Electronics Vacuum Feedthrough

A feed-through and electronics technology, applied in the field of feed-throughs, can solve problems such as large volume, inability to meet gas detectors, and fewer communication channels, and achieve low outgassing rate, reliable structure, and improved thermal shock resistance.

Active Publication Date: 2017-08-11
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defects that the electronic vacuum feedthroughs in the prior art have a large volume, fewer communication channels, and cannot meet the needs of gas detectors, so as to provide a vacuum feedthrough suitable for space applications. High Speed ​​Low Noise Multiplex Electronics Vacuum Feedthrough

Method used

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  • Electronics Vacuum Feedthrough
  • Electronics Vacuum Feedthrough

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Embodiment 1

[0050] Such as Figure 1-2 As shown, an electronic vacuum feed-through of this embodiment includes:

[0051] The flexible circuit board 1, preferably the flexible circuit board 1 is a RO4000 series flexible circuit board with a frequency not less than 500 MHz. The selected RO4000 series flexible circuit board meets the NASA low outgassing low outgassing rate standard;

[0052] The substrate 4 is formed with a through hole, the flexible circuit board 1 is arranged in the through hole, and the inner wall of the through hole and the flexible circuit board 1 are sealed by setting a sealing gel, and the material of the substrate 4 Stainless steel or titanium is preferred. The sealing colloid is a colloid with good airtightness, low outgassing rate and good strength in vacuum, preferably epoxy resin glue 2.

[0053]The above-mentioned solution is the core solution of the present invention. Since the flexible circuit board 1 is used as the conductor material of the electronic vacu...

Embodiment 2

[0069] The difference between this embodiment 2 and embodiment 1 lies in the type, proportion and curing temperature of the double epoxy resin glue used. Specifically: the two-component epoxy resin glue is the Torr seal epoxy resin glue of Agilent; the A component and the B component of the Torrseal epoxy resin glue are proportioned according to the mass ratio of 2:1; The completed epoxy resin glue is mixed in a vacuum environment with a vacuum degree of <100Pa, and stirred evenly until there are no obvious bubbles on the surface of the sealant, and then pure nitrogen is introduced to 1 atmosphere.

[0070] In the flexible circuit board packaging step, the flexible circuit board-clamp assembly is placed in a vacuum drying oven for heating and curing. Preferably, the heating temperature is 60 degrees centigrade, and the heating time is 2 hours. In the overall packaging step of the feedthrough, the encapsulated feedthrough is heated and cured in a vacuum heating oven. Preferab...

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Abstract

The invention relates to an electronic vacuum feed-through member. The electronic vacuum feed-through member comprises a flexible circuit board and a substrate with a through hole formed therein, and further comprises a holder clamping the flexible circuit board, wherein a sealing colloid is arranged between the flexible circuit board and the holder for integrally packaging the flexible circuit board and the holder to form a flexible circuit board-holder assembly, and the flexible circuit board-holder assembly is packaged in the through hole through the sealing colloid. The electronic vacuum feed-through member provided by the invention has the advantages of high density, high frequency, low noise, low outgassing rate and low leak rate and can realize high-speed low-noise electronic reading of 128 paths.

Description

technical field [0001] The invention relates to the field of feedthroughs, in particular to a high-speed, low-noise, multi-channel electronic vacuum feedthrough suitable for space applications. Background technique [0002] "High-Speed ​​Low-Noise Multiplex Electronics Vacuum Feedthrough for Space Applications" is designed for space X-ray gas detectors. It is mainly used to detect the electronic readout of low-energy X-ray detectors in the universe. The feedthrough is also applicable to other fields, especially the application of electronic vacuum readout with strict requirements on density, vacuum degree, outgassing rate, and leaking rate. [0003] The main function of the electronic vacuum feedthrough is to enable the input and output of electronic signals in the vacuum system. At present, there are mainly the following types of electronic vacuum feedthroughs on the market: welded single-pin feedthroughs made of ceramic and stainless steel materials, D-sub feedthroughs s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J47/00
CPCH01J47/00H01J47/001
Inventor 冯骅李红吴琼衡培银
Owner TSINGHUA UNIV
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