Artificial graphite/copper composite radiating fin and preparation method therefor

Abstract

An artificial graphite/copper composite radiating fin and a preparation method therefor relate to the field of radiation of heat components of electronics and electromagnetic shield. The artificial graphite/copper composite radiating fin comprises a copper foil layer and artificial graphite layers located on the upper and lower sides of the copper foil layer; the copper foil layer comprises a copper substrate and roughened layers located on the upper and lower sides of the copper substrate; a tumor-like copper particle structure is uniformly distributed on the surface of each of the roughened layers; each of the roughened layers is mutually engaged with each artificial graphite layer through the tumor-like copper particle structure; and each artificial graphite layer is formed by roll-pressing fluffy artificial single graphite flakes to be adhered to a release film and paving the film on the copper foil. The preparation method comprises: performing roughening treatment and curing treatment on the cleaned copper foil; roll-pressing the fluffy artificial single graphite flakes to be adhered to the release film, then paving the film on the copper foil, and calendering stepwise so as to obtain the artificial graphite/copper composite radiating fin. The radiating fin provided by the invention has a good heat-conducting performance, an excellent electromagnetic shielding effect and low thermal resistance of the interface between the copper foil and graphite, thereby improving the heat-conducting performance.

Description

technical field [0001] The invention relates to the field of heat dissipation and electromagnetic shielding of heating components of electronic products, in particular to an artificial graphite / copper composite heat sink and a preparation method thereof. Background technique [0002] The current CPU generates heat due to high-speed operation, and the high-speed operation of the CPU is developed to improve the processing speed of its equipment. The demand for mobile phones, tablet computers, notebook computers and TVs and the use of display screens increase. The demand for high brightness of display screens increases the use of light-emitting diodes. However, the more light-emitting diodes are used, the power consumption increases, which also increases equipment At the same time, the battery power consumption increases, and the battery capacity also needs to be increased accordingly, which makes the display device generate more heat due to high energy consumption. If the heat...

AI Technical Summary

Problems solved by technology

The demand for mobile phones, tablet computers, notebook computers and TVs and the use of display screens have increased. The demand for high brightness of display screens has increased the use of light-emitting diodes. However, the more light-emitting diodes are used, the power consumption increases, which also increases equipment. At the same time, the battery power consumption increases, and the battery capacity also needs to be increased accordingly, which makes the display device generate more heat due to high energy consumption. If the heat generation cannot be effectively controlled, not only the high temperature will cause the CPU to crash or lose its function due to high heat. , will also shorten the service life of heating equipment

At the same time, the functions of display devices are increasing nowadays, and the parts used are also diversified, with a large number and smaller volume. Due to the miniaturization of mobile phones, tablet computers and other devices, the available space is insufficient, and the distance between the parts and components is closer, which is easy to occur. mutual electromagnetic interference

[0003] At present, the thickness of artificial graphite used as a heat dissipation material in the market is mainly 25 μm. The artificial graphite of 40 μm can be mass-produced, but the thermal conductivity is not good. The mass production of artificial graphite of 70 μm is not high, and the thickness limits the heat dissipation performance of artificial graphite. , more heat needs to be solved, in order to transfer the heat from the heating component "A" point to other points and then reduce the temperature of the heating component, so that the body temperature of the heating component "A" is greatly reduced

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