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Purely cationic photosensitive resin for 3D printing stereolithographic rapid prototyping, and preparation method and application thereof

A cationic, stereolithography technology, applied in the direction of additive processing, etc., can solve the problems of photosensitivity gap and other problems, and achieve the effect of simple steps, good photosensitivity and high precision

Active Publication Date: 2016-03-09
NANCHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, pure cycloaliphatic epoxy resin is used as a photosensitive prepolymer, and its photosensitivity still has a certain gap with that of free radical acrylate.

Method used

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  • Purely cationic photosensitive resin for 3D printing stereolithographic rapid prototyping, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] (1) In a special 5000ml glass three-necked flask equipped with a stirrer and a condenser, add 1100 grams of siloxane-containing cycloaliphatic epoxy resin, add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 800 g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 500 g, 1,4-butanediol diglycidyl ether 470 gram, 130 grams of triarylsulfonium hexafluoroantimonate.

[0037] (2) Heat to 50°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 18.5mJ / cm 2 .

[0038] (3) The cantilever beam test pieces were fabricated by using the SLA-3500 UV laser curing rapid prototyping equipment manufactured by 3DSystems, and then these test pieces were post-cured for 90 minutes in a UV box with a power of 500 mW. Their warpage factors CF(6)=0.01, CF(11)=0.02 were measured.

[0039] (4) Using the SLA-3500 UV laser curing rapid prototyping equipment manufactu...

Embodiment 2

[0041] (1) In a special 5000ml glass three-necked flask equipped with a stirrer and a condenser, add 1500 grams of siloxane-containing cycloaliphatic epoxy resin, add 3,4-epoxycyclohexylcarboxylic acid-3 ， ,4 ， - Epoxycyclohexyl methyl ester 700g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 300g, 1,4-cyclohexanedimethanol diglycidol 370 grams of ether, 130 grams of triarylsulfonium hexafluoroantimonate.

[0042] (2) Heat to 40°C and stir for 30 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 17.9mJ / cm 2 .

[0043] (3) Some test pieces were made by using SLA-3500 UV laser curing rapid prototyping equipment, and then post-cured for 90 minutes in a UV box with a power of 500 mW. Their warpage factors CF(6)=-0.01, CF(11)=-0.02 were measured.

[0044] (4) Using SLA-3500 UV laser curing rapid prototyping equipment, some test pieces were made according to ASTMD638 and ASTMD256 standards...

Embodiment 3

[0046](1) In a special 5000ml glass three-necked flask equipped with a stirrer and a condenser, add 1600 grams of siloxane-containing cycloaliphatic epoxy resin, add bis(3,4-epoxycyclohexylcarboxylate)-hexyl Diacid ester 600g, 3,3-[oxybismethylene]-bis[3-ethyl]oxetane 500g, polypropylene glycol diglycidyl ether 250g, triarylsulfonium hexafluoroantimony Salt 140 grams.

[0047] (2) Heat to 50°C and stir for 20 minutes to make it into a transparent light yellow uniform liquid, which is a prepared photosensitive resin. Measure its critical exposure E c 16.9mJ / cm 2 .

[0048] (3) Some test pieces were made by using SLA-3500 UV laser curing rapid prototyping equipment, and then post-cured for 90 minutes in a UV box with a power of 500 mW. Their warpage factors CF(6)=-0.01, CF(11)=-0.03 were measured.

[0049] (4) Using SLA-3500 UV laser curing rapid prototyping equipment, some test pieces were made according to ASTMD638 and ASTMD256 standards, and then post-cured for 90 minute...

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Abstract

The invention provides a purely cationic photosensitive resin for 3D printing stereolithographic rapid prototyping, and a preparation method and application thereof. The purely cationic photosensitive resin comprises the following raw materials by mass: 15 to 95% of alicyclic epoxy resin containing siloxane, 1 to 30% of an oxetane compound, 1 to 50% of an alicyclic epoxy compound, 1 to 25% of an aliphatic epoxy compound and 1 to 12% of a cationic initiator. The preparation method comprises the following steps: mixing the above-mentioned raw materials according to the mass percentages; and then carrying out heating at 20 to 80 DEG C and stirring for 5 to 120 min so as to obtain transparent light-yellow uniform liquid. The photosensitive resin prepared in the invention is small in irritation, has few volatile matters and can be conveniently prepared; the photosensitive resin has good photosensitivity and critical light exposure Ec of less than 19.0 mJ / cm2; and a molded part has high precision, a warping factor CF(6) of the molded part is in a range of + / - 0.01 and a warping factor CF(11) of the molded part is in a range of + / - 0.03. A part printed from the photosensitive resin prepared in the invention has higher shaping precision compared with a part printed from conventional photosensitive resin.

Description

technical field [0001] The invention belongs to the field of rapid prototyping and manufacturing of 3D printing stereolithography, and relates to the application of alicyclic epoxy resin containing siloxane as a prepolymer in the preparation of photosensitive resins for rapid prototyping of stereolithography. Background technique [0002] 3D printing can also be called additive manufacturing technology. The emergence of 3D printing makes it easy and fast to manufacture complex parts. At present, the more mature 3D printing processes mainly include fused filament deposition rapid prototyping, paper laminate rapid prototyping, selective laser sintering rapid prototyping and stereolithography rapid prototyping. Stereolithography rapid prototyping is to use computer-controlled ultraviolet laser to scan point by point on the liquid surface of ultraviolet curable resin (commonly known as: photosensitive resin) according to the shape of two-dimensional cross-section, so that the re...

Claims

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Application Information

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IPC IPC(8): C08G59/30C08G77/38B33Y70/00B29C67/24
Inventor 黄笔武杜志鹏万时策
Owner NANCHANG UNIV
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