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A kind of preparation method of cu-ni-sn copper alloy strip

A copper alloy plate, cu-ni-sn technology, applied in the field of copper alloy, can solve the problem that the tensile strength, yield strength and hardness of copper alloy cannot meet the requirements of production standards, so as to improve the melting and casting process, increase the strength and reduce the number of products The effect of stomata

Active Publication Date: 2017-11-14
山西春雷铜材有限责任公司
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Problems solved by technology

[0004] In order to solve the technical problem that the final tensile strength, yield strength and hardness of copper alloys for lead frames cannot meet the requirements of production standards, the present invention provides a method for preparing Cu-Ni-Sn copper alloy (TKA) strips

Method used

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  • A kind of preparation method of cu-ni-sn copper alloy strip
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Embodiment Construction

[0021] The preparation method of TKA copper alloy strip, comprises the steps:

[0022] (1) According to the effective volume of the power frequency cored induction furnace, the mass ratio is copper: tin: nickel: phosphorus: zinc = 97.43: 1.5: 0.8: 0.07: 0.2 for batching; copper, tin, nickel, phosphor copper Put the intermediate alloy and zinc into the furnace body of the power frequency cored induction furnace and heat it to 1170-1210°C (1170°C, 1190°C, 1210°C) for melting, and then cover the surface of the melt with a layer of calcined charcoal with a thickness of 150-200mm , keep warm for 30 minutes, and then fully stir to obtain smelting water (smelting water is also called copper water);

[0023] (2) Use a crystallizer with a graphite inner sleeve to carry out the above-mentioned copper water at a temperature of 1170°C-1210°C (1170°C, 1190°C, 1210°C), and a casting speed of 2.4-3.0 m / h (2.4 m / h, 2.7 m / h, 3.0 m / h) semi-continuous casting process to obtain a rectangular ing...

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Abstract

The invention relates to the field of copper alloys, in particular to a method for preparing Cu-Ni-Sn copper alloy strips. The technical problem that the ultimate tensile strength, yield strength and hardness of the existing copper alloy used for the lead frame cannot meet the requirements of the production standard is solved. The present invention uses the theories of solid solution strengthening, precipitation strengthening and work hardening. The hot-rolling solid solution treatment utilizes the higher solubility of solute atoms at high temperature, and exists in the base copper in the form of solid solution. After rapid cooling, the solute elements have no time to precipitate and form a supersaturated solid solution; during the precipitation strengthening process, Ni and Sn atoms The solubility in copper drops sharply, precipitates from the matrix, and the matrix is ​​depleted; during the cold rolling process, the copper alloy strip produces plastic deformation, the grains slip, and dislocation entanglement occurs, which makes the grains elongated, broken and fibrosis. The requirements of high strength, high yield and high hardness are realized, thereby improving the ultimate tensile strength, yield strength and hardness of TKA copper alloy strip.

Description

technical field [0001] The invention relates to the field of copper alloys, in particular to a method for preparing Cu-Ni-Sn copper alloy strips. Background technique [0002] With the rapid development of science and technology, the requirements for the tensile strength, yield strength and hardness of the copper alloy materials used in the lead frames of electronic chips are getting higher and higher. The tensile strength of the ideal copper alloys for lead frames is currently desired Rm is 530-640MPa, yield strength Rp0.2≥520MPa, elongation after fracture A11.3≥6%, Vickers hardness HV is 160-195 (Vickers hardness value, no unit), and HV≥140 after softening. [0003] At present, the main materials used for lead frames in China are Cu-Fe-P alloys (C19400, C19210) and Cu-Ni-Si alloys (C70250). The existing problems of copper alloys for lead frames are: 1. The tensile strength of the existing Cu-Fe-P alloys (C19400, C19210) is 420-500 MPa, which cannot meet the technical requ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/02C22C1/03C22F1/08
Inventor 李辉张晓敏王全仁张淑琴李大伟张美霞卫志强宁笃功卫煜堂陈婷
Owner 山西春雷铜材有限责任公司
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