A preparation method of bismaleimide resin prepolymerization system for liquid molding technology

Abstract

The invention discloses a method for preparing a bismaleimide resin prepolymerization system used in liquid molding technology. The method comprises: step ①: adding bismaleimide to The monomer and the active solvent are stirred and mixed at 100~145°C until a clear and transparent mixed system is obtained; wherein, the active solvent is acryloyl chloride, acryloyl oxazolidinone, acryloyl morpholine, 2,-amino-1 ,1,3-tricyano-1-propene, 9-anthracene methacrylate, m-bromostyrene, p-bromostyrene, etc. The patent of the present invention has a unique approach. The selected active solvent will not cause gel phenomenon in the process of dissolving BMI, and form a stable prepolymer under a certain temperature condition, which can be stored at room temperature for a long time without delamination. Has great commercial value. Further, the present invention can conveniently adjust the viscosity of the resin by adjusting the amount of the active solvent, and the active solvent used in the present invention is relatively low in price and has broad market application prospects.

Description

technical field [0001] The invention relates to a liquid phase molding resin material, in particular to a preparation method of a bismaleimide resin prepolymerization system used in liquid molding technology. Background technique [0002] Bismaleimide resin is one of the important varieties of high-performance advanced composite material matrix resin, and is also an important reactive polyimide, with good high temperature resistance, heat and humidity resistance, mechanical properties, chemical corrosion resistance and other characteristics . At the same time, it does not release low-molecular substances when it is cured, and it can produce a good "synergistic effect" when used in conjunction with other high-performance resins, so it is widely used in advanced manufacturing fields such as aerospace, energy transportation, electronic communications, and medical equipment. [0003] However, the common bismaleimide resin monomer has a high melting point (up to 155-159°C) due t...

AI Technical Summary

Problems solved by technology

The strong polar solvents used in the former generally have a higher boiling point, and are not easy to be completely removed during the curing stage, which is likely to cause defects in the product, and these solvents have been gradually eliminated due to their high toxicity and serious environmental pollution. The main process used in maleimide resin

However, this process can only be cured through the "ene" and "Diels-Alder" reactions, and has defects such as high curing temperature (up to 250°C), long reaction time, and high energy consumption.

[0004] Due to the characteristics of high melting point, insoluble and high activity of bismaleimide, people have done a lot of work on the selection of active solvents for bismaleimide resins. Commonly used active solvents with unsaturated double bonds For example, styrene, acrylates, vinyl ethers, etc. cannot achieve good dissolution of bismaleimide resin and obtain suitable reaction conditions due to poor solubility or poor reactivity, that is, cannot produce appropriate processing technology window, thereby also making it impossible to process

The existing method to solve this problem is to modify the bismaleimide resin to form a low melting point eutectic, but this modified resin will have an adverse effect on the performance of the cured and molded material, including Reduce the glass transition temperature to reduce heat resistance, reduce the mechanical properties of materials, etc.