Low-noise avalanche photodetector and preparation method thereof
A technology of avalanche optoelectronics and detectors, applied in circuits, electrical components, semiconductor devices, etc., can solve the problem of low working bandwidth
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Embodiment 1
[0022] As embodiment 1, the present invention discloses a Si / Ge avalanche photodetector, its structure is as attached figure 1 shown. The structure of this detector includes but is not limited to: P-type ohmic contact layer 1, absorption layer 2, charge layer 3, multiplication layer 4, heavily doped N-type ohmic contact layer 5 and Si substrate 6, wherein the specific structural parameters As shown in Table 1.
[0023]
[0024]
[0025] Table 1
[0026] The present invention is characterized in that the one-dimensional avalanche photodetector is improved into a two-dimensional structure, and the k value is reduced by using the dead zone effect. The N-type and P-type ohmic contact layers are formed by high doping at both lateral ends of the low-doped silicon layer, and the doping concentration is higher than 1.0×10 18 / cm 3 . The charge layer is formed between the P-type and N-type ohmic contact layers using precisely controlled P-type or N-type doping, and the dopin...
Embodiment 2
[0033] As embodiment 2, the present invention discloses an InP / InGaAs avalanche photodetector, the structure of which is shown in the attached image 3 . The structure of this detector includes but is not limited to: P-type ohmic contact layer 7, multiplication layer 8, charge layer 9, absorption layer 10, heavily doped N-type ohmic contact layer 11 and InP substrate 12, wherein the specific structural parameters As shown in table 2.
[0034]
[0035] Table 2
[0036] Embodiment 2 provides a method for manufacturing the above-mentioned InP / InGaAs avalanche photodetector, including the following steps:
[0037] S1. Make regions of different doped InP materials, and sequentially form P-type ohmic contact layer 7, multiplication layer 8, charge layer 9, and heavily doped N-type ohmic contact layer on InP by diffusion, ion implantation and other processes. 11; and an InP substrate 12 is formed at the bottom between the charge layer 9 and the heavily doped N-type ohmic contac...
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