Micropore laser-high temperature chemical synchronous compounding processing device and method

Abstract

The invention discloses a micropore laser-high temperature chemical synchronous compounding processing device and method. The micropore laser-high temperature chemical synchronous compounding processing device comprises a laser processing unit, a worktable and a chemical processing unit. The laser processing unit comprises a laser, an optical fiber and a laser processing head which are connected in sequence. The chemical processing unit comprises a liquid storage box, an output pipeline and a spray head. One end of the output pipeline is communicated with the liquid storage box, and the other end of the output pipeline is connected with the spray head. The spray head is installed at the lower end of the laser processing head. A workpiece is fixed to the worktable. The laser processing head is installed at the upper end of the workpiece. The lower end of the worktable is provided with an angle adjusting mechanism used for adjusting the inclination angle of the worktable. The micropore laser-high temperature chemical synchronous compounding processing device is simple in structure and easy to implement, laser processing and high temperature chemical processing are conducted synchronously and automatically, and processing precision, surface quality and efficiency are high. Chemical liquid can have a chemical reaction with the workpiece in a high temperature area of laser processing and cannot have a chemical reaction in the area without laser processing due to the low temperature, excessive processing of the workpiece is avoided, and precision of micropore processing can be ensured.

Description

technical field [0001] The invention belongs to the field of laser and chemical composite processing, and in particular relates to a microhole laser-high temperature chemical synchronous composite processing device and processing method. Background technique [0002] Difficult-to-machine materials refer to materials with relatively poor machinability. The coefficient Kr is usually used to indicate the relative machinability of the material. It is generally believed that when Kr<0.5, it is a difficult-to-machine material. The reasons for their difficulty in processing generally include the following aspects: high hardness, high strength, high plasticity and high toughness, low plasticity and high brittleness, low thermal conductivity, microscopic hard points or hard inclusions, etc. The relative machinability Kr of stainless steel is between 0.3 and 0.5, and the difficulty of machining is mainly manifested in high hardness, high plasticity and toughness, and low thermal c...

AI Technical Summary

Problems solved by technology

However, laser processing has the following problems: on the one hand, because it uses laser to ablate the workpiece point by point, the processing efficiency is low; on the other hand, there is a large amount of slag on the processing surface because of the splash of the melt during the laser processing , when the method of increasing the laser power density is used to improve the efficiency of laser processing, a large thermal stress will be generated due to the large surface temperature gradient, and it is easy to generate microcracks on the surface of the material

However, the existing laser and chemical serial processing method is: firstly laser processing the workpiece, and then chemical processing, the disadvantages of the existing method: first, the process is long, the processing accuracy and efficiency are low, because the first process It is laser processing, and the second process is chemical processing, so secondary positioning and clamping are required. The secondary positioning error will reduce the processing accuracy, and the serial processing process will also reduce the processing efficiency; the second is that the chemical liquid is heated at room temperature or to a certain temperature. A chemical dissolution reaction occurs with the workpiece immersed in the chemical liquid, and it is easy to cause overprocessing on the surface of the workpiece that does not need to be processed. Therefore, it is necessary to add a protective layer before processing and remove the protective layer after processing, which makes the process complicated and difficult to process. , processing accuracy and low efficiency

Although the device can remove the recast layer, the device requires the cooperation of an external power source to perform electrochemical anodic dissolution in the laser processing area. In addition to dissolution, anodic dissolution will also occur in other areas of the workpiece, which may easily cause transitional processing in other areas that do not need to be processed; the workbench cannot adjust the inclination angle, and cannot adapt to openings with various inclination angles

Images