity of 80% IACS or above and overcomes the defect that the high strength and high conductivity of other composite materials cannot simultaneously exist; and meanwhile the composite material is favorable in softening resistance, high in high-temperature strength and good in plasticity, and the softening temperature is 800 DEG C or higher.

Description

technical field [0001] The invention relates to a dispersed copper composite material, and also relates to a preparation method of the dispersed copper composite material, which belongs to the technical field of dispersed copper processing. Background technique [0002] Al as a dispersed phase 2 o 3 Cu-Al 2 o 3 The contribution of composite material strength is mainly manifested in the following aspects (1) Al 2 o 3 Particle pinning dislocations, under certain conditions, act as dislocation sources and increase dislocation density; (2) Al 2 o 3 The existence of particles hinders the movement of dislocations and subgrain boundaries, thereby hindering the formation of recrystallization nuclei and grain growth; (3) Al 2 o 3 The presence of particles can inhibit the progress of static and dynamic recrystallization. Therefore, Cu-Al 2 o 3 Composite materials have the advantages of high thermal conductivity, high electrical conductivity, excellent high-temperature stren...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C32/00C22C1/05
Inventor 田保红张毅李武会龙永强李红霞任凤章贾淑果刘勇宋克兴李全安
Owner HENAN UNIV OF SCI & TECH
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