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Gluconic acid cyanide-free gold-electroplating solution and electroplating method thereof

A gluconic acid and cyanide-free gold plating technology, applied in the field of electroplating copper and tin, can solve the problems of restricting the promotion of cyanide-free gold plating, low coating quality, poor plating solution performance, etc., and achieves excellent plating solution performance, high brightness, Good coating quality

Inactive Publication Date: 2016-04-13
无锡杨市表面处理科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing cyanide electroplating generally has the technical defects of poor performance of the plating solution and low coating quality, which seriously restrict the further promotion of cyanide-free electroplating in industry

Method used

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  • Gluconic acid cyanide-free gold-electroplating solution and electroplating method thereof
  • Gluconic acid cyanide-free gold-electroplating solution and electroplating method thereof
  • Gluconic acid cyanide-free gold-electroplating solution and electroplating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] The formulation of the electroplating solution is as follows:

[0033]

[0034] Plating process conditions: the pulse width of single pulse square wave current is 0.5ms, the duty cycle is 30%, and the average current density is 0.5A / dm 2 ; The pH is 6, the temperature is 60°C, and the electroplating time is 40min.

Embodiment 2

[0036] The formulation of the electroplating solution is as follows:

[0037]

[0038] Plating process conditions: the pulse width of single pulse square wave current is 0.6ms, the duty cycle is 25%, and the average current density is 0.6A / dm 2 ; The pH is 6.5, the temperature is 60°C, and the electroplating time is 35min.

Embodiment 3

[0040] The formulation of the electroplating solution is as follows:

[0041]

[0042]

[0043] Plating process conditions: the pulse width of single pulse square wave current is 0.8ms, the duty cycle is 20%, and the average current density is 1A / dm 2 ; The pH is 7, the temperature is 50° C., and the electroplating time is 20 minutes.

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Abstract

The invention discloses a gluconic acid cyanide-free gold-electroplating solution and an electroplating method thereof. The gold-electroplating solution comprises 10-15 g / L by gold of auric chloride, 78-94 g / L by a gluconic acid group of gluconic acid or gluconate, 1-8 g / L of piperidine, and 0.16-0.48 g / L of arsenic trioxide. Gluconic acid or gluconate is taken as a complexant, a complex of piperidine and arsenic trioxide is taken as a brightener, and auric chloride is a main gold salt. The obtained gold-electroplating solution has preferable dispersion and deep electroplating performance; the cathodic current efficiency is high; and performance of the solution is excellent. Through adoption of the gold-electroplating solution in an alkaline condition, an obtained electroplated layer is low in porosity, high in brightness, and excellent in quality.

Description

technical field [0001] The invention relates to the technical field of copper-tin electroplating, in particular to an electroplating solution for cyanide-free gold plating with gluconic acid and an electroplating method thereof. Background technique [0002] Gold has good ductility, is easy to polish, has low contact resistance, good conductivity and welding performance, and has been widely used as a solderable coating in the electronics industry. Gold is resistant to high temperatures, and hard gold is relatively wear-resistant, so gold plating is widely used in precision instruments, meters, printed circuit boards, integrated circuits, tube shells, electrical contacts and other parts that require long-term stable electrical parameters. Gold has high chemical stability and is only soluble in aqua regia but not in other acids. Therefore, the gold coating has strong corrosion resistance and good anti-tarnish performance. At the same time, the gold alloy coating has various co...

Claims

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Application Information

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IPC IPC(8): C25D3/48C25D5/18
Inventor 潘增炎
Owner 无锡杨市表面处理科技有限公司
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