An electrochemical method for preparing copper dendrite superhydrophobic surface

Abstract

The invention discloses an electrochemical method for preparing a superhydrophobic surface of copper dendrites. The method comprises the following steps: 1. Slowly add concentrated sulfuric acid to distilled water, then dissolve copper sulfate crystals in the solution, and obtain solution A after stirring evenly 2. Dissolve myristic acid in absolute ethanol to obtain solution B; 3. Remove the oxide layer on the surface of the two copper substrates, then rinse them with distilled water and absolute ethanol successively, and dry them for later use; 4. Dissolve the solution A is placed in the electrolytic cell as the electrolyte, and the two dried copper substrates are respectively used as the anode and the cathode, and electrolyzed; 5. Rinse the electrolyzed cathode copper substrate with distilled water and absolute ethanol in turn, and then the solution B Apply evenly on the surface of the cathode copper substrate after washing, let it dry, and then wipe the surface lightly with a sponge. The contact angle of the superhydrophobic surface prepared on the copper substrate by the method of the present invention can reach more than 152°, and the superhydrophobic performance remains stable after being placed for one year under conventional conditions.

Description

technical field [0001] The invention belongs to the technical field of preparation of hydrophobic surface materials, and in particular relates to an electrochemical method for preparing a superhydrophobic surface of copper dendrites. Background technique [0002] Superhydrophobic is a special phenomenon of solid surfaces, which mainly depends on the chemical composition and microstructure. Generally, superhydrophobic surfaces are constructed by modifying low surface energy substances on rough surfaces or constructing rough structures on the surface of hydrophobic materials. Recent studies have shown that metal surfaces with superhydrophobic properties have potential applications in self-cleaning, anti-oxidation, anti-corrosion, flow drag reduction, and non-destructive transport of microfluidics. [0003] With the in-depth study of superhydrophobic surfaces, many preparation methods are emerging, such as electrodeposition, chemical vapor deposition, plasma etching, anodic oxi...

AI Technical Summary

Problems solved by technology

In recent years, although the relevant literature on the preparation of metal dendrite structures by electrodeposition methods has gradually increased, there are very few successful cases in which researchers have applied dendrite structures to the field of superphobicity in the prior art, and most of them are in the research stage. There have also been a small number of reports of metal dendritic structures on super-thin surfaces. For example, Wang et al. deposited metal gold on silicon wafers by exchange reaction technology, and obtained dendritic micro / nano double-layer rough structures. The surface was treated with dodecane After thiol modification, it becomes superhydrophobic

However, there are still few reports on super-phobic surfaces with copper dendrite structures that are widely used in industry, and there are even fewer related studies on the preparation of super-phobic surfaces with copper dendrites by electrodeposition.

Images