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Packaging method suitable for outer space detector beryllium window

A packaging method and outer space technology, applied in the manufacture of discharge tubes/lamps, electrical components, cold cathodes, etc., can solve the problems of poor air tightness and high outgassing rate of beryllium windows, so as to improve air tightness and improve Utilization rate, the effect of reducing outgassing rate

Active Publication Date: 2016-04-13
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Therefore, the technical problem to be solved by the present invention is to overcome the defects of poor airtightness and high outgassing rate of the beryllium window packaged by the beryllium window packaging method in the prior art, thereby providing an applicable window with good airtightness and low outgassing rate. Beryllium window packaging method for outer space detectors, this method can greatly reduce the outgassing effect of epoxy resin glue in the packaging structure, thereby improving the service life of outer space detectors

Method used

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  • Packaging method suitable for outer space detector beryllium window

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Embodiment 1

[0033] This embodiment provides a packaging method suitable for beryllium windows of outer space detectors, which specifically includes the following steps: S1, weighing the A component and the B component of the 2216Gray epoxy resin at a mass ratio of 1:1, spare;

[0034] S2, put the epoxy resin A component and B component weighed in step S1 in a vacuum degree of Mix in a vacuum environment of <100Pa, and stir evenly until there are no bubbles on the surface of the colloid, and then fill the vacuum environment with pure nitrogen to 1 standard atmospheric pressure, for use;

[0035] S3, uniformly coating the epoxy resin mixture obtained in step S2 on the sealing surface 2 of the beryllium window 1, and then pressing the beryllium sheet on the sealing surface;

[0036] S4, heating and curing the beryllium window 1 in step S3, controlling the heating temperature to be 90° C., and the heating time to be 1.5 hours.

Embodiment 2

[0038] This embodiment provides a packaging method suitable for beryllium windows of outer space detectors, which specifically includes the following steps: S1. Weigh the A component and B component of 2216Gray epoxy resin according to a mass ratio of 3:1, spare;

[0039] S2. Place the epoxy resin A component and B component weighed in step S1 in a vacuum environment with a vacuum of 99 Pa and mix them, and stir them until there are no bubbles on the surface of the colloid, and then fill the vacuum environment Enter pure nitrogen to 1 standard atmosphere for use;

[0040] S3, uniformly coating the epoxy resin mixture obtained in step S2 on the sealing surface 2 of the beryllium window 1, and then pressing the beryllium sheet on the sealing surface;

[0041] S4, heat curing the beryllium window 1 in step S3, the heating temperature is 100° C., and the heating time is 0.5 hours.

Embodiment 3

[0043] This embodiment provides a packaging method suitable for beryllium windows of outer space detectors, which specifically includes the following steps: S1. Weigh the A component and B component of 2216Gray epoxy resin according to a mass ratio of 2:1, spare;

[0044] S2. Place the epoxy resin A component and B component weighed in step S1 in a vacuum environment with a vacuum of 50 Pa for mixing, and stir evenly until there are no bubbles on the surface of the colloid, and then fill the vacuum environment Enter pure nitrogen to 1 standard atmosphere for use;

[0045] S3, uniformly coating the epoxy resin mixture obtained in step S2 on the sealing surface 2 of the beryllium window 1, and then pressing the beryllium sheet on the sealing surface;

[0046] S4, heat curing the beryllium window 1 in step S3, the heating temperature is 95°C, and the heating time is 1 hour.

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Abstract

The invention relates to a packaging method suitable for an outer space detector beryllium window. The packaging method comprises the following steps: S1, weighing a compound A and a compound B of 2216Gray epoxy resin glue according to the mass ratio of (1-3): 1 for standby use; S2, putting the compound A and the compound B weighed in the step S1 in a vacuum environment with the vacuum degree of smaller than 100 Pa for mixing, stirring uniformly until no bubble exists on the surface of the glue, and then charging pure nitrogen in the vacuum environment until the environment is at one standard atmospheric pressure for standby use; S3, uniformly coating the epoxy resin mixture obtained in the step S2 on the sealing surface of the beryllium window, and then pressing a beryllium plate on the sealing surface; and S4, carrying out heating curing on the beryllium window in the step S3, wherein the heating temperature is 90-100 DEG C, and the heating time is 0.5-1.5 h. The beryllium window packaging method solves the defect that the outgassing rate of the beryllium window packaged by the beryllium window packaging method in the prior art is high.

Description

Technical field [0001] The invention belongs to the technical field of beryllium window packaging, and in particular relates to a packaging method suitable for beryllium windows of outer space detectors. Background technique [0002] Beryllium has the highest transmittance to X-rays, so the proportional counter tube, ionization high current tube, and Geiger tube for detecting X-rays are all equipped with beryllium windows. The beryllium window is also an important component in the outer space detector system. Its function is to isolate the working gas and ensure the purity of the gas. [0003] At the present stage, there are two main methods for encapsulating beryllium windows, that is, fixing the beryllium sheet on the beryllium window base frame by welding or epoxy bonding, while maintaining the airtightness of the beryllium window. [0004] When metal beryllium is welded, it is necessary to add dissimilar metals as filler materials or brazing filler metals. According to the inter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J9/26
CPCH01J9/26
Inventor 冯骅李红吴琼衡培银
Owner TSINGHUA UNIV
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