Waste circuit board element removing system and process

Abstract

The embodiment of the invention discloses a waste circuit board element removing system. The waste circuit board element removing system comprises a material conveying device, a reflow soldering heating device, a vibration sieve and a waste gas collecting device. The material conveying device is used for conveying a waste circuit board and passes through the reflow soldering heating device. The vibration sieve comprises a vibration driving mechanism and a plurality of layers of sieve nets driven by the vibration driving machine. The waste gas collecting device comprises a housing covering the reflow soldering heating device and the vibration sieve inside and a waste gas processing device used for collecting and processing waste gas inside the housing. In this way, by means of the waste circuit board element removing system, the problems of unstable heating temperature and heavy workloads of separation in the later period can be avoided on the basis of avoiding air pollution and preventing damages to elements. The invention further provides a waste circuit board element removing process based on the waste circuit board element removing system.

Description

technical field [0001] The invention relates to the technical field of recycling and processing of waste circuit boards, and more specifically relates to a system and process for removing components of waste circuit boards. Background technique [0002] With the continuous upgrading of mobile phones in recent years, more and more old mobile phones have been eliminated. If they are not disposed of effectively, the waste circuit boards in mobile phones will have a serious adverse impact on the environment. Valuable metals and valuable components will also be wasted. [0003] In the recycling process of metal components of circuit boards in the prior art, tin pots or hot air rollers are usually used to heat and remove components, and then the bare circuit boards are crushed and sorted to extract metals such as copper, nickel, and gold. [0004] However, these methods of removing components have the following problems: [0005] The use of tin pot to remove the components of th...

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Problems solved by technology

[0008] However, the box-type heat source adopts intermittent heating, so the temperature in the heating chamber is unstable and fluctuates up and down. At the same time, the components, card slots, capacitors and resistors that have been taken off are mixed together, which brings great trouble to the later sorting

[0009] Therefore, on the basis of avoiding air pollution and preventing damage to components, how to avoid the problems of unstable heating temperature and large sorting workload in the later stage has become an important technical problem to be solved by those skilled in the art.

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