A kind of preparation method of tin-based silver graphene lead-free composite solder

一种复合钎料、银石墨的技术，应用在制造工具、焊接设备、金属加工设备等方向，能够解决金属基体结合强度差、难以均匀分布等问题，达到提高载荷传递、细化晶粒、提高粉末活性的效果
CN105171277BInactive Publication Date: 2017-07-07TIANJIN UNIV
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TIANJIN UNIV
Publication Date
2017-07-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a preparation method of tin-based silver graphene lead-free composite solder, which comprises mixing a certain amount of graphene with sodium lauryl sulfate, then adding a certain amount of dimethylformamide, and ultrasonically treating it for 2 hour, then add a certain amount of silver nitrate to the mixed solution, continue ultrasonic treatment, and finally get homemade silver graphene nanosheets; weigh the required solder matrix powder according to different silver graphene mass fractions, pour it into a ball mill jar and mill for 5 hours , put the powder into a stainless steel mold after drying, put it under a hydraulic press and press it at a pressure of 500Mpa, then put the cold-pressed cylinder into a high-vacuum tubular resistance furnace for vacuum sintering at 175°C for 2 hours, and cool to room temperature After that, it is punched into a cylinder under the hydraulic press. The present invention selects the graphene modified by Ag particles as the reinforcement material to improve the load transfer between the graphene modified by nano-silver and the Sn matrix, so as to achieve a better strengthening effect.
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Description

technical field

[0001] The invention relates to the preparation of composite solder, which is a method for preparing composite solder by adding silver graphene nanosheets to traditional 96.5Sn-3.0Ag-0.5Cu solder and using a ball milling process. Background technique

[0002] For a long time, tin-lead alloy solder has been widely used in the electronics industry. Its brazing joints are an indispensable key part of electronic devices. They serve as interconnect materials to provide mechanical support between circuit devices, circuit conduction and heat transfer channels. , but lead is potentially harmful to human health and the natural environment. In addition, with the development of microelectronics technology, electronic products are developing in the direction of miniaturization and portability, which makes the brazing joints of electronic packages more and more dense, while the calorific value per unit volume of electronic products is increasing. The service temperature ...

Claims

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