Novel formaldehyde scavenging material for urea formaldehyde resin glue, and preparation and application methods thereof

A technology for urea-formaldehyde resin glue and formaldehyde capture, which is applied in the direction of non-polymer adhesive additives, adhesive additives, polymer adhesive additives, etc., can solve the problems of reducing the mechanical properties of the board, low capture efficiency, etc., and achieve formaldehyde absorption Increased efficiency, high aldehyde removal rate, and stable product performance

Inactive Publication Date: 2016-05-25
JIANGSU SHINE ALL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the defects of low capture efficiency of formaldehyde capture materials in the prior art and lower mech

Method used

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  • Novel formaldehyde scavenging material for urea formaldehyde resin glue, and preparation and application methods thereof

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Embodiment 1

[0026] A new formaldehyde capture material for urea-formaldehyde resin glue, its raw material components include: 30 parts of phosphoric acid, 25 parts of urea, 2 parts of triethanolamine, 15 parts of water, 0.01 part of sodium edetate, 3 parts of ammonium phosphate, 10 parts of glycerol, 15 parts of ethyl 3-oxobutyrate, 2 parts of melamine, 1 part of ethylene glycol, 0.5 parts of alkylphenol polyoxyethylene ether, 3 parts of phenol, 2 parts of ethanol, 1 part of ferric chloride , 1 part of copper hydroxide, 0.3 part of diatomaceous earth, 0.2 part of rosin methyl ester and 0.5 part of aluminum oxide, the parts are parts by mass.

[0027] The preparation method of the above-mentioned formaldehyde capture new material for urea-formaldehyde resin glue comprises the following steps connected in sequence:

[0028] a. React phosphoric acid, urea, water, triethanolamine and sodium edetate at 110-115°C for 3 hours;

[0029] b. React ammonium phosphate, glycerol and ethyl 3-oxobutyra...

Embodiment 2

[0034] A new formaldehyde capture material for urea-formaldehyde resin glue, its raw material components include: 32.4 parts of phosphoric acid, 28 parts of urea, 3 parts of triethanolamine, 18 parts of water, 0.02 parts of sodium edetate, 4 parts of ammonium phosphate, 12 parts of glycerol, 18 parts of ethyl 3-oxobutyrate, 3 parts of melamine, 2 parts of ethylene glycol, 0.8 parts of alkylphenol polyoxyethylene ether, 4 parts of phenol, 3 parts of ethanol, 2 parts of ferric chloride , 1.5 parts of copper hydroxide, 0.4 parts of diatomaceous earth, 0.3 parts of rosin methyl ester and 0.6 parts of aluminum oxide, the parts are parts by mass.

[0035] The preparation method of the above-mentioned formaldehyde capture new material for urea-formaldehyde resin glue comprises the following steps connected in sequence:

[0036] a. React phosphoric acid, urea, water, triethanolamine and sodium edetate at 110-115°C for 3.2 hours;

[0037] b. React ammonium phosphate, glycerol and ethy...

Embodiment 3

[0042] A new formaldehyde capture material for urea-formaldehyde resin glue, its raw material components include: 36 parts of phosphoric acid, 30 parts of urea, 4 parts of triethanolamine, 20 parts of water, 0.03 parts of sodium edetate, 5 parts of ammonium phosphate, 15 parts of glycerol, 20 parts of ethyl 3-oxobutyrate, 5 parts of melamine, 3 parts of ethylene glycol, 1 part of alkylphenol polyoxyethylene ether, 5 parts of phenol, 4 parts of ethanol, 3 parts of ferric chloride , 2 parts of copper hydroxide, 0.5 part of diatomaceous earth, 0.5 part of rosin methyl ester and 0.8 part of aluminum oxide, the parts are parts by mass.

[0043] The preparation method of the above-mentioned formaldehyde capture new material for urea-formaldehyde resin glue comprises the following steps connected in sequence:

[0044] a. React phosphoric acid, urea, water, triethanolamine and sodium edetate at 110-115°C for 3.5 hours;

[0045] b. React ammonium phosphate, glycerol and ethyl 3-oxobut...

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Abstract

The invention discloses a novel formaldehyde scavenging material for urea formaldehyde resin glue. The novel material is prepared from the following raw materials in parts by mass: 30-45 parts of phosphoric acid, 25-30 parts of urea, 15-20 parts of water, 0.01-0.03 part of sodium ethylene diamine tetracetate, 3-5 parts of ammonium phosphate, 10-15 parts of glycerol, 15-20 parts of ethyl 3-ketobutyrate, 2-5 parts of melamine, 1-3 parts of ethylene glycol, 0.5-1 part of alkylphenol polyoxyethylene, 3-5 parts of phenol, 2-4 parts of ethanol, 1-3 parts of ferric chloride and 1-2 parts of cupric hydroxide. All the raw materials chemically react under the synergistic effect, and the obtained product is used for scavenging formaldehyde by the combination of chemical adsorption and physical adsorption. Compared with the existing formaldehyde scavenging material, the formaldehyde absorption efficiency is obviously enhanced, the free formaldehyde release amount of the obtained board can be lower than 0.2 mg/L, the glue layer does not become yellow, the strength of the board boiled by hot water is greater than 0.9 MPa, and the product has stable properties.

Description

technical field [0001] The invention relates to a new formaldehyde capture material used for urea-formaldehyde resin glue and a preparation and application method thereof, belonging to the field of air purification. Background technique [0002] There are many kinds of wood-based panels, mainly including plywood, particle board, particle board, medium density fiberboard, blockboard, laminated veneer lumber, etc., which are widely used in interior decoration, furniture manufacturing, floor laying, building structures, etc. The output of wood-based panels is increasing every year, but the product quality is uneven. The main quality problem is that formaldehyde exceeds the standard. This is because 85%-90% of the glue used in the wood-based panel industry is urea-formaldehyde resin. Pressed boards and the wood-based panels produced from them will continuously release formaldehyde during use. [0003] Formaldehyde is a volatile organic compound. Long-term exposure to or living ...

Claims

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Application Information

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IPC IPC(8): C09J11/08C09J11/06C09J11/04
CPCC09J11/08C09J11/04C09J11/06
Inventor 何在祥吴坚陈涛陆海鹰
Owner JIANGSU SHINE ALL IND CO LTD
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