High-temperature resistant packaging material and preparation method thereof

A packaging material and high temperature resistant technology, applied in the field of packaging materials, to achieve the effects of high durability, simple preparation process and less industrial emission of pollutants

Inactive Publication Date: 2016-05-11
SUZHOU JIN TENG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially for some special purposes, the gaps in the packaging materials required in special environments are relatively obvious, such as packaging materials required for the storage and transportation of items in high temperature and low temperature resistant environments. Therefore, it is necessary to develop a packaging material with better High temperature resistant packaging materials with excellent performance and no harm to the environment are particularly necessary

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] (1) Weigh 5 parts of polyethylene terephthalate, 5 parts of butylene terephthalate, 5 parts of talcum powder, 5 parts of xylan, 5 parts of silicon dioxide, propylene oxide butyl 5 parts of ether, 5 parts of glass fiber powder, 5 parts of salicylic acid, 5 parts of magnesium oxide, 5 parts of zirconium phosphate, 5 parts of boron nitride, 5 parts of graphite, 5 parts of aluminum silicate fiber, and 5 parts of polyetherimide part, 10 parts of polybenzimidazole, mixed evenly;

[0024] (2) Add the above components into the rotor mixer and stir, heat the stirring furnace to 200°C, and the stirring speed is 300 rpm, at the same time slowly add 5 parts of diethylenetriaminopropyltrimethylsilane, benzophenone hydrazone 5 parts, keep stirring for 60 minutes;

[0025] (3) After all the components are added, heat the rotor mixer to 300°C, the stirring speed is 500 rpm, and continue stirring for 120 minutes;

[0026] (4) Extruding the raw material slurry obtained above;

[0027]...

Embodiment 2

[0030] (1) Weigh 10 parts of polyethylene terephthalate, 10 parts of butylene terephthalate, 8 parts of talcum powder, 10 parts of xylan, 8 parts of silicon dioxide, butyl propylene oxide 8 parts of ether, 8 parts of glass fiber powder, 8 parts of salicylic acid, 8 parts of magnesium oxide, 8 parts of zirconium phosphate, 8 parts of boron nitride, 8 parts of graphite, 8 parts of aluminum silicate fiber, and 10 parts of polyetherimide part, 12 parts of polybenzimidazole, mixed evenly;

[0031] (2) Add the above components into the rotor mixer and stir, heat the stirring furnace to 200°C, and the stirring speed is 300 rpm, at the same time slowly add 8 parts of aminopropyltriethoxysilane, 8 parts of phenyltriethoxysilane portion, continuously stirred for 60 minutes;

[0032] (3) After all the components are added, heat the rotor mixer to 300°C, the stirring speed is 500 rpm, and continue stirring for 120 minutes;

[0033] (4) Extruding the raw material slurry obtained above; ...

Embodiment 3

[0037] (1) Weigh 15 parts of polyethylene terephthalate, 15 parts of butylene terephthalate, 10 parts of talc, 15 parts of xylan, 10 parts of silicon dioxide, butyl propylene oxide 10 parts of ether, 10 parts of glass fiber powder, 10 parts of salicylic acid, 10 parts of magnesium oxide, 10 parts of zirconium phosphate, 10 parts of boron nitride, 10 parts of graphite, 10 parts of aluminum silicate fiber, 15 parts of polyetherimide part, 15 parts of polybenzimidazole, mixed evenly;

[0038] (2) Add the above components into the rotor mixer and stir, heat the stirring furnace to 200°C, and the stirring speed is 300 rpm, at the same time slowly add 10 parts of N-cyclohexyl-γ-aminopropylmethyldimethoxysilane , 10 parts of phenylmethyldichlorosilane, stirring continuously for 60 minutes;

[0039] (3) After all the components are added, heat the rotor mixer to 300°C, the stirring speed is 500 rpm, and continue stirring for 120 minutes;

[0040] (4) Extruding the raw material slurr...

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PUM

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Abstract

The invention discloses a high-temperature resistant packaging material which comprises the following raw materials in parts by weight: 5-15 parts of polyethylene terephthalate, 5-15 parts of butylene terephthalate, 5-10 parts of talc powder, 5-15 parts of xylan, 5-10 parts of silicon dioxide, 5-10 parts of epoxypropane butyl ether, 5-10 parts of glass fiber powder, 5-10 parts of salicylic acid, 5-10 parts of magnesium oxide, 5-10 parts of zirconium phosphate, 5-10 parts of boron mononitride, 5-10 parts of graphite, 5-10 parts of aluminum silicate fiber, 5-15 parts of polyetherimide, 10-15 parts of polybenzimidazole, 5-10 parts of amino silane and 5-10 parts of phenyl silane. The invention also discloses a preparation method of the high-temperature resistant packaging material.

Description

technical field [0001] The invention relates to the technical field of packaging materials, in particular to a high-temperature-resistant packaging material and a preparation method thereof. Background technique [0002] Packaging materials refer to the materials used to make packaging containers, packaging decoration, packaging printing, packaging and transportation to meet product packaging requirements, including metal, plastic, glass, ceramics, paper, bamboo, wild mushrooms, natural fibers, Main packaging materials such as chemical fibers and composite materials, and auxiliary materials such as coatings, adhesives, strapping tapes, decorations, and printing materials. [0003] However, with the development of social industrialization, all walks of life need to involve a wide variety of packaging materials, and at the same time, the demand for corresponding packaging materials has risen sharply. Especially for some special purposes, the gaps in the packaging materials re...

Claims

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Application Information

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IPC IPC(8): C08L79/04C08L67/02C08L5/14C08L79/08C08K13/04C08K7/14C08K7/10C08K5/12C08K3/34C08K3/36C08K5/1515C08K5/13C08K3/22C08K3/32C08K3/38C08K3/04C08K5/544C08K5/30C08K5/5419C08K5/54
CPCC08L79/04C08L5/14C08L67/02C08L79/08C08L2201/08C08L2205/02C08L2205/035C08K13/04C08K7/14C08K7/10C08K5/12C08K3/34C08K3/36C08K5/1515C08K5/13C08K2003/222C08K2003/328C08K2003/385C08K3/04C08K5/544C08K5/30C08K5/5419C08K5/5406
Inventor 孙政良
Owner SUZHOU JIN TENG ELECTRONICS TECH
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