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A kind of mortar for wire cutting and preparation method thereof

A wire cutting and mortar technology, applied in chemical instruments and methods, other chemical processes, etc., can solve the problems of removal, affecting the cleaning of cutting silicon wafers, affecting the cutting effect of silicon wafers, etc., so as to protect the environment and improve the cutting effect. Yield rate, the effect of reducing the proportion of dirty sheets

Active Publication Date: 2018-03-27
JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although this method solves the problem of mortar recycling to a certain extent, it still cannot remove impurities such as iron hydroxide and silicic acid attached to the surface of silicon carbide abrasives. These impurities are easy to form polymers and affect the cutting of silicon wafers by mortar. And the cleaning of silicon wafers, and the silicon micropowder or iron-containing micropowder produced by the recycled mortar during the cutting process will also chemically react with the water in the system to generate more colloids, which will eventually affect the cutting effect of silicon wafers more seriously and silicon wafer cleaning effect

Method used

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  • A kind of mortar for wire cutting and preparation method thereof
  • A kind of mortar for wire cutting and preparation method thereof
  • A kind of mortar for wire cutting and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] A method for preparing mortar for wire cutting, comprising the following steps:

[0054] (1) Provide recycled mortar, which includes silicon carbide particles and cutting fluid;

[0055] (2) Add oxalic acid in the recycled mortar, stir at room temperature for 2 hours to obtain a mortar for wire cutting, which includes recycled mortar and oxalic acid, and the quality of oxalic acid is 0.02% of the quality of the recycled mortar. The pH of the mortar is in the range of 6-7.

[0056] In order to verify the beneficial effect of the present invention, the wire cutting mortar prepared in the present embodiment 1 is compared with the recovery mortar of the prior art (that is, the mortar without adding oxalic acid), and the specific comparative tests include:

[0057] 1. Comparison of mortar settlement rate

[0058] The wire-cutting mortar prepared in Example 1 and the recycled mortar of the prior art were subjected to a sedimentation test at the same time, and the recycled m...

Embodiment 2

[0068] A method for preparing mortar for wire cutting, comprising the following steps:

[0069] (1) Provide recycled mortar, which includes silicon carbide particles and cutting fluid;

[0070] (2) Add acetic acid to the reclaimed mortar, stir at room temperature for 3 hours to obtain a mortar for wire cutting, which includes reclaimed mortar and acetic acid, and the quality of acetic acid is 0.06% of the quality of the reclaimed mortar. The pH of the mortar is in the range of 5-6.

[0071] The performance of the mortar prepared in Example 2 was compared with the recycled mortar of the prior art (that is, the recycled mortar without adding acetic acid). The specific comparison test refers to Example 1, and the test results are shown in Table 2.

[0072] Table 2

[0073]

[0074] As can be seen from Table 2, the sedimentation rate of the mortar for wire cutting prepared in Example 2 is lower than that of the existing recycled mortar, and the proportion of silicon wafers ob...

Embodiment 3

[0076] A method for preparing mortar for wire cutting, comprising the following steps:

[0077] (1) Provide recycled mortar, which includes silicon carbide particles and cutting fluid;

[0078] (2) Add acetic acid to the reclaimed mortar, stir at room temperature for 3 hours to obtain a mortar for wire cutting, which includes reclaimed mortar and acetic acid, and the quality of acetic acid is 0.03% of the reclaimed mortar quality. The pH of the mortar is in the range of 5-6.

[0079] The performance of the mortar prepared in Example 3 was compared with the recycled mortar of the prior art (that is, the recycled mortar without adding acetic acid). The specific comparison test refers to Example 1, and the test results are shown in Table 3.

[0080] table 3

[0081]

[0082] As can be seen from Table 3, the sedimentation rate of the mortar for wire cutting prepared in Example 3 is lower than that of the existing recycled mortar, and the proportion of silicon wafers obtained ...

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Abstract

The invention provides a mortar for wire-electrode cutting. The mortar comprises recovered mortar and a colloid inhibitor. The colloid inhibitor is a water soluble organic matter containing carboxyl group and does not contain hydroxyl group and amide group; and the weight of the colloidal inhibitor is 0.02% -0.2% of the recovered mortar. The mortar for wire-electrode cutting includes the colloid inhibitor, which is a water-soluble organic matter containing carboxyl group. The carboxyl group-containing water-soluble organic matter hinders iron hydroxide and silicic acid in the recovered mortar from polymer development, thereby reducing the impact of colloid on silicon chip cutting and cleaning, reducing the proportion of dirty sheets, improving the dispersibility of the mortar, and improving the cutting yield of the silicon wafer. The present invention also provides a preparation method of the mortar for wire-electrode cutting. The method comprises the steps of: providing a recovered mortar; adding the colloid inhibitor in the recovered mortar, and stirring at room temperature for 2-3 h to obtain the mortar for wire-electrode cutting. The preparation method is simple and easy for operation, and easy for industrialization production.

Description

technical field [0001] The invention relates to the field of silicon chip cutting, in particular to a mortar for wire cutting and a preparation method thereof. Background technique [0002] In the processing of silicon wafers, cutting silicon rods or blocks into sheets of different diameters and thicknesses through special wire cutting equipment is currently a common processing method in the world. The cutting principle is to use thousands of steel wires with a diameter of 100μm-150μm as the cutting carrier, use silicon carbide abrasives whose hardness is second only to diamond as the main cutting medium, and use good wettability, strong cutting ability and strong resistance to silicon carbide Abrasives with excellent dispersing properties, such as polyethylene glycol-based, propylene glycol-based or oil-based cutting fluids, are used as dispersants for silicon carbide abrasives, and are formulated into mortars that are uniformly dispersed and stable in suspension. The rapi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K3/14
CPCC09K3/1463
Inventor 李建章金兵郝刚付红平彭也庆
Owner JIANGXI SAI WEI LDK SOLAR HI TECH CO LTD