Low-temperature plasma modifying and microscale sizing integrated device for wood thin plates

Abstract

The invention provides a low-temperature plasma modifying and microscale sizing integrated device for wood thin plates, which ensures that the use level of adhesive for veneer artificial board products is reduced by 30 to 70 percent compared with that in the traditional sizing mode. The device comprises an equipment framework, a wood thin plate conveying component, a power component, a low-temperature plasma processing component, an ultrasonic cyclone glue spraying component and a controller component, wherein the low-temperature plasma processing component comprises at least one pair of dielectric barrier discharge electrodes, a low-temperature plasma generator, a low-temperature plasma power supply and a cooling ozone removal device; the paired electrodes are parallel with a feeding press roll and are fixed on the equipment framework; the ultrasonic cyclone glue spraying component comprises ultrasonic cyclone synergistic nozzles, a nozzle supporting bracket, a glue amount control valve, a pipeline cleaning valve, an adhesive storage device, an adhesive collecting device and a glue sprayed smell removal device; the nozzle supporting bracket is fixed on the equipment framework and is positioned between a discharging press roll and a discharging conveying roll group; the nozzles are adjustably, parallelly and symmetrically arranged on the nozzle supporting bracket.

Description

technical field [0001] The invention proposes an integrated device for low-temperature plasma modification and micro-glue sizing of wood veneers. Background technique [0002] The main raw materials for wood-based panel production include wood and adhesives. The amount of adhesive not only affects the quality of the product, such as bonding strength and free formaldehyde emission, but also significantly affects the production cost. According to estimates, the cost of adhesives accounts for about 1 / 4 to 1 / 3 of the total production cost. It can be seen that from an economic point of view, under the premise of ensuring product quality in actual production, the amount of adhesive should be reduced as much as possible. [0003] At present, veneer-based wood-based panel products, which account for more than 60% of my country's total wood-based panel production, such as plywood, building templates, laminated veneer lumber and multi-layer solid wood composite floor substrates, etc...

AI Technical Summary

Problems solved by technology

[0006] The present invention proposes an integrated device for low-temperature plasma modification and micro-amount gluing of wood veneers. Through atmospheric pressure and low-temperature plasma modification treatment, a surface layer with nanoscale scratches and high reactivity is constructed on the surface of wood veneer, and at the same time, the atomized micro-sizing method adapted to this surface structure and characteristics is adopted to realize micro-sizing ( The amount of adhesive used is 30-70% lower than that of the traditional gluing method) The production cost is low, the bonding strength is high, the dimensional stability is good, and the formaldehyde emission is low (even no formaldehyde emission. Using this patented technology makes the expensive Formaldehyde isocyanate glue is used in the production of veneer-based wood-based panel products) high-quality veneer-based wood-based panel products

Images