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A kind of preparation method of tin-based silver graphene lead-free composite solder

一种复合钎料、银石墨的技术，应用在制造工具、焊接设备、金属加工设备等方向，能够解决金属基体结合强度差、难以均匀分布等问题，达到提高载荷传递、细化晶粒、提高粉末活性的效果

Inactive Publication Date: 2017-07-07
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to improve the problems that the graphene-enhanced Sn-based solder exists in the matrix that is difficult to uniformly distribute and has poor bonding strength with the metal matrix, the present invention selects Ag particle-modified graphene as the reinforcing material to improve the bonding of nano-silver-modified graphene and Load transfer between Sn matrix for better strengthening effect

Method used

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  • A kind of preparation method of tin-based silver graphene lead-free composite solder
  • A kind of preparation method of tin-based silver graphene lead-free composite solder
  • A kind of preparation method of tin-based silver graphene lead-free composite solder

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Embodiment 1

[0024] Embodiment 1, prepare tin-based silver graphene lead-free composite solder, the steps are as follows:

[0025] (1) take by weighing 30mg graphene with electronic balance, 10mg sodium lauryl sulfate, then mix it, measure the dimethylformamide of 40ml with graduated cylinder, mix the SDS (10mg) of 30mg graphene and 10mg Sodium dialkylsulfate) was added to 40ml of DMF (dimethylformamide), and sonicated for 2 hours.

[0026] (2) Measure the silver nitrate solution that 20ml molar concentration is 0.06mol / ml with graduated cylinder again, add the mixed solution that step (1) makes to it, ultrasonic treatment 30 minutes, graphene is obtained better modification, then in After heating at 70°C for 1 hour, filter, wash with water and then with alcohol to obtain silver graphene nanosheets (AG-GNSs).

[0027] (3) Then weigh a certain amount of 96.5Sn-3.0Ag-0.5Cu alloy powder and mix it with silver graphene nano-silver sheets (AG-GNSs) prepared in step (2) (using 96.5Sn-3.0Ag-0.5C...

Embodiment 2

[0032] Embodiment 2, preparation tin-based silver graphene lead-free composite solder, step is basically the same as embodiment 1, and its difference is only in:

[0033] Step 3: when mixing 96.5Sn-3.0Ag-0.5Cu alloy powder with silver graphene nano-silver sheets (AG-GNSs), the mass fraction of silver-graphene nano-sheets in the mixed powder is 0.05%.

Embodiment 3

[0034] Embodiment 3, preparation tin-based silver graphene lead-free composite solder, step is basically the same as embodiment 1, and its difference is only in:

[0035] Step 3: when mixing 96.5Sn-3.0Ag-0.5Cu alloy powder with silver graphene nano-silver sheets (AG-GNSs), the mass fraction of silver-graphene nano-sheets in the mixed powder is 0.1%.

[0036] figure 1 For prior art Sn-Ag-Cu lead-free solder and embodiment 1, embodiment 2, embodiment 3 strengthen the comparative schematic diagram of the wetting angle of lead-free solder by silver graphene nanosheet, by figure 1 It can be seen that with the increase of the mass fraction of silver graphene nanosheets, the wetting angle also gradually decreases, from 40° when no addition to 22° in Example 3.

[0037] figure 2 It is a schematic diagram comparing the tensile strength value of the Sn-Ag-Cu lead-free solder of the prior art and the tensile strength value of the lead-free solder enhanced by silver graphene nanosheets...

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Abstract

The invention discloses a preparation method of tin-based silver graphene lead-free composite solder, which comprises mixing a certain amount of graphene with sodium lauryl sulfate, then adding a certain amount of dimethylformamide, and ultrasonically treating it for 2 hour, then add a certain amount of silver nitrate to the mixed solution, continue ultrasonic treatment, and finally get homemade silver graphene nanosheets; weigh the required solder matrix powder according to different silver graphene mass fractions, pour it into a ball mill jar and mill for 5 hours , put the powder into a stainless steel mold after drying, put it under a hydraulic press and press it at a pressure of 500Mpa, then put the cold-pressed cylinder into a high-vacuum tubular resistance furnace for vacuum sintering at 175°C for 2 hours, and cool to room temperature After that, it is punched into a cylinder under the hydraulic press. The present invention selects the graphene modified by Ag particles as the reinforcement material to improve the load transfer between the graphene modified by nano-silver and the Sn matrix, so as to achieve a better strengthening effect.

Description

technical field [0001] The invention relates to the preparation of composite solder, which is a method for preparing composite solder by adding silver graphene nanosheets to traditional 96.5Sn-3.0Ag-0.5Cu solder and using a ball milling process. Background technique [0002] For a long time, tin-lead alloy solder has been widely used in the electronics industry. Its brazing joints are an indispensable key part of electronic devices. They serve as interconnect materials to provide mechanical support between circuit devices, circuit conduction and heat transfer channels. , but lead is potentially harmful to human health and the natural environment. In addition, with the development of microelectronics technology, electronic products are developing in the direction of miniaturization and portability, which makes the brazing joints of electronic packages more and more dense, while the calorific value per unit volume of electronic products is increasing. The service temperature ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/40B23K35/26B22F1/05
CPCB23K35/0227B23K35/262B23K35/40B22F1/05B23K35/3601B23K35/0244C22C47/14C22C49/02C22C49/14B22F2998/10B22F2999/00C22C13/00C22C1/05B22F2009/043B22F3/02B22F3/10B22F2201/20B22F2201/11B23K35/26B22F9/04B22F2301/30B22F2304/10
Inventor 荆洪阳刘暾徐连勇韩永典王丽霞
Owner TIANJIN UNIV
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