The invention discloses a
beryllium window sealing method. The method includes the steps: immersing a
beryllium sheet in a mixed liquid of
sulfuric acid and
hydrogen peroxide with a
mass ration of 9:11, the temperature of the mixed liquid being controlled within 50-55 DEG C, and the reaction time being 13-17s; cleaning the immersed
beryllium sheet with deionized water for 8-12min,
drying the beryllium sheet in a 75-85 DEG C baking oven, and storing the dried sheet in a vacuum cabinet for standby application; selecting
copper as a core
metal of an output window, performing a sealing step at the heating rate of 3 DEG C / min for 60min at the holding temperature of 730 DEG C, then making the temperature rise to 800 DEG C and the
holding time last 8min, the beryllium sheet, the
copper and a solder dissolving each other at the temperature of 800 DEG C, forming a metallic compound of the beryllium sheet, the
copper and the solder on a sealing surface, and thus forming a firm and airtight
soldering surface. The sealing reliability of the
beryllium window is guaranteed, and the
beryllium window can be greatly applied to
ray tubes. The well sealed output window exhibits firm and reliable
solderability. The output window can stand repeated
thermal shock at the temperature of 800 DEG C, and the
leak rate of the output window is better than 10<-9>pa.m<3> / s.