Nano molybdenum disilicide-enhanced high-thermal-conductivity silicon carbide-based ceramic circuit board substrate material and preparation method thereof

Abstract

The invention discloses a nano molybdenum disilicide-enhanced high-thermal-conductivity silicon carbide-based ceramic circuit board substrate material. According to a silicon carbide-based ceramic circuit board substrate, micron-sized silicon carbide powder and nano-sized aluminum oxide powder are compounded for use, so that a blank body is higher in density and better in sintering stability. The sintering temperature can be effectively decreased through added pyrophyllite. Nano molybdenum disilicide has the good reinforcement and toughening effect, can promote the thermal conductivity and does not damage the insulativity of the substrate. A polyethylene glycol complex solvent containing nano-ceramic powder transparent liquid has the high wettability and bonding capability for powder, the various materials can be evenly scattered and coated to form the blank body of a uniform structure, and the composite ceramic substrate with the high density, strength and thermal conductivity can be obtained at the relatively low temperature. The production process is safe and environmentally friendly, and the application potential is great.

Description

technical field [0001] The invention relates to the technical field of preparation of silicon carbide ceramics, in particular to a nanomolybdenum disilicide-reinforced silicon carbide-based ceramic circuit board substrate material with high thermal conductivity and a preparation method thereof. Background technique [0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient doe...

AI Technical Summary

Problems solved by technology

[0002] As the power and density of electronic components increase, the calorific value per unit volume also increases, and the requirements for the comprehensive performance of circuit substrates are getting higher and higher. Among them, ceramic substrates have good comprehensive performance in terms of insulation, thermal conductivity and Thermal expansion, chemical stability and other aspects are outstanding, and are gradually widely used in substrate materials. Among them, alumina and beryllium oxide are mainly used as substrate materials for a long time. However, alumina ceramic sheets have low thermal conductivity and thermal expansion. The coefficient does not match with Si and other shortcomings. Although the comprehensive performance of beryllium oxide ceramics is relatively good, its production cost is high and toxic. Although the comprehensive performance of aluminum nitride ceramics is relatively good, the production cost is high and the application is also limited. Silicon carbide as a substrate material has obvious advantages in terms of performance

[0003] Although the application prospects of silicon carbide ceramic substrates are broad, in the actual production process, there are problems such as low sintering density, low utilization rate of raw materials, and insulation to be improved, which restrict the large-scale use of such materials. Further improvements in the production process