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A tin-copper-nickel alloy electroplating solution and an electroplating method thereof

A nickel alloy and electroplating solution technology, applied in the field of electroplating solution, can solve the problems of poor processing performance, poor stability of the plating solution, easy occurrence of whiskers, etc., and achieve the effects of strong processing performance, good thermal stability and good ductility.

Inactive Publication Date: 2016-03-02
无锡永发电镀有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous development of science and technology, the requirements for products are becoming more and more stringent, and the coating of a single element is difficult to meet the needs of electroplating products. Researchers gradually turn their attention to alloy electroplating
[0003] Due to the good corrosion resistance and solderability of tin and tin-lead alloy coatings, they have been widely applied to the solderability coatings of electronic components. However, pure tin coatings are prone to produce whiskers that cause short circuits. Lead is harmful to human body and The environment is harmful and is strictly controlled. At present, lead-free solderable alloy coatings such as tin-silver and tin-bismuth have been developed, but the bath stability of tin-silver alloy coating is poor, the cost is high, and it is easy to use in tin alloys. Whiskers occur; although the tin-bismuth alloy coating is not easy to produce whiskers, it has poor processability and is prone to cracks
And known pH buffer boric acid is harmful to human body and environment

Method used

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  • A tin-copper-nickel alloy electroplating solution and an electroplating method thereof
  • A tin-copper-nickel alloy electroplating solution and an electroplating method thereof
  • A tin-copper-nickel alloy electroplating solution and an electroplating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1: the tin-copper-nickel alloy electroplating solution of the present embodiment comprises following components:

[0022]

[0023] Use this tin-copper-nickel alloy plating solution electroplating method as follows:

[0024] Prepare tin-copper-nickel alloy electroplating solution: dissolve 25g of complexing agent, 3g of stabilizer and 5g of antioxidant in deionized water to form a solution, add 12g of hydroxycarboxylic acid, 80g of stannous sulfate, and organic sulfonic acid to the solution 60g of copper and 40g of nickel sulfate were stirred and dissolved to form a mixed solution, 2g of a brightener was added to the mixed solution to dissolve, and then the remainder of deionized water was added to a total volume of 1L to obtain a tin-copper-nickel alloy electroplating solution.

[0025] Use ammonia water to adjust the pH of the electroplating solution to 4-8, use a carbon electrode as the anode, and the workpiece as the negative electrode. The temperature ...

Embodiment 2

[0026] Embodiment 2: the tin-copper-nickel alloy electroplating solution of the present embodiment comprises following components:

[0027]

[0028] Use this tin-copper-nickel alloy plating solution electroplating method as follows:

[0029] Prepare tin-copper-nickel alloy electroplating solution: dissolve 25g of complexing agent, 3g of stabilizer and 5g of antioxidant in deionized water to form a solution, add 12g of hydroxycarboxylic acid, 100g of stannous sulfate, and organic sulfonic acid to the solution 80g of copper and 50g of nickel sulfate were stirred and dissolved to form a mixed solution, 2g of a brightener was added to the mixed solution to dissolve, and then the remainder of deionized water was added to a total volume of 1L to obtain a tin-copper-nickel alloy electroplating solution.

[0030] Use ammonia water to adjust the pH of the electroplating solution to 4-8, use a carbon electrode as the anode, and the workpiece as the negative electrode. The temperature...

Embodiment 3

[0031] Embodiment 3: the tin-copper-nickel alloy electroplating solution of the present embodiment comprises following components:

[0032]

[0033]

[0034] Use this tin-copper-nickel alloy plating solution electroplating method as follows:

[0035] Prepare tin-copper-nickel alloy electroplating solution: dissolve 25g of complexing agent, 3g of stabilizer and 5g of antioxidant in deionized water to form a solution, add 12g of hydroxycarboxylic acid, 150g of stannous sulfate, and organic sulfonic acid to the solution 100g of copper and 80g of nickel sulfate were stirred and dissolved to form a mixed solution, 2g of a brightener was added to the mixed solution to dissolve, and the remainder of deionized water was added to a total volume of 1L to obtain a tin-copper-nickel alloy electroplating solution.

[0036] Use ammonia water to adjust the pH of the electroplating solution to 4-8, use a carbon electrode as the anode, and the workpiece as the negative electrode. The tem...

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PUM

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Abstract

A tin-copper-nickel alloy electroplating solution and an electroplating method thereof are disclosed. The electroplating solution comprises 80-150 g / L of stannous sulfate, 60-100 g / L of organic copper sulfonate, 40-80 g / L of nickel sulfate, 10-20 g / L of hydroxy carboxylic acid, 0.5-15 g / L of an antioxidant, 20-35 g / L of a complexing agent, 1-5 g / L of a stabilizing agent and 1-5 g / L of a brightener, with the balance being deionized water. The electroplating solution is simple in composition, low in cost, high in stability, low in toxicity, safe and environmental friendly. A plating layer prepared by electroplating is free of crystal whisker, good in thermal stability, good in malleability, high in processability and not liable to crack.

Description

technical field [0001] The invention relates to the technical field of electroplating solutions, in particular to a tin-copper-nickel alloy electroplating solution and an electroplating method thereof. Background technique [0002] With the continuous development of science and technology, the requirements for products are becoming more and more stringent, and the coating of a single element is difficult to meet the needs of electroplating products. Researchers are gradually turning their attention to alloy electroplating. [0003] Due to the good corrosion resistance and solderability of tin and tin-lead alloy coatings, they have been widely applied to the solderability coatings of electronic components. However, pure tin coatings are prone to produce whiskers that cause short circuits. Lead is harmful to human body and The environment is harmful and is strictly controlled. At present, lead-free solderable alloy coatings such as tin-silver and tin-bismuth have been develope...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/56
Inventor 石明
Owner 无锡永发电镀有限公司
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